| 國立臺灣大學 |
2012 |
Evolution of Ag3Sn compounds and microhardness of Sn3.5Ag0.5Cu nano-composite solders during different cooling rate and aging
|
Chuang, T.H.; Tsao, L.C.; Chung, Chien-Han; Chang, S.Y. |
| 國立臺灣大學 |
2011 |
Effect of addition of TiO2 nanoparticles on the microstructure, microhardness and interfacial reactions of Sn3.5AgXCu solder
|
Chang, S.Y.; Jain, C.C.; Chuang, T.H.; Feng, L.P.; Tsao, L.C. |
| 國立臺灣大學 |
2011 |
Strengthening mechanism of nano-Al2O3 particles reinforced Sn3.5Ag0.5Cu lead-free solder
|
Chuang, T.H.; Wu, M.W.; Chang, S.Y.; Ping, S.F.; Tsao, L.C. |
| 國立臺灣大學 |
2011 |
The Inhibition of Tin Whiskers on the Surface of Sn-8Zn-3Bi-0.5Ce Solders
|
Jain, C.C.; Chen, C.L.; Lai, H.J.; Chuang, T.H. |
| 臺大學術典藏 |
2011 |
Strengthening mechanism of nano-Al2O3 particles reinforced Sn3.5Ag0.5Cu lead-free solder
|
Wu, M.W.; Chang, S.Y.; Ping, S.F.; Tsao, L.C.; ChuangTH; Chuang, T.H.; Chuang, T.H.; Wu, M.W.; Chang, S.Y.; Ping, S.F.; Tsao, L.C. |
| 臺大學術典藏 |
2011 |
Polymorphism in epidermal growth factor receptor intron 1 predicts prognosis of patients with esophageal cancer after chemoradiation and surgery
|
Lee Y.-C.; Kuo S.-W.; Huang P.-M.; Hsu H.-H.; Chuang T.-H.; Chen J.-S.; Cheng J.-C.-H.; Wang Y.-H.; Lin C.-C.; Hsu C.-H.; Wu M.-T.; Shun C.-T.; Yang P.-W.; Yang S.-Y.; JANG-MING LEE; Jang-Ming Lee ;Yang S.-Y. ;Yang P.-W. ;Shun C.-T. ;Wu M.-T. ;Hsu C.-H. ;Lin C.-C. ;Cheng J.-C.-H. ;Wang Y.-H. ;Chuang T.-H. ;Chen J.-S. ;Hsu H.-H. ;Huang P.-M. ;Kuo S.-W. ;Lee Y.-C. |
| 臺大學術典藏 |
2011 |
Polymorphism in epidermal growth factor receptor intron 1 predicts prognosis of patients with esophageal cancer after chemoradiation and surgery
|
Lee Y.-C.; Kuo S.-W.; Huang P.-M.; Hsu H.-H.; Chen J.-S.; Chuang T.-H.; Wang Y.-H.; Cheng J.-C.-H.; Lee J.-M.; Yang S.-Y.; Yang P.-W.; Shun C.-T.; Wu M.-T.; CHIH-HUNG HSU; Lin C.-C.; Lee J.-M. ;Yang S.-Y. ;Yang P.-W. ;Shun C.-T. ;Wu M.-T. ;Chih-Hung Hsu ;Lin C.-C. ;Cheng J.-C.-H. ;Wang Y.-H. ;Chuang T.-H. ;Chen J.-S. ;Hsu H.-H. ;Huang P.-M. ;Kuo S.-W. ;Lee Y.-C. |
| 臺大學術典藏 |
2011 |
Interfacial microstructure and bonding strength of Sn-3Ag-0.5Cu and Sn-3Ag-0.5Cu-0.5Ce-xZn solder BGA packages with immersion Ag surface finish
|
Lin, H.-J.; Chuang, T.-H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2011 |
Polymorphism in epidermal growth factor receptor intron 1 predicts prognosis of patients with esophageal cancer after chemoradiation and surgery
|
Lee J.-M. ;Yang S.-Y. ;Yang P.-W. ;Shun C.-T. ;Wu M.-T. ;Hsu C.-H. ;Lin C.-C. ;Chia-Hsien Cheng ;Wang Y.-H. ;Chuang T.-H. ;Chen J.-S. ;Hsu H.-H. ;Huang P.-M. ;Kuo S.-W. ;Lee Y.-C.; Lee J.-M.; Yang S.-Y.; Yang P.-W.; Shun C.-T.; Wu M.-T.; Hsu C.-H.; Lin C.-C.; CHIA-HSIEN CHENG; Wang Y.-H.; Chuang T.-H.; Chen J.-S.; Hsu H.-H.; Huang P.-M.; Kuo S.-W.; Lee Y.-C. |
