| 臺大學術典藏 |
2011 |
Polymorphism in epidermal growth factor receptor intron 1 predicts prognosis of patients with esophageal cancer after chemoradiation and surgery
|
Lee Y.-C.; Kuo S.-W.; Huang P.-M.; Hsu H.-H.; Chuang T.-H.; Chen J.-S.; Cheng J.-C.-H.; Wang Y.-H.; Lin C.-C.; Hsu C.-H.; Wu M.-T.; Shun C.-T.; Yang P.-W.; Yang S.-Y.; JANG-MING LEE; Jang-Ming Lee ;Yang S.-Y. ;Yang P.-W. ;Shun C.-T. ;Wu M.-T. ;Hsu C.-H. ;Lin C.-C. ;Cheng J.-C.-H. ;Wang Y.-H. ;Chuang T.-H. ;Chen J.-S. ;Hsu H.-H. ;Huang P.-M. ;Kuo S.-W. ;Lee Y.-C. |
| 臺大學術典藏 |
2011 |
Polymorphism in epidermal growth factor receptor intron 1 predicts prognosis of patients with esophageal cancer after chemoradiation and surgery
|
Lee Y.-C.; Kuo S.-W.; Huang P.-M.; Hsu H.-H.; Chen J.-S.; Chuang T.-H.; Wang Y.-H.; Cheng J.-C.-H.; Lee J.-M.; Yang S.-Y.; Yang P.-W.; Shun C.-T.; Wu M.-T.; CHIH-HUNG HSU; Lin C.-C.; Lee J.-M. ;Yang S.-Y. ;Yang P.-W. ;Shun C.-T. ;Wu M.-T. ;Chih-Hung Hsu ;Lin C.-C. ;Cheng J.-C.-H. ;Wang Y.-H. ;Chuang T.-H. ;Chen J.-S. ;Hsu H.-H. ;Huang P.-M. ;Kuo S.-W. ;Lee Y.-C. |
| 臺大學術典藏 |
2011 |
Interfacial microstructure and bonding strength of Sn-3Ag-0.5Cu and Sn-3Ag-0.5Cu-0.5Ce-xZn solder BGA packages with immersion Ag surface finish
|
Lin, H.-J.; Chuang, T.-H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2011 |
Polymorphism in epidermal growth factor receptor intron 1 predicts prognosis of patients with esophageal cancer after chemoradiation and surgery
|
Lee J.-M. ;Yang S.-Y. ;Yang P.-W. ;Shun C.-T. ;Wu M.-T. ;Hsu C.-H. ;Lin C.-C. ;Chia-Hsien Cheng ;Wang Y.-H. ;Chuang T.-H. ;Chen J.-S. ;Hsu H.-H. ;Huang P.-M. ;Kuo S.-W. ;Lee Y.-C.; Lee J.-M.; Yang S.-Y.; Yang P.-W.; Shun C.-T.; Wu M.-T.; Hsu C.-H.; Lin C.-C.; CHIA-HSIEN CHENG; Wang Y.-H.; Chuang T.-H.; Chen J.-S.; Hsu H.-H.; Huang P.-M.; Kuo S.-W.; Lee Y.-C. |
| 臺大學術典藏 |
2009 |
Evaluations of whisker growth and fatigue reliability of Sn-3Ag-0.5Cu and Sn-3Ag-0.5Cu-0.05Ce solder ball grid array packages
|
Chuang, T.-H.; TUNG-HAN CHUANG; Chang, T.-C.; Cheng, C.-Y. |
| 國立臺灣大學 |
2008 |
Active soldering of ZnS–SiO2 sputtering targets to copper backing plates using an Sn3.5Ag4Ti(Ce, Ga) filler metal
|
Chang, S.Y.; Chuang, T.H.; Tsao, L.C.; Yang, C.L.; Yang, Z.S. |
| 國立臺灣大學 |
2008 |
Intermetallic Reactions in Reflowed and Aged Sn-58Bi BGA Packages with Au/Ni/Cu Pads
|
Chi, C.C.; Tsao, L.C.; Tsao, C.W.; Chuang, T.H. |
| 國立臺灣大學 |
2008 |
Formation of Whiskers and Hillocks on the Surface of Sn-6.6RE Alloys
|
Chuang, T.H.; Chi, C.C.; Lin, H.J. |
| 國立臺灣大學 |
2008 |
Intermetallic Compounds Formed in Sn-20In-2.8Ag Solder BGA Packages with Ag/Cu Pads
|
Jain, C.C.; Wang, S.S.; Huang, K.W.; Chuang, T.H. |
| 國立臺灣大學 |
2008 |
Intermetallic Reactions in Sn-0.4Co-0.7Cu Solder BGA Packages with an ENIG Surface Finish
|
Chuang, T.H.; Jain, C.C.; Wu, H.M. |
