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Showing items 256-265 of 384 (39 Page(s) Totally)
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| 國立臺灣大學 |
2008 |
Enhanced growth of anodic alumina nanochannels on Ga-ion pre-irradiated aluminum
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Liu, C. Y.; Datta, A.; Liu, N. W.; Wu, Y. R.; Wang, H. H.; Chuang, T. H.; Wang, Y. L. |
| 臺大學術典藏 |
2008 |
Intermetallic Reactions in Sn-0.4Co-0.7Cu Solder BGA Packages with an ENIG Surface Finish
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ChuangTH; Wu, H.M.; Jain, C.C.; Chuang, T.H.; Chuang, T.H.; Jain, C.C.; Wu, H.M. |
| 國立臺灣大學 |
2007 |
Rapid growth of tin whiskers on the surface of Sn–6.6Lu alloy
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Chuang, T.H.; Lin, H.J.; Chi, C.C. |
| 國立臺灣大學 |
2007 |
Abnormal Tin Whisker Growth in Rare Earth Element-Doped Sn-3Ag-0.5Cu Solder Joints
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Chuang, T. H.; Yen, S. F. |
| 國立臺灣大學 |
2007 |
Low Temperature Bonding of Alumina/Alumina and Alumina/Copper in Air Using Sn3.5Ag4Ti(Ce,Ga) Filler
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Chang, S.Y.; Chuang, T.H.; Yang, C.L. |
| 國立臺灣大學 |
2007 |
Electromigration in the Flip Chip Solder Joint of Sn-8Zn-3Bi on Copper Pads
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Lin, W.H.; Wu, Albert T.; Lin, S.Z.; Chuang, T.H.; Tu, K.N. |
| 國立臺灣大學 |
2006-02 |
Intermetallic Formation in Sn3Ag0.5Cu and Sn3Ag0.5Cu0.06Ni0.01Ge Solder BGA Packages with Au/Ni/Cu Pads
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Chuang, T. H.; Yen, S. F.; Cheng, M. D. |
| 國立臺灣大學 |
2006 |
Intermetallic compounds formed during the interfacial reactions between liquid In-49Sn solder and Ni substrates
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Wang, S. S.; Tseng, Y. H.; Chuang, T. H. |
| 國立臺灣大學 |
2006 |
Intermetallic reactions in Sn3Ag0.5Cu and Sn3Ag0.5Cu0.06Ni0.01Ge solder BGA packages with Au/Ni surface finishes
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Chuang, T. H.; Yen, S. F.; Cheng, M. D. |
| 國立臺灣大學 |
2006 |
Active Soldering of ITO to Copper
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Chang, S. Y.; Lu, M. H.; Tsao, L. C.; Chuang, T. H. |
Showing items 256-265 of 384 (39 Page(s) Totally)
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