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機構	日期	題名	作者
臺大學術典藏	2022-03-22T08:30:53Z	Enhancing effect of substrate bias on nanotwin formation of sputtered Ag thin films	Wu P.-C;Lai Y.-C;Chuang T.-H.; Wu P.-C; Lai Y.-C; Chuang T.-H.; TUNG-HAN CHUANG
臺大學術典藏	2022-03-22T08:30:53Z	Effects of Grain Size on the Ag Dissolution and Ion Migration of Ag-4Pd Alloy Wires	Lin Y.-C;Lee P.-I;Wu P.-C;Chen C.-H;Chuang T.-H.; Lin Y.-C; Lee P.-I; Wu P.-C; Chen C.-H; Chuang T.-H.; TUNG-HAN CHUANG
臺大學術典藏	2022-03-22T08:30:52Z	Effects of Grain Size on the Ag Dissolution and Ion Migration of Ag-4Pd Alloy Wires	Lin Y.-C;Lee P.-I;Wu P.-C;Chen C.-H;Chuang T.-H.; Lin Y.-C; Lee P.-I; Wu P.-C; Chen C.-H; Chuang T.-H.; TUNG-HAN CHUANG
臺大學術典藏	2022-03-22T08:30:52Z	Intermetallic Growth at the Interfaces Between Zn4Sb3 Thermoelectric Material and Various Metallic Electrodes	Chen C.-H;Lee P.-I;Yeh W.-T;Chuang T.-H.; Chen C.-H; Lee P.-I; Yeh W.-T; Chuang T.-H.; TUNG-HAN CHUANG
臺大學術典藏	2022-03-22T08:30:52Z	Effects of adding active elements to aluminum-based filler alloys on the bonding of 6061 aluminum alloy and alumina	Sun Y.-K;Chang S.-Y;Tsao L.-C;Chuang T.-H;Zhang G.-Z;Yeh C.-Y.; Sun Y.-K; Chang S.-Y; Tsao L.-C; Chuang T.-H; Zhang G.-Z; Yeh C.-Y.; TUNG-HAN CHUANG
臺大學術典藏	2022-03-22T08:30:52Z	Formation of High Density ?111? Textured Nanotwins in Evaporated Ag Thin Films Through Post-Deposition Ion Bombardment	Lee P.-I;Wu P.-C;Chuang T.-H.; Lee P.-I; Wu P.-C; Chuang T.-H.; TUNG-HAN CHUANG
臺大學術典藏	2022-03-22T08:30:52Z	Effect of post-weld heat treatment on the solid-state diffusion bonding of 6061 aluminum alloy	Chen C.-H;Sun Y.-K;Lai Y.-C;Chang S.-Y;Chuang T.-H.; Chen C.-H; Sun Y.-K; Lai Y.-C; Chang S.-Y; Chuang T.-H.; TUNG-HAN CHUANG
臺大學術典藏	2022-03-22T08:30:52Z	Fluxless Direct Soldering of Transparent Conductive Oxides (TCOs) to Copper	Tsao L.-C;Li C.-K;Sun Y.-K;Chang S.-Y;Chuang T.-H.; Tsao L.-C; Li C.-K; Sun Y.-K; Chang S.-Y; Chuang T.-H.; TUNG-HAN CHUANG
臺大學術典藏	2022-03-22T08:30:51Z	Fluxless Direct Soldering of Transparent Conductive Oxides (TCOs) to Copper	Tsao L.-C;Li C.-K;Sun Y.-K;Chang S.-Y;Chuang T.-H.; Tsao L.-C; Li C.-K; Sun Y.-K; Chang S.-Y; Chuang T.-H.; TUNG-HAN CHUANG
臺大學術典藏	2022-03-22T08:30:51Z	Evaporation of Ag Nanotwinned Films on Si Substrates with Ion Beam Assistance	Wu P.-C;Chuang T.-H.; Wu P.-C; Chuang T.-H.; TUNG-HAN CHUANG
臺大學術典藏	2022-03-22T08:30:51Z	Enhancing effect of substrate bias on nanotwin formation of sputtered Ag thin films	Wu P.-C;Lai Y.-C;Chuang T.-H.; Wu P.-C; Lai Y.-C; Chuang T.-H.; TUNG-HAN CHUANG
臺大學術典藏	2022-03-22T08:30:51Z	Thermal stability of grain structure for Ag nanotwinned films sputtered with substrate bias	Lai Y.-C;Wu P.-C;Chuang T.-H.; Lai Y.-C; Wu P.-C; Chuang T.-H.; TUNG-HAN CHUANG
臺大學術典藏	2022-03-22T08:30:50Z	Thermal stability of grain structure for Ag nanotwinned films sputtered with substrate bias	Lai Y.-C;Wu P.-C;Chuang T.-H.; Lai Y.-C; Wu P.-C; Chuang T.-H.; TUNG-HAN CHUANG
