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教育部委託研究計畫 計畫執行:國立臺灣大學圖書館
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"chuang t h"的相關文件
顯示項目 261-270 / 384 (共39頁)
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| 國立臺灣大學 |
2007 |
Electromigration in the Flip Chip Solder Joint of Sn-8Zn-3Bi on Copper Pads
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Lin, W.H.; Wu, Albert T.; Lin, S.Z.; Chuang, T.H.; Tu, K.N. |
| 國立臺灣大學 |
2006-02 |
Intermetallic Formation in Sn3Ag0.5Cu and Sn3Ag0.5Cu0.06Ni0.01Ge Solder BGA Packages with Au/Ni/Cu Pads
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Chuang, T. H.; Yen, S. F.; Cheng, M. D. |
| 國立臺灣大學 |
2006 |
Intermetallic compounds formed during the interfacial reactions between liquid In-49Sn solder and Ni substrates
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Wang, S. S.; Tseng, Y. H.; Chuang, T. H. |
| 國立臺灣大學 |
2006 |
Intermetallic reactions in Sn3Ag0.5Cu and Sn3Ag0.5Cu0.06Ni0.01Ge solder BGA packages with Au/Ni surface finishes
|
Chuang, T. H.; Yen, S. F.; Cheng, M. D. |
| 國立臺灣大學 |
2006 |
Active Soldering of ITO to Copper
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Chang, S. Y.; Lu, M. H.; Tsao, L. C.; Chuang, T. H. |
| 國立臺灣大學 |
2006 |
Mechanical properties of intermetallic compounds on lead-free solder by moir? techniques
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Tsai, Iting; Wu, Enboa; Yen, S. F.; Chuang, T. H. |
| 臺大學術典藏 |
2006 |
Intermetallic reactions in Sn3Ag0.5Cu and Sn3Ag0.5Cu0.06Ni0.01Ge solder BGA packages with Au/Ni surface finishes
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ChuangTH; Cheng, M. D.; Yen, S. F.; Chuang, T. H.; Chuang, T. H.; Yen, S. F.; Cheng, M. D.Chuangth |
| 臺大學術典藏 |
2006 |
Mechanical properties of intermetallic compounds on lead-free solder by Moire techniques
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Tsai, Iting; Wu, Enboa; Yen, S. F.; Chuang, T. H.; TUNG-HAN CHUANG |
| 國立成功大學 |
2004 |
Bioassay-guided isolation and cytotoxicity of phenylpropanoid esters from the stems of Hibiscus taiwanensis
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Wu, P. L.; Chuang, T. H.; He, C. X.; Wu, Tian-Shung |
| 國立臺灣大學 |
2004 |
Reflow and burn-in of a Sn-20In-0.8Cu ball grid array package with a Au/Ni/Cu pad
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Chiang, M. J.; Chang, S. Y.; Chuang, T. H. |
顯示項目 261-270 / 384 (共39頁)
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