| 國立成功大學 |
2021 |
Interfacial magnetic coupling in Co/antiferromagnetic van der Waals compound FePS3
|
Dhanarajgopal, A.;Chang, P.-C.;Liu, S.-Y.;Chuang, T.-H.;Wei, D.-H.;Kuo, C.-C.;Kuo, C.-N.;Lue, C.S.;Lin, W.-C. |
| 國立成功大學 |
2021 |
Effective accentuation of voltage-gated sodium current caused by apocynin (4′-hydroxy-3′-methoxyacetophenone), a known nadph-oxidase inhibitor
|
Chuang, T.-H.;Cho, H.-Y.;Wu, S.-N. |
| 臺大學術典藏 |
2020-05-25T07:35:27Z |
Polymorphism in epidermal growth factor receptor intron 1 predicts prognosis of patients with esophageal cancer after chemoradiation and surgery
|
Lee J.-M; Yang S.-Y; Yang P.-W; Shun C.-T; Wu M.-T; Hsu C.-H; Chia-Chi Lin; Cheng J.-C.-H; Wang Y.-H; Chuang T.-H; Chen J.-S; Hsu H.-H; Huang P.-M; Kuo S.-W; Lee Y.-C. |
| 臺大學術典藏 |
2020-05-19T01:53:04Z |
Polymorphism in epidermal growth factor receptor intron 1 predicts prognosis of patients with esophageal cancer after chemoradiation and surgery
|
Lee J.-M. ;Yang S.-Y. ;Yang P.-W. ;Shun C.-T. ;Wu M.-T. ;Hsu C.-H. ;Lin C.-C. ;Cheng J.-C.-H. ;Wang Y.-H. ;Chuang T.-H. ;Chen J.-S. ;Hsu H.-H. ;Pei-Ming Huang ;Kuo S.-W. ;Lee Y.-C.; Lee J.-M.; Yang S.-Y.; Yang P.-W.; Shun C.-T.; Wu M.-T.; Hsu C.-H.; Lin C.-C.; Cheng J.-C.-H.; Wang Y.-H.; Chuang T.-H.; Chen J.-S.; Hsu H.-H.; PEI-MING HUANG; Kuo S.-W.; Lee Y.-C. |
| 臺大學術典藏 |
2020-05-19T01:53:04Z |
Genetic variants in DNA repair predicts the survival of patients with esophageal cancer
|
Lee J.-M. ;Yang P.-W. ;Yang S.-Y. ;Chuang T.-H. ;Tung E.-C. ;Chen J.-S. ;Pei-Ming Huang ;Lee Y.-C.; Lee J.-M.; Yang P.-W.; Yang S.-Y.; Chuang T.-H.; Tung E.-C.; Chen J.-S.; PEI-MING HUANG; Lee Y.-C. |
| 臺大學術典藏 |
2020-05-18T08:39:01Z |
Polymorphism in epidermal growth factor receptor intron 1 predicts prognosis of patients with esophageal cancer after chemoradiation and surgery
|
Lee Y.-C.; Lee J.-M. ;Yang S.-Y. ;Yang P.-W. ;Shun C.-T. ;Wu M.-T. ;Hsu C.-H. ;Lin C.-C. ;Cheng J.-C.-H. ;Wang Y.-H. ;Chuang T.-H. ;Chen J.-S. ;Hsu H.-H. ;Huang P.-M. ;Shuenn-Wen Kuo ;Lee Y.-C.; Lee J.-M.; Yang S.-Y.; Yang P.-W.; Shun C.-T.; Wu M.-T.; Hsu C.-H.; Lin C.-C.; Cheng J.-C.-H.; Wang Y.-H.; Chuang T.-H.; Chen J.-S.; Hsu H.-H.; Huang P.-M.; SHUENN-WEN KUO |
| 臺大學術典藏 |
2020-05-12T02:54:23Z |
Characterization of alumina ceramics by ultrasonic testing
|
Chang, L.-S.; Chuang, T.-H.; Wei, W.J.; WEN-CHENG J. WEI |
| 臺大學術典藏 |
2020-05-12T02:53:30Z |
Synergistic effects of wear and corrosion for Al2O3 particulate-reinforced 6061 aluminum matrix composites
|
Fang, C. K.; Huang, C. C.; Chuang, T. H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:30Z |
Recent research and development activities on superplasticity in Taiwan
|
Huang, J. C.; Chuang, T. H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:29Z |
Observations of fracture surface chemistry on Cu-0.5 At. % Sb bicrystals
|
Chuang, T.H.; Gust, W.; Heldt, L.A.; Hintz, M.B.; Hofmann, S.; Lučić, R.; Predel, B.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:29Z |
