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"chuang t h"的相关文件
显示项目 191-200 / 384 (共39页)
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| 臺大學術典藏 |
2020-05-12T02:53:04Z |
Low-Temperature Bonding of Bi0.5Sb1.5Te3 Thermoelectric Material with Cu Electrodes Using a Thin-Film In Interlayer
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Lin, Y.-C.; Yang, C.-L.; Huang, J.-Y.; Jain, C.-C.; Hwang, J.-D.; Chu, H.-S.; Chen, S.-C.; Chuang, T.-H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:04Z |
Materials Characteristics of Ag-Alloy Wires and Their Applications in Advanced Packages
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Tsai, C.-H.; Chuang, C.-H.; Tsai, H.-H.; Lee, J.-D.; Chang, D.; Lin, H.-J.; Chuang, T.-H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:04Z |
Microstructures, electrical and magnetic properties of (Ga, Co)-ZnO films by radio frequency magnetron co-sputtering
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Chen, S.-C.; Wang, C.-H.; Sun, H.; Wen, C.-K.; Lu, C.-F.; Tsai, C.-L.; Fu, Y.-K.; Chuang, T.-H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:03Z |
The influence of oxygen flow ratio on the optoelectronic properties of p-type Ni1-xO films deposited by ion beam assisted sputtering
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TUNG-HAN CHUANG; Chuang, T.-H.; Wang, X.; Wen, C.-K.; Peng, W.-C.; Chen, S.-C.; Sun, H. |
| 臺大學術典藏 |
2020-05-12T02:53:03Z |
Evaluation of corrosion resistance of ag-alloy bonding wires for electronic packaging
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Chen, C.-H.; Lin, Y.-C.; Shih, Y.-T.; Chen, S.-C.; Tsai, C.-H.; Wang, S.-C.; Chuang, T.-H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:03Z |
Spin Diffusion Length in Ferromagnet/Superconductor Bilayers
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Cheng, S.L.; Chuang, T.H.; Lin, J.G.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:03Z |
Microstructures and optoelectronic properties of nickel oxide films deposited by reactive magnetron sputtering at various working pressures of pure oxygen environment
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Sun, H.; Chen, S.-C.; Hsu, S.-W.; Wen, C.-K.; Chuang, T.-H.; Wang, X.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:03Z |
Characterization and crystallization kinetics of sputtered NiSi thin films for blue laser optical recording application
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Ou, S.-L.; Chen, S.-C.; Lin, Y.-C.; Lin, P.-C.; Wen, C.-K.; Chuang, T.-H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:02Z |
Luminous efficiency of pd-doped ag-alloy wire bonded led package after reliability tests
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Yuan, J.-H.; Chuang, T.-H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:02Z |
Mechanism of the Electromigration in Ag-Pd Alloy Bonding Wires
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Chuang, T.-H.; Chen, C.-H.; TUNG-HAN CHUANG |
显示项目 191-200 / 384 (共39页)
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