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機構	日期	題名	作者
臺大學術典藏	2020-02-06T06:49:54Z	A patient friendly corifollitropin alfa protocol without routine pituitary suppression in normal responders	Wang H.-L; Lai H.-H; Chuang T.-H; Shih Y.-W; Huang S.-C; Lee M.-J; SHEE-UAN CHEN; Wang H.-L;Lai H.-H;Chuang T.-H;Shih Y.-W;Huang S.-C;Lee M.-J;Shee-Uan Chen
臺大學術典藏	2020-02-06T06:49:53Z	Identification of mosaic and segmental aneuploidies by next-generation sequencing in preimplantation genetic screening can improve clinical outcomes compared to array-comparative genomic hybridization	Lai H.-H;Chuang T.-H;Wong L.-K;Lee M.-J;Hsieh C.-L;Wang H.-L;Shee-Uan Chen; Lai H.-H; Chuang T.-H; Wong L.-K; Lee M.-J; Hsieh C.-L; Wang H.-L; SHEE-UAN CHEN
臺大學術典藏	2020-02-06T06:49:52Z	Concordance between different trophectoderm biopsy sites and the inner cell mass of chromosomal composition measured with a next-generation sequencing platform	Chuang T.-H;Hsieh J.-Y;Lee M.-J;Lai H.-H;Hsieh C.-L;Wang H.-L;Chang Y.-J;Shee-Uan Chen; Chuang T.-H; Hsieh J.-Y; Lee M.-J; Lai H.-H; Hsieh C.-L; Wang H.-L; Chang Y.-J; SHEE-UAN CHEN
臺大學術典藏	2020-01-06T03:11:16Z	Intermetallic Compounds Formed in Sn-20In-2.8Ag Solder BGA Packages with Ag/Cu Pads	Jain, C. C.; Wang, S. S.; Huang, K. W.; Chuang, T. H.; STEVEN SHENG-SHIH WANG
國立成功大學	2020	Lateral loading test for partially confined and unconfined masonry panels	Tu, Y.-H.;Lo, T.-Y.;Chuang, T.-H.
國立成功大學	2020	The key role of Taiwanese nurses in combating covid-19 pandemic	Chen, S.-F.;Huang, L.-H.;Chen, Chen C.-M.;Chuang, T.-H.;Peng, M.-T.;Wang, H.-H.
淡江大學	2019-05-24	Atomic replacement effects on the band structure of doped perovskite thin films	Cheng, S. L.;Du, C. H.;Chuang, T. H.;Lin, J. G.
臺大學術典藏	2018-09-10T15:19:10Z	Spin injection induced phase transition in YBa2Cu3O7-δ/Nd0.35Sr0.65MnO3 bilayer	Cheng, S.L.; Lin, J.G.; Chuang, T.H.; SOO-FIN CHENG
臺大學術典藏	2018-09-10T08:33:07Z	Functional interaction of Heat Shock protein 90 and beclin 1 modulates toll-like receptor-mediated autophagy	Xu, C. Liu, J. Hsu, L.-C. Luo, Y. Xiang, R. Chuang, T.-H.Xu, C.; Liu, J.; Hsu, L.-C.; Luo, Y.; Xiang, R.; Chuang, T.-H.; LI-CHUNG HSU; Xu, C.; Liu, J.; Hsu, L.-C.; Luo, Y.; Xiang, R.; Chuang, T.-H.
