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Showing items 276-325 of 384 (8 Page(s) Totally)
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Institution	Date	Title	Author
臺大學術典藏	2004	Mechanisms for the intermetallic formation during the Sn-20In-2.8Ag/Ni soldering reactions	ChuangTH; Chuang, T. H.; Huang, K. W.; Lin, W. H.; Chuang, T. H.; Huang, K. W.; Lin, W. H.
臺大學術典藏	2004	Erratum: Intermetallic compounds formed during the reflow and aging of Sn-3.8Ag-0.7Cu and Sn-20ln-2Ag-0.5Cu solder ball grid arrav packaaes(Journal of Electronics Materials (March 2004) 33 (171-180))	Cheng, M.D.; Chang, S.Y.; Yen, S.F.; Chuang, T.H.; TUNG-HAN CHUANG
國立臺灣大學	2003	Morphology and kinetics of discontinuous precipitation and dissolution in an Fe-8.5Al-27Mn-1.0Si-0.92C alloy	Chang, S. Y.; Wang, S. S.; Tsao, L. C.; Chuang, T. H.
國立臺灣大學	2003	Intermetallic Compounds Formed during the Reflow of In-49Sn Solder Ball-Grid-Array Packages	Chuang, T. H.; Chang, S. Y.; Tsao, L. C.; Weng, W. P.; Wu, H. M.
國立臺灣大學	2003	Thin-film reactions during diffusion soldering of Cu/Ti/Si and Au/Cu/Al2O3 with Sn interlayers	Liang, M. W.; Hsieh, T. E.; Chang, S. Y.; Chuang, T. H.
國立臺灣大學	2003	Active soldering of indium tin oxide (ITO) with Cu in air using an Sn3.5Ag4Ti(Ce, Ga) filler	Chang, S. Y.; Tsao, L. C.; Chiang, M. J.; Chuang, T. H.; Tung, C. N.; Pan, G. H.
國立臺灣大學	2003	Joining alumina to inconel 600 and UMCo-50 superalloys using an Sn10Ag4Ti active filler metal	Chang, S. Y.; Hung, Y. T.; Chuang, T. H.
臺大學術典藏	2003	Active soldering of indium tin oxide (ITO) with Cu in air using an Sn3.5Ag4Ti(Ce, Ga) filler	Tung, C.N.; Pan, G.H.; Chuang, T.H.; TUNG-HAN CHUANG; Chiang, M.J.; Tsao, L.C.; Chang, S.Y.
臺大學術典藏	2003	Thin-film reactions during diffusion soldering of Cu/Ti/Si and Au/Cu/Al2O3 with Sn interlayers	Liang, M.W.; Hsieh, T.E.; Chang, S.Y.; Chuang, T.H.; TUNG-HAN CHUANG
國立臺灣大學	2002	Intermetallic Compounds formed during the Soldering Reactions of Eutectic Sn-9Zn with Cu and Ni Substrates	Chan, Y. C.; Chiu, M. Y.; Chuang, T. H.
國立臺灣大學	2002	Effects of zinc additions on the microstructure and melting temperatures of Al–Si–Cu filler metals	Tsao, L. C.; Chiang, M. J.; Lin, W. H.; Cheng, M. D.; Chuang, T. H.
國立臺灣大學	2002	Soldering reactions between In49Sn and Ag thick films	Cheng, M. D.; Wang, S. S.; Chuang, T. H.
國立臺灣大學	2002	Characterization of Intermetallic Compounds formed during the Interfacial Reactions of Liquid Su and Sn-58Bi Solders with Ni Substrates	Chiu, M. Y.; Chang, S. Y.; Tseng, Y. H.; Chan, Y. C.; Chuang, T. H.
國立臺灣大學	2002	Intermetallic compounds formed at the interface between liquid indium and copper substrates	Yu, C. L.; Wang, S. S.; Chuang, T. H.
國立臺灣大學	2002	Intermetallic compounds formed during interfacial reactