| 臺大學術典藏 |
2022-03-22T08:30:52Z |
Formation of High Density ?111? Textured Nanotwins in Evaporated Ag Thin Films Through Post-Deposition Ion Bombardment
|
Lee P.-I;Wu P.-C;Chuang T.-H.; Lee P.-I; Wu P.-C; Chuang T.-H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2022-03-22T08:30:52Z |
Effect of post-weld heat treatment on the solid-state diffusion bonding of 6061 aluminum alloy
|
Chen C.-H;Sun Y.-K;Lai Y.-C;Chang S.-Y;Chuang T.-H.; Chen C.-H; Sun Y.-K; Lai Y.-C; Chang S.-Y; Chuang T.-H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2022-03-22T08:30:52Z |
Fluxless Direct Soldering of Transparent Conductive Oxides (TCOs) to Copper
|
Tsao L.-C;Li C.-K;Sun Y.-K;Chang S.-Y;Chuang T.-H.; Tsao L.-C; Li C.-K; Sun Y.-K; Chang S.-Y; Chuang T.-H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2022-03-22T08:30:51Z |
Fluxless Direct Soldering of Transparent Conductive Oxides (TCOs) to Copper
|
Tsao L.-C;Li C.-K;Sun Y.-K;Chang S.-Y;Chuang T.-H.; Tsao L.-C; Li C.-K; Sun Y.-K; Chang S.-Y; Chuang T.-H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2022-03-22T08:30:51Z |
Evaporation of Ag Nanotwinned Films on Si Substrates with Ion Beam Assistance
|
Wu P.-C;Chuang T.-H.; Wu P.-C; Chuang T.-H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2022-03-22T08:30:51Z |
Enhancing effect of substrate bias on nanotwin formation of sputtered Ag thin films
|
Wu P.-C;Lai Y.-C;Chuang T.-H.; Wu P.-C; Lai Y.-C; Chuang T.-H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2022-03-22T08:30:51Z |
Thermal stability of grain structure for Ag nanotwinned films sputtered with substrate bias
|
Lai Y.-C;Wu P.-C;Chuang T.-H.; Lai Y.-C; Wu P.-C; Chuang T.-H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2022-03-22T08:30:50Z |
Thermal stability of grain structure for Ag nanotwinned films sputtered with substrate bias
|
Lai Y.-C;Wu P.-C;Chuang T.-H.; Lai Y.-C; Wu P.-C; Chuang T.-H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2022-03-22T08:30:50Z |
Intermetallic Growth at the Interfaces Between Zn4Sb3 Thermoelectric Material and Various Metallic Electrodes
|
Chen C.-H;Lee P.-I;Yeh W.-T;Chuang T.-H.; Chen C.-H; Lee P.-I; Yeh W.-T; Chuang T.-H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2022-03-22T08:30:50Z |
Formation of High Density ?111? Textured Nanotwins in Evaporated Ag Thin Films Through Post-Deposition Ion Bombardment
|
Lee P.-I;Wu P.-C;Chuang T.-H.; Lee P.-I; Wu P.-C; Chuang T.-H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2022-03-22T08:27:52Z |
Effects of adding active elements to aluminum-based filler alloys on the bonding of 6061 aluminum alloy and alumina
|
Sun Y.-K;Chang S.-Y;Tsao L.-C;Chuang T.-H;Zhang G.-Z;Yeh C.-Y.; Sun Y.-K; Chang S.-Y; Tsao L.-C; Chuang T.-H; Zhang G.-Z; Yeh C.-Y.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2022-03-22T08:27:52Z |
Effect of post-weld heat treatment on the solid-state diffusion bonding of 6061 aluminum alloy
|
Chen C.-H;Sun Y.-K;Lai Y.-C;Chang S.-Y;Chuang T.-H.; Chen C.-H; Sun Y.-K; Lai Y.-C; Chang S.-Y; Chuang T.-H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2022-03-22T08:27:51Z |
