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Showing items 171-180 of 384 (39 Page(s) Totally)
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| 臺大學術典藏 |
2020-05-12T02:53:08Z |
Dual-phase solid-liquid interdiffusion bonding, a solution for the die attachment of WBG
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TUNG-HAN CHUANG;Lo, W.-C.;Chuang, T.-H.;Chang, J.-Y.;Chang, T.-C.; Chang, T.-C.; Chang, J.-Y.; Chuang, T.-H.; Lo, W.-C.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:08Z |
Effects of annealing twins on the grain growth and mechanical properties of Ag-8Au-3Pd bonding wires
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Chuang, T.-H.; Tsai, C.-H.; Wang, H.-C.; Chang, C.-C.; Chuang, C.-H.; Lee, J.-D.; Tsai, H.-H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:08Z |
An innovative annealing-twinned Ag-Au-Pd bonding wire for IC and LED packaging
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Tsai, H.-H.; Lee, J.-D.; Tsai, C.-H.; Wang, H.-C.; Chang, C.-C.; Chuang, T.-H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:07Z |
Durability to Electromigration of an Annealing-Twinned Ag-4Pd Alloy Wire Under Current Stressing
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Chuang, T.-H.; Lin, H.-J.; Chuang, C.-H.; Tsai, C.-H.; Lee, J.-D.; Tsai, H.-H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:07Z |
Solid Liquid Interdiffusion Bonding of (Pb, Sn)Te Thermoelectric Modules with Cu Electrodes Using a Thin-Film Sn Interlayer
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Chuang, T.H.; Lin, H.J.; Chuang, C.H.; Yeh, W.T.; Hwang, J.D.; Chu, H.S.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:07Z |
Surface reconstruction of an annealing twinned Ag-8Au-3Pd alloy wire under current stressing
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Chuang, T.-H.; Wang, H.-C.; Chuang, C.-H.; Lin, H.-J.; Lee, J.-D.; Tsai, H.-H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:07Z |
Effects of la addition on microstructure and mechanical properties of SN-58BI solders joints with osp pads
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Shiue, Y.Y.; Chuang, T.H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:07Z |
Diffusion soldering of Bi0.5Sb1.5Te3 thermoelectric material with Cu electrode
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Yang, C.L.; Lai, H.J.; Hwang, J.D.; Chuang, T.H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:07Z |
High performance Ag-Pd alloy wires for high frequency IC packages
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Tsai, H.-H.; Chuang, T.-H.; Lee, J.-D.; Tsai, C.-H.; Wang, H.-C.; Lin, H.-J.; Chang, C.-C.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:06Z |
Applications of Ag-Alloy stud bump for IC and LED packages
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Tsai, H.-H.; Tsai, C.-H.; Lee, J.-D.; Chang, D.; Shih, Y.-T.; Chen, C.-H.; Chuang, T.-H.; TUNG-HAN CHUANG |
Showing items 171-180 of 384 (39 Page(s) Totally)
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