臺大學術典藏	2018-09-10T08:22:01Z	Kinetic model of hyperbranched polymers formed by self-condensing vinyl or self-condensing ring-opening polymerization of AB monomers activated by stimuli with different reactivities	Su, Wei-Fang;Guo, Wenjeng;Chuang, Tsu-Hwang;Su, Yuan-Yuan;Cheng, Kuo-Chung;WEI-FANG SU;Su, W.-F.;Guo, W.;Chuang, T.-H.;Su, Y.-Y.;Cheng, K.-C.;Su, Wei-Fang;Guo, Wenjeng;Chuang, Tsu-Hwang;Su, Yuan-Yuan;Cheng, Kuo-Chung;WEI-FANG SU; Cheng, K.-C.; Su, Y.-Y.; Chuang, T.-H.; Guo, W.; Su, W.-F.; WEI-FANG SU; Cheng, Kuo-Chung; Su, Yuan-Yuan; Chuang, Tsu-Hwang; Guo, Wenjeng; Su, Wei-Fang
臺大學術典藏	2018-09-10T08:06:55Z	A five-amino-acid motif in the undefined region of the TLR8 ectodomain is required for species-specific ligand recognition	Liu, J.;Xu, C.;Hsu, L.-C.;Luo, Y.;Xiang, R.;Chuang, T.-H.; LI-CHUNG HSU
臺大學術典藏	2018-09-10T07:47:03Z	First shell substitution effects on hyperbranched polymers formed from monomers A2 and B3 with end-capping molecules	WEI-FANG SU;Su, W.-F.;Guo, W.;Tsai, T.-H.;Chuang, T.-H.;Cheng, K.-C.;WEI-FANG SU; Cheng, K.-C.; Chuang, T.-H.; Tsai, T.-H.; Guo, W.; Su, W.-F.; WEI-FANG SU
臺大學術典藏	2018-09-10T07:38:35Z	The proximity between C-termini of dimeric vacuolar H+- pyrophosphatase determined using atomic force microscopy and a gold nanoparticle technique	SHIH-KANG FAN;Pan, R.-L.;Tseng, F.-G.;Fu, C.-C.;Fan, S.-K.;Chuang, T.-H.;Huang, T.-W.;Lin, S.-M.;Huang, Y.-T.;Hsu, S.-H.;Liu, T.-H.;SHIH-KANG FAN; Liu, T.-H.; Hsu, S.-H.; Huang, Y.-T.; Lin, S.-M.; Huang, T.-W.; Chuang, T.-H.; Fan, S.-K.; Fu, C.-C.; Tseng, F.-G.; Pan, R.-L.; SHIH-KANG FAN
臺大學術典藏	2018-09-10T07:13:14Z	Model of hyperbranched polymers formed by monomers A2 and Bg with end-capping molecules	Su, Wei-Fang;Guo, Wenjeng;Tsai, The-Hua;Chuang, Tsu-Hwang;WEI-FANG SU;Cheng, Kuo-Chung;Su, W.-F.;Guo, W.;Tsai, T.-H.;Chuang, T.-H.;Cheng, K.-C.;Su, Wei-Fang;Guo, Wenjeng;Tsai, The-Hua;Chuang, Tsu-Hwang;WEI-FANG SU;Cheng, Kuo-Chung; Cheng, K.-C.; Chuang, T.-H.; Tsai, T.-H.; Guo, W.; Su, W.-F.; Cheng, Kuo-Chung; WEI-FANG SU; Chuang, Tsu-Hwang; Tsai, The-Hua; Guo, Wenjeng; Su, Wei-Fang
臺大學術典藏	2018-09-10T05:59:51Z	Selective particle separation and deposition by 3-D insulator-based dielectrophoresis	Jiang, M.-S.; Chuang, T.-H.; Fu, C.-C.; Fan, S.-K.; SHIH-KANG FAN; SHIH-KANG FAN;Fan, S.-K.;Fu, C.-C.;Chuang, T.-H.;Jiang, M.-S.;Chu, L.-Y.;Chuang, K.-C.;SHIH-KANG FAN; Chuang, K.-C.; Chu, L.-Y.
臺大學術典藏	2018-09-10T04:51:22Z	2-(N-methylanilino)-2-phenylsulfanylacetonitrile, a reagent tested for electrophilic, nucleophilic and radical reactions	Chen, C.-C.;Chen, S.-T.;Chuang, T.-H.;Fang, J.-M.; Chen, C.-C.; Chen, S.-T.; Chuang, T.-H.; Fang, J.-M.; JIM-MIN FANG
臺大學術典藏	2018-06-28T22:23:24Z	Evolution of Ag3Sn compounds and microhardness of Sn3.5Ag0.5Cu nano-composite solders during different cooling rate and aging	ChuangTH; Chang, S.Y.; Chung, Chien-Han; Tsao, L.C.; Chuang, T.H.; Chuang, T.H.; Tsao, L.C.; Chung, Chien-Han; Chang, S.Y.
臺大學術典藏	2018-06-28T22:11:37Z	Formation of Whiskers and Hillocks on the Surface of Sn-6.6RE Alloys	Chuang, T.H.; Chi, C.C.; Lin, H.J.; Chuang, T.H.; Chi, C.C.; Lin, H.J.; ChuangTH
臺大學術典藏	2018-06-28T22:11:27Z	Intermetallic Compounds Formed during the Reflow of In-49Sn Solder Ball-Grid-Array Packages	Chuang, T. H.; Chang, S. Y.; Tsao, L. C.; Weng, W. P.; Wu, H. M.; Chuang, T. H.; Chang, S. Y.; Tsao, L. C.; Weng, W. P.; Wu, H. M.; ChuangTH
國立成功大學	2018	Organic amine-mediated free-radical carbocyclization reactions of 2,2,2-trihalogeno-substituted: N -(2-alkynylphenyl)acetamides	Chuang, T.-H.;Chuang, Chuang C.-P.
國立臺灣科技大學	2017	Ziffersystem: A novel malware distribution detection system	Chuang, T.-H.;Huang, S.-Y.;Mao, C.-H.;Jeng, A.B.;Lee, H.-M.