Enhancing effect of substrate bias on nanotwin formation of sputtered Ag thin films
|
Wu P.-C;Lai Y.-C;Chuang T.-H.; Wu P.-C; Lai Y.-C; Chuang T.-H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2022-03-22T08:27:51Z |
Effects of Grain Size on the Ag Dissolution and Ion Migration of Ag-4Pd Alloy Wires
|
Lin Y.-C;Lee P.-I;Wu P.-C;Chen C.-H;Chuang T.-H.; Lin Y.-C; Lee P.-I; Wu P.-C; Chen C.-H; Chuang T.-H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2022-03-22T08:27:51Z |
Evaporation of Ag Nanotwinned Films on Si Substrates with Ion Beam Assistance
|
Wu P.-C;Chuang T.-H.; Wu P.-C; Chuang T.-H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2022-03-22T08:27:50Z |
Thermal stability of grain structure for Ag nanotwinned films sputtered with substrate bias
|
Lai Y.-C;Wu P.-C;Chuang T.-H.; Lai Y.-C; Wu P.-C; Chuang T.-H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2022-03-22T08:27:50Z |
Intermetallic Growth at the Interfaces Between Zn4Sb3 Thermoelectric Material and Various Metallic Electrodes
|
Chen C.-H;Lee P.-I;Yeh W.-T;Chuang T.-H.; Chen C.-H; Lee P.-I; Yeh W.-T; Chuang T.-H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2022-03-22T08:27:50Z |
Formation of High Density ?111? Textured Nanotwins in Evaporated Ag Thin Films Through Post-Deposition Ion Bombardment
|
Lee P.-I;Wu P.-C;Chuang T.-H.; Lee P.-I; Wu P.-C; Chuang T.-H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2022-03-22T08:27:50Z |
Fluxless Direct Soldering of Transparent Conductive Oxides (TCOs) to Copper
|
Tsao L.-C;Li C.-K;Sun Y.-K;Chang S.-Y;Chuang T.-H.; Tsao L.-C; Li C.-K; Sun Y.-K; Chang S.-Y; Chuang T.-H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2022-01-07T06:05:45Z |
ZNRF1 Mediates Epidermal Growth Factor Receptor Ubiquitination to Control Receptor Lysosomal Trafficking and Degradation
|
Shen C.-H.; Chou C.-C.; Lai T.-Y.; Hsu J.-E.; Lin Y.-S.; Liu H.-Y.; Chen Y.-K.; Ho I.-L.; Hsu P.-H.; Chuang T.-H.; CHIH-YUAN LEE; Hsu L.-C. |
| 臺大學術典藏 |
2022-01-07T06:05:44Z |
Terminal uridyltransferase 7 regulates TLR4-triggered inflammation by controlling Regnase-1 mRNA uridylation and degradation
|
Lin C.-C.; Shen Y.-R.; Chang C.-C.; Guo X.-Y.; Young Y.-Y.; Lai T.-Y.; Yu I.-S.; CHIH-YUAN LEE; Chuang T.-H.; Tsai H.-Y.; Hsu L.-C. |
| 國立成功大學 |
2022 |
Characterization of Inhibitory Capability on Hyperpolarization-Activated Cation Current Caused by Lutein (β,ε-Carotene-3,3′-Diol), a Dietary Xanthophyll Carotenoid
|
Chuang, Chuang C.-W.;Chang, K.-P.;Cho, H.-Y.;Chuang, T.-H.;Yu, M.-C.;Wu, C.-L.;Wu, S.-N. |
| 國立成功大學 |
2022 |
The Evidence for Sparsentan-Mediated Inhibition of INa and IK(erg): Possibly Unlinked to Its Antagonism of Angiotensin II or Endothelin Type a Receptor
|
Chuang, T.-H.;Cho, H.-Y.;Wu, S.-N. |
| 國立成功大學 |
2022 |
Effective Perturbations by Phenobarbital on INa, IK(erg), IK(M) and IK(DR) during Pulse Train Stimulation in Neuroblastoma Neuro-2a Cells
|
Wu, P.-M.;Lai, P.-C.;Cho, H.-Y.;Chuang, T.-H.;Wu, S.-N.;Tu, Y.-F. |
| 國立成功大學 |
2022 |
Trigonal distortion in zigzag-antiferromagnet iron phosphorus trisulfide
|
Chang, A.G.;Lan, Lan L.-W.;Chan, Y.-J.;Kuo, C.-N.;Chen, T.;Huang, C.-H.;Chuang, T.-H.;Wei, D.-H.;Lue, C.-S.;Kuo, C.-C. |