| 臺大學術典藏 |
2009 |
Evaluations of whisker growth and fatigue reliability of Sn-3Ag-0.5Cu and Sn-3Ag-0.5Cu-0.05Ce solder ball grid array packages
|
Chuang, T.-H.; TUNG-HAN CHUANG; Chang, T.-C.; Cheng, C.-Y. |
| 國立臺灣大學 |
2008 |
Active soldering of ZnS–SiO2 sputtering targets to copper backing plates using an Sn3.5Ag4Ti(Ce, Ga) filler metal
|
Chang, S.Y.; Chuang, T.H.; Tsao, L.C.; Yang, C.L.; Yang, Z.S. |
| 國立臺灣大學 |
2008 |
Intermetallic Reactions in Reflowed and Aged Sn-58Bi BGA Packages with Au/Ni/Cu Pads
|
Chi, C.C.; Tsao, L.C.; Tsao, C.W.; Chuang, T.H. |
| 國立臺灣大學 |
2008 |
Formation of Whiskers and Hillocks on the Surface of Sn-6.6RE Alloys
|
Chuang, T.H.; Chi, C.C.; Lin, H.J. |
| 國立臺灣大學 |
2008 |
Intermetallic Compounds Formed in Sn-20In-2.8Ag Solder BGA Packages with Ag/Cu Pads
|
Jain, C.C.; Wang, S.S.; Huang, K.W.; Chuang, T.H. |
| 國立臺灣大學 |
2008 |
Intermetallic Reactions in Sn-0.4Co-0.7Cu Solder BGA Packages with an ENIG Surface Finish
|
Chuang, T.H.; Jain, C.C.; Wu, H.M. |
| 國立臺灣大學 |
2008 |
Enhanced growth of anodic alumina nanochannels on Ga-ion pre-irradiated aluminum
|
Liu, C. Y.; Datta, A.; Liu, N. W.; Wu, Y. R.; Wang, H. H.; Chuang, T. H.; Wang, Y. L. |
| 臺大學術典藏 |
2008 |
Intermetallic Reactions in Sn-0.4Co-0.7Cu Solder BGA Packages with an ENIG Surface Finish
|
ChuangTH; Wu, H.M.; Jain, C.C.; Chuang, T.H.; Chuang, T.H.; Jain, C.C.; Wu, H.M. |
| 國立臺灣大學 |
2007 |
Rapid growth of tin whiskers on the surface of Sn–6.6Lu alloy
|
Chuang, T.H.; Lin, H.J.; Chi, C.C. |
| 國立臺灣大學 |
2007 |
Abnormal Tin Whisker Growth in Rare Earth Element-Doped Sn-3Ag-0.5Cu Solder Joints
|
Chuang, T. H.; Yen, S. F. |
| 國立臺灣大學 |
2007 |
Low Temperature Bonding of Alumina/Alumina and Alumina/Copper in Air Using Sn3.5Ag4Ti(Ce,Ga) Filler
|
Chang, S.Y.; Chuang, T.H.; Yang, C.L. |
| 國立臺灣大學 |
2007 |
Electromigration in the Flip Chip Solder Joint of Sn-8Zn-3Bi on Copper Pads
|
Lin, W.H.; Wu, Albert T.; Lin, S.Z.; Chuang, T.H.; Tu, K.N. |
| 國立臺灣大學 |
2006-02 |
Intermetallic Formation in Sn3Ag0.5Cu and Sn3Ag0.5Cu0.06Ni0.01Ge Solder BGA Packages with Au/Ni/Cu Pads
|
Chuang, T. H.; Yen, S. F.; Cheng, M. D. |
| 國立臺灣大學 |
2006 |
Intermetallic compounds formed during the interfacial reactions between liquid In-49Sn solder and Ni substrates
|
Wang, S. S.; Tseng, Y. H.; Chuang, T. H. |
| 國立臺灣大學 |
2006 |
Intermetallic reactions in Sn3Ag0.5Cu and Sn3Ag0.5Cu0.06Ni0.01Ge solder BGA packages with Au/Ni surface finishes
|
Chuang, T. H.; Yen, S. F.; Cheng, M. D. |
| 國立臺灣大學 |
2006 |
Active Soldering of ITO to Copper
|
Chang, S. Y.; Lu, M. H.; Tsao, L. C.; Chuang, T. H. |