臺大學術典藏	2022-03-22T08:30:50Z	Intermetallic Growth at the Interfaces Between Zn4Sb3 Thermoelectric Material and Various Metallic Electrodes	Chen C.-H;Lee P.-I;Yeh W.-T;Chuang T.-H.; Chen C.-H; Lee P.-I; Yeh W.-T; Chuang T.-H.; TUNG-HAN CHUANG
臺大學術典藏	2022-03-22T08:30:50Z	Formation of High Density ?111? Textured Nanotwins in Evaporated Ag Thin Films Through Post-Deposition Ion Bombardment	Lee P.-I;Wu P.-C;Chuang T.-H.; Lee P.-I; Wu P.-C; Chuang T.-H.; TUNG-HAN CHUANG
臺大學術典藏	2022-03-22T08:27:52Z	Effects of adding active elements to aluminum-based filler alloys on the bonding of 6061 aluminum alloy and alumina	Sun Y.-K;Chang S.-Y;Tsao L.-C;Chuang T.-H;Zhang G.-Z;Yeh C.-Y.; Sun Y.-K; Chang S.-Y; Tsao L.-C; Chuang T.-H; Zhang G.-Z; Yeh C.-Y.; TUNG-HAN CHUANG
臺大學術典藏	2022-03-22T08:27:52Z	Effect of post-weld heat treatment on the solid-state diffusion bonding of 6061 aluminum alloy	Chen C.-H;Sun Y.-K;Lai Y.-C;Chang S.-Y;Chuang T.-H.; Chen C.-H; Sun Y.-K; Lai Y.-C; Chang S.-Y; Chuang T.-H.; TUNG-HAN CHUANG
臺大學術典藏	2022-03-22T08:27:51Z	Enhancing effect of substrate bias on nanotwin formation of sputtered Ag thin films	Wu P.-C;Lai Y.-C;Chuang T.-H.; Wu P.-C; Lai Y.-C; Chuang T.-H.; TUNG-HAN CHUANG
臺大學術典藏	2022-03-22T08:27:51Z	Effects of Grain Size on the Ag Dissolution and Ion Migration of Ag-4Pd Alloy Wires	Lin Y.-C;Lee P.-I;Wu P.-C;Chen C.-H;Chuang T.-H.; Lin Y.-C; Lee P.-I; Wu P.-C; Chen C.-H; Chuang T.-H.; TUNG-HAN CHUANG
臺大學術典藏	2022-03-22T08:27:51Z	Evaporation of Ag Nanotwinned Films on Si Substrates with Ion Beam Assistance	Wu P.-C;Chuang T.-H.; Wu P.-C; Chuang T.-H.; TUNG-HAN CHUANG
臺大學術典藏	2022-03-22T08:27:50Z	Thermal stability of grain structure for Ag nanotwinned films sputtered with substrate bias	Lai Y.-C;Wu P.-C;Chuang T.-H.; Lai Y.-C; Wu P.-C; Chuang T.-H.; TUNG-HAN CHUANG
臺大學術典藏	2022-03-22T08:27:50Z	Intermetallic Growth at the Interfaces Between Zn4Sb3 Thermoelectric Material and Various Metallic Electrodes	Chen C.-H;Lee P.-I;Yeh W.-T;Chuang T.-H.; Chen C.-H; Lee P.-I; Yeh W.-T; Chuang T.-H.; TUNG-HAN CHUANG
臺大學術典藏	2022-03-22T08:27:50Z	Formation of High Density ?111? Textured Nanotwins in Evaporated Ag Thin Films Through Post-Deposition Ion Bombardment	Lee P.-I;Wu P.-C;Chuang T.-H.; Lee P.-I; Wu P.-C; Chuang T.-H.; TUNG-HAN CHUANG
臺大學術典藏	2022-03-22T08:27:50Z	Fluxless Direct Soldering of Transparent Conductive Oxides (TCOs) to Copper	Tsao L.-C;Li C.-K;Sun Y.-K;Chang S.-Y;Chuang T.-H.; Tsao L.-C; Li C.-K; Sun Y.-K; Chang S.-Y; Chuang T.-H.; TUNG-HAN CHUANG
臺大學術典藏	2022-01-07T06:05:45Z	ZNRF1 Mediates Epidermal Growth Factor Receptor Ubiquitination to Control Receptor Lysosomal Trafficking and Degradation	Shen C.-H.; Chou C.-C.; Lai T.-Y.; Hsu J.-E.; Lin Y.-S.; Liu H.-Y.; Chen Y.-K.; Ho I.-L.; Hsu P.-H.; Chuang T.-H.; CHIH-YUAN LEE; Hsu L.-C.

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