Diffusion Soldering of Bi0.5Sb1.5Te3 Thermoelectric Material with Cu Electrode
|
Yang, C. L.; Lai, H. J.; Hwang, J. D.; Chuang, T. H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:29Z |
Intermetallic compounds formed during the interfacial reactions between liquid In-49Sn solder and Ni substrates
|
Wang, S. S.; Tseng, Y. H.; Chuang, T. H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:29Z |
Intermetallic compounds formed during the reflow and aging of Sn-3.8Ag-0.7Cu and Sn-20In-2Ag-0.5Cu solder ball grid array packages (vol 33, pg 171, 2004)
|
TUNG-HAN CHUANG; Yen, S. F.; Chuang, T. H.; Chang, S. Y.; Cheng, M. D. |
| 臺大學術典藏 |
2020-05-12T02:53:29Z |
Plasma-enhanced chemical-vapor deposition oxide prepared at low-flow conditions for course wavelength-division multiplexing optical-waveguide devices
|
Chu, A. K.; Lin, J. Y.; Wang, M. L.; Fan, C. C.; Shue, H. S.; Chuang, T. H.; Chen, S. Y.; Chiu, C. H.; Lin, S. F.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:28Z |
Discontinuous coarsening of discontinuous precipitate in a Ni-7.5 at.% In alloy
|
Chuang, T.H.; Fournelle, R.A.; Gust, W.; Predel, B.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:28Z |
The morphology of discontinuous precipitation on the surface of NiIn and NiSn alloys
|
Chuang, T.H.; Fournelle, R.A.; Gust, W.; Predel, B.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:28Z |
Electrical and Magnetic Studies on Grain Boundary Segregation in a NI-3AT.%Sn Alloy
|
Yao, Y.D.; Chuang, T.H.; Lee, C.K.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:28Z |
Discontinuous coarsening and dissolution in an Fe13.5at.%Zn solid solution
|
Chuang, T.-H.; Gust, W.; Predel, B.; Fournelle, R.A.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:27Z |
The mutual effects of boron, zirconium and aluminium on grain boundary segregation in Ni3Al intermetallic compounds
|
Chuang, T.H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:27Z |
Grain boundary pest of boron- doped Niin3Al at 1200 °C
|
Chuang, T.H.; Pan, Y.C.; Hsu, S.E.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:27Z |
Magnetization study on grain-boundary precipitation in a Ni-8 at. % Sn alloy
|
Yao, Y.D.; Chen, Y.Y.; Li, T.J.; Chuang, T.H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:27Z |
Electrical Resistivity of Nickel‐Rich Nickel‐Indium Alloys between 10 and 800 K
|
Tzeng, S.J.; Yao, Y.D.; Chuang, T.H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:27Z |
Electrical resistivity, magnetization, and grain boundary precipitates in NiSn alloys
|
Yao, Y.D.; Chen, Y.Y.; Tzeng, S.J.; Chuang, T.H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:26Z |
Low-pressure diffusion bonding of SAE 316 stainless steel by inserting a superplastic interlayer
|
Yeh, M.S.; Chuang, T.H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:26Z |
Grain boundary melting of hafnium containing Ni3Al intermetallic compounds
|
Chang, T.T.; Chuang, T.H.; TUNG-HAN CHUANG |
