|
English
|
正體中文
|
简体中文
|
总笔数 :0
|
|
造访人次 :
51906169
在线人数 :
1020
教育部委托研究计画 计画执行:国立台湾大学图书馆
|
|
|
"chuang t h"的相关文件
显示项目 286-295 / 384 (共39页)
<< < 24 25 26 27 28 29 30 31 32 33 > >>
每页显示[10|25|50]项目
| 國立臺灣大學 |
2002 |
Effects of zinc additions on the microstructure and melting temperatures of Al–Si–Cu filler metals
|
Tsao, L. C.; Chiang, M. J.; Lin, W. H.; Cheng, M. D.; Chuang, T. H. |
| 國立臺灣大學 |
2002 |
Soldering reactions between In49Sn and Ag thick films
|
Cheng, M. D.; Wang, S. S.; Chuang, T. H. |
| 國立臺灣大學 |
2002 |
Characterization of Intermetallic Compounds formed during the Interfacial Reactions of Liquid Su and Sn-58Bi Solders with Ni Substrates
|
Chiu, M. Y.; Chang, S. Y.; Tseng, Y. H.; Chan, Y. C.; Chuang, T. H. |
| 國立臺灣大學 |
2002 |
Intermetallic compounds formed at the interface between liquid indium and copper substrates
|
Yu, C. L.; Wang, S. S.; Chuang, T. H. |
| 國立臺灣大學 |
2002 |
Intermetallic compounds formed during interfacial reactions between liquid Sn-8Zn-3Bi solders and Ni substrates
|
Chiu, M. Y.; Wang, S. S.; Chuang, T. H. |
| 國立臺灣大學 |
2002 |
Evaluation of the Formability of Plastic/Zn22AI/Plastic Sandwiched Structures by Gas Blowing
|
Tsao, L. C.; Su, T. L.; Chuang, T. H. |
| 國立臺灣大學 |
2002 |
Phase Identification And Growth Kinetics of the Intermetallic Compounds Formed during In-49Sn/Cu Soldering Reactions
|
Chuang, T. H.; Yu, C. L.; Chang, S. Y.; Wang, S. S. |
| 國立臺灣大學 |
2002 |
Corrosion behaviors of Al-Si-Cu-based filler metals and 6061-T6 brazements
|
Su, T. L.; Wang, S. S.; Tsao, L. C.; Chang, S. Y.; Chuang, T. H.; Yeh, M. S. |
| 國立臺灣大學 |
2002 |
Brazeability of a 3003 Aluminum alloy with Al-Si-Cu-based filler metals
|
Tsao, L. C.; Weng, W. P.; Cheng, M. D.; Tsao, C. W.; Chuang, T. H. |
| 國立臺灣大學 |
2002 |
Morphology and growth kinetics of Ag3Sn during soldering reaction between liquid Sn and an Ag substrate
|
Su, T. L.; Tsao, L. C.; Chang, S. Y.; Chuang, T. H. |
显示项目 286-295 / 384 (共39页)
<< < 24 25 26 27 28 29 30 31 32 33 > >>
每页显示[10|25|50]项目
|