國立成功大學	2017	Residual size-based mobile data offloading for file transmission on mobile devices	Chuang, T.-H.;Su, P.-H.;Tsai, M.-H.
國立成功大學	2017	Copper-Salt-Promoted Carbocyclization Reactions of α-Bromo- N -arylacylamides	Chuang, Chuang C.-P.;Chen, Y.-Y.;Chuang, T.-H.;Yang, C.-H.
臺大學術典藏	2015	Spin injection induced phase transition in YBa2Cu3O7-δ/Nd0.35Sr0.65MnO3 bilayer	Lin, J. G.; Chuang, T. H.; Cheng, S. L.
淡江大學	2013-07-15	Thermal properties and flammability of polylactide/aluminum trihydrate composites with addition of organoclay and carbon fiber	Lin, Y.-H.; Cheng, K.-C.; Chuang, T.-H.; Guo, W.; Wang, S.-F.; Don, T.-M.
國立臺灣大學	2012	Evolution of Ag3Sn compounds and microhardness of Sn3.5Ag0.5Cu nano-composite solders during different cooling rate and aging	Chuang, T.H.; Tsao, L.C.; Chung, Chien-Han; Chang, S.Y.
國立臺灣大學	2011	Effect of addition of TiO2 nanoparticles on the microstructure, microhardness and interfacial reactions of Sn3.5AgXCu solder	Chang, S.Y.; Jain, C.C.; Chuang, T.H.; Feng, L.P.; Tsao, L.C.
國立臺灣大學	2011	Strengthening mechanism of nano-Al2O3 particles reinforced Sn3.5Ag0.5Cu lead-free solder	Chuang, T.H.; Wu, M.W.; Chang, S.Y.; Ping, S.F.; Tsao, L.C.
國立臺灣大學	2011	The Inhibition of Tin Whiskers on the Surface of Sn-8Zn-3Bi-0.5Ce Solders	Jain, C.C.; Chen, C.L.; Lai, H.J.; Chuang, T.H.
臺大學術典藏	2011	Strengthening mechanism of nano-Al2O3 particles reinforced Sn3.5Ag0.5Cu lead-free solder	Wu, M.W.; Chang, S.Y.; Ping, S.F.; Tsao, L.C.; ChuangTH; Chuang, T.H.; Chuang, T.H.; Wu, M.W.; Chang, S.Y.; Ping, S.F.; Tsao, L.C.
臺大學術典藏	2011	Polymorphism in epidermal growth factor receptor intron 1 predicts prognosis of patients with esophageal cancer after chemoradiation and surgery	Lee Y.-C.; Kuo S.-W.; Huang P.-M.; Hsu H.-H.; Chuang T.-H.; Chen J.-S.; Cheng J.-C.-H.; Wang Y.-H.; Lin C.-C.; Hsu C.-H.; Wu M.-T.; Shun C.-T.; Yang P.-W.; Yang S.-Y.; JANG-MING LEE; Jang-Ming Lee ;Yang S.-Y. ;Yang P.-W. ;Shun C.-T. ;Wu M.-T. ;Hsu C.-H. ;Lin C.-C. ;Cheng J.-C.-H. ;Wang Y.-H. ;Chuang T.-H. ;Chen J.-S. ;Hsu H.-H. ;Huang P.-M. ;Kuo S.-W. ;Lee Y.-C.
臺大學術典藏	2011	Polymorphism in epidermal growth factor receptor intron 1 predicts prognosis of patients with esophageal cancer after chemoradiation and surgery	Lee Y.-C.; Kuo S.-W.; Huang P.-M.; Hsu H.-H.; Chen J.-S.; Chuang T.-H.; Wang Y.-H.; Cheng J.-C.-H.; Lee J.-M.; Yang S.-Y.; Yang P.-W.; Shun C.-T.; Wu M.-T.; CHIH-HUNG HSU; Lin C.-C.; Lee J.-M. ;Yang S.-Y. ;Yang P.-W. ;Shun C.-T. ;Wu M.-T. ;Chih-Hung Hsu ;Lin C.-C. ;Cheng J.-C.-H. ;Wang Y.-H. ;Chuang T.-H. ;Chen J.-S. ;Hsu H.-H. ;Huang P.-M. ;Kuo S.-W. ;Lee Y.-C.
