|
"chuang t h"的相关文件
显示项目 176-185 / 384 (共39页) << < 13 14 15 16 17 18 19 20 21 22 > >> 每页显示[10|25|50]项目
| 臺大學術典藏 |
2020-05-12T02:53:07Z |
Surface reconstruction of an annealing twinned Ag-8Au-3Pd alloy wire under current stressing
|
Chuang, T.-H.; Wang, H.-C.; Chuang, C.-H.; Lin, H.-J.; Lee, J.-D.; Tsai, H.-H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:07Z |
Effects of la addition on microstructure and mechanical properties of SN-58BI solders joints with osp pads
|
Shiue, Y.Y.; Chuang, T.H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:07Z |
Diffusion soldering of Bi0.5Sb1.5Te3 thermoelectric material with Cu electrode
|
Yang, C.L.; Lai, H.J.; Hwang, J.D.; Chuang, T.H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:07Z |
High performance Ag-Pd alloy wires for high frequency IC packages
|
Tsai, H.-H.; Chuang, T.-H.; Lee, J.-D.; Tsai, C.-H.; Wang, H.-C.; Lin, H.-J.; Chang, C.-C.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:06Z |
Applications of Ag-Alloy stud bump for IC and LED packages
|
Tsai, H.-H.; Tsai, C.-H.; Lee, J.-D.; Chang, D.; Shih, Y.-T.; Chen, C.-H.; Chuang, T.-H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:06Z |
Thermal stability of grain structure and material properties in an annealing twinned Ag-4Pd alloy wire
|
Chuang, T.-H.; Lin, H.-J.; Chuang, C.-H.; Shiue, Y.-Y.; Shieu, F.-S.; Huang, Y.-L.; Hsu, P.-C.; Lee, J.-D.; Tsai, H.-H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:06Z |
Improvement of bonding strength of a (Pb, Sn)Te-Cu contact manufactured in a low temperature SLID-bonding process
|
Chuang, T.-H.; Yeh, W.-T.; Chuang, C.-H.; Hwang, J.-D.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:06Z |
Mechanism of Electromigration in Ag-Alloy Bonding Wires with Different Pd and Au Content
|
Chuang, T.-H.; Lin, H.-J.; Wang, H.-C.; Chuang, C.-H.; Tsai, C.-H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:06Z |
Nickel-tin solid-liquid inter-diffusion bonding
|
Yu, C.-C.; Su, P.-C.; Bai, S.J.; Chuang, T.-H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:05Z |
Low temperature bonding of Pd/Ni assembly for hydrogen purifier
|
Lin, Y.-C.; Chuang, C.-H.; Tsai, H.-H.; Chuang, T.-H.; TUNG-HAN CHUANG |
显示项目 176-185 / 384 (共39页) << < 13 14 15 16 17 18 19 20 21 22 > >> 每页显示[10|25|50]项目
|