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"chuang t h"
Showing items 121-130 of 384 (39 Page(s) Totally)
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| 臺大學術典藏 |
2020-05-12T02:53:19Z |
Brazeability of the 6061-T6 aluminum alloy with Al-Si-20Cu-based filler metals
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Tsao, L.C.; Tsai, T.C.; Wu, C.S.; Chuang, T.H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:18Z |
Interfacial reaction between liquid Sn-20In-2.8Ag solder and Ag substrate
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Chiang, M.J.; Chuang, T.H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:18Z |
Intermetallic compounds formed at the interface between liquid indium and copper substrates
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Yu, C.L.; Wang, S.S.; Chuang, T.H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:18Z |
Intermetallic compounds formed during interfacial reactions between liquid Sn-8Zn-3Bi solders and Ni substrates
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Chiu, M.Y.; Wang, S.S.; Chuang, T.H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:18Z |
Soldering reactions between In49Sn and Ag thick films
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Cheng, M.D.; Wang, S.S.; Chuang, T.H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:18Z |
Intermetallic compounds formed during the soldering reactions of eutectic Sn-9Zn with Cu and Ni substrates
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Chan, Y.C.; Chiu, M.Y.; Chuang, T.H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:17Z |
Intermetallic compounds formed during the reflow of In-49Sn solder ball-grid array packages
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Chuang, T.H.; Chang, S.Y.; Tsao, L.C.; Weng, W.P.; Wu, H.M.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:17Z |
Evaluation of the formability of plastic/Zn22Al/plastic sandwiched structures by gas blowing
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Tsao, L.C.; Su, T.L.; Chuang, T.H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:17Z |
Interfacial reactions of liquid Sn and Sn-3.5Ag solders with Ag thick films
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Su, T.L.; Tsao, L.C.; Chang, S.Y.; Chuang, T.H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:17Z |
Morphology and growth kinetics of Ag3Sn during soldering reaction between liquid Sn and an Ag substrate
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Su, T.L.; Tsao, L.C.; Chang, S.Y.; Chuang, T.H.; TUNG-HAN CHUANG |
Showing items 121-130 of 384 (39 Page(s) Totally)
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