臺大學術典藏	2011	Interfacial microstructure and bonding strength of Sn-3Ag-0.5Cu and Sn-3Ag-0.5Cu-0.5Ce-xZn solder BGA packages with immersion Ag surface finish	Lin, H.-J.; Chuang, T.-H.; TUNG-HAN CHUANG
臺大學術典藏	2011	Polymorphism in epidermal growth factor receptor intron 1 predicts prognosis of patients with esophageal cancer after chemoradiation and surgery	Lee J.-M. ;Yang S.-Y. ;Yang P.-W. ;Shun C.-T. ;Wu M.-T. ;Hsu C.-H. ;Lin C.-C. ;Chia-Hsien Cheng ;Wang Y.-H. ;Chuang T.-H. ;Chen J.-S. ;Hsu H.-H. ;Huang P.-M. ;Kuo S.-W. ;Lee Y.-C.; Lee J.-M.; Yang S.-Y.; Yang P.-W.; Shun C.-T.; Wu M.-T.; Hsu C.-H.; Lin C.-C.; CHIA-HSIEN CHENG; Wang Y.-H.; Chuang T.-H.; Chen J.-S.; Hsu H.-H.; Huang P.-M.; Kuo S.-W.; Lee Y.-C.
臺大學術典藏	2009	Evaluations of whisker growth and fatigue reliability of Sn-3Ag-0.5Cu and Sn-3Ag-0.5Cu-0.05Ce solder ball grid array packages	Chuang, T.-H.; TUNG-HAN CHUANG; Chang, T.-C.; Cheng, C.-Y.
國立臺灣大學	2008	Active soldering of ZnS–SiO2 sputtering targets to copper backing plates using an Sn3.5Ag4Ti(Ce, Ga) filler metal	Chang, S.Y.; Chuang, T.H.; Tsao, L.C.; Yang, C.L.; Yang, Z.S.
國立臺灣大學	2008	Intermetallic Reactions in Reflowed and Aged Sn-58Bi BGA Packages with Au/Ni/Cu Pads	Chi, C.C.; Tsao, L.C.; Tsao, C.W.; Chuang, T.H.
國立臺灣大學	2008	Formation of Whiskers and Hillocks on the Surface of Sn-6.6RE Alloys	Chuang, T.H.; Chi, C.C.; Lin, H.J.
國立臺灣大學	2008	Intermetallic Compounds Formed in Sn-20In-2.8Ag Solder BGA Packages with Ag/Cu Pads	Jain, C.C.; Wang, S.S.; Huang, K.W.; Chuang, T.H.
國立臺灣大學	2008	Intermetallic Reactions in Sn-0.4Co-0.7Cu Solder BGA Packages with an ENIG Surface Finish	Chuang, T.H.; Jain, C.C.; Wu, H.M.
國立臺灣大學	2008	Enhanced growth of anodic alumina nanochannels on Ga-ion pre-irradiated aluminum	Liu, C. Y.; Datta, A.; Liu, N. W.; Wu, Y. R.; Wang, H. H.; Chuang, T. H.; Wang, Y. L.
臺大學術典藏	2008	Intermetallic Reactions in Sn-0.4Co-0.7Cu Solder BGA Packages with an ENIG Surface Finish	ChuangTH; Wu, H.M.; Jain, C.C.; Chuang, T.H.; Chuang, T.H.; Jain, C.C.; Wu, H.M.
國立臺灣大學	2007	Rapid growth of tin whiskers on the surface of Sn–6.6Lu alloy	Chuang, T.H.; Lin, H.J.; Chi, C.C.
國立臺灣大學	2007	Abnormal Tin Whisker Growth in Rare Earth Element-Doped Sn-3Ag-0.5Cu Solder Joints	Chuang, T. H.; Yen, S. F.
國立臺灣大學	2007	Low Temperature Bonding of Alumina/Alumina and Alumina/Copper in Air Using Sn3.5Ag4Ti(Ce,Ga) Filler	Chang, S.Y.; Chuang, T.H.; Yang, C.L.
國立臺灣大學	2007	Electromigration in the Flip Chip Solder Joint of Sn-8Zn-3Bi on Copper Pads	Lin, W.H.; Wu, Albert T.; Lin, S.Z.; Chuang, T.H.; Tu, K.N.
國立臺灣大學	2006-02	Intermetallic Formation in Sn3Ag0.5Cu and Sn3Ag0.5Cu0.06Ni0.01Ge Solder BGA Packages with Au/Ni/Cu Pads	Chuang, T. H.; Yen, S. F.; Cheng, M. D.
國立臺灣大學	2006	Intermetallic compounds formed during the interfacial reactions between liquid In-49Sn solder and Ni substrates	Wang, S. S.; Tseng, Y. H.; Chuang, T. H.
國立臺灣大學	2006	Intermetallic reactions in Sn3Ag0.5Cu and Sn3Ag0.5Cu0.06Ni0.01Ge solder BGA packages with Au/Ni surface finishes	Chuang, T. H.; Yen, S. F.; Cheng, M. D.
國立臺灣大學	2006	Active Soldering of ITO to Copper	Chang, S. Y.; Lu, M. H.; Tsao, L. C.; Chuang, T. H.

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