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"chuang t h"的相關文件
顯示項目 266-275 / 384 (共39頁)
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| 國立臺灣大學 |
2006 |
Mechanical properties of intermetallic compounds on lead-free solder by moir? techniques
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Tsai, Iting; Wu, Enboa; Yen, S. F.; Chuang, T. H. |
| 臺大學術典藏 |
2006 |
Intermetallic reactions in Sn3Ag0.5Cu and Sn3Ag0.5Cu0.06Ni0.01Ge solder BGA packages with Au/Ni surface finishes
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ChuangTH; Cheng, M. D.; Yen, S. F.; Chuang, T. H.; Chuang, T. H.; Yen, S. F.; Cheng, M. D.Chuangth |
| 臺大學術典藏 |
2006 |
Mechanical properties of intermetallic compounds on lead-free solder by Moire techniques
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Tsai, Iting; Wu, Enboa; Yen, S. F.; Chuang, T. H.; TUNG-HAN CHUANG |
| 國立成功大學 |
2004 |
Bioassay-guided isolation and cytotoxicity of phenylpropanoid esters from the stems of Hibiscus taiwanensis
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Wu, P. L.; Chuang, T. H.; He, C. X.; Wu, Tian-Shung |
| 國立臺灣大學 |
2004 |
Reflow and burn-in of a Sn-20In-0.8Cu ball grid array package with a Au/Ni/Cu pad
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Chiang, M. J.; Chang, S. Y.; Chuang, T. H. |
| 國立臺灣大學 |
2004 |
Mechanisms for interfacial reactions between liquid Sn-3.5Ag solders and cu substrates
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Chuang, T. H.; Wu, H. M.; Cheng, M. D.; Chang, S. Y.; Yen, S. F. |
| 國立臺灣大學 |
2004 |
Intermetallic Compounds Formed during the Reflow and Aging of Sn-3.8Ag-0.7Cu and Sn-20In-2Ag-0.5Cu Solder Ball Grid Array Packages
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Cheng, M. D.; Chang, S. Y.; Yen, S. F.; Chuang, T. H. |
| 國立臺灣大學 |
2004 |
Mechanisms for the intermetallic formation during the Sn-20In-2.8Ag/Ni soldering reactions
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Chuang, T. H.; Huang, K. W.; Lin, W. H. |
| 國立臺灣大學 |
2004 |
Morphology and Growth Kinetics of Intermetallics Formed during the Interfacial Reactions of Solder Joints
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Chuang, T.H.; Wu, H.F.; Huang, K.W.; Yen, S.F.; Lin, H.J. |
| 臺大學術典藏 |
2004 |
Mechanisms for interfacial reactions between liquid Sn-3.5Ag solders and cu substrates
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Chuang, T. H.; Wu, H. M.; Cheng, M. D.; Chang, S. Y.; Yen, S. F.; Chuang, T. H.; Wu, H. M.; Cheng, M. D.; Chang, S. Y.; Yen, S. F.; ChuangTH |
顯示項目 266-275 / 384 (共39頁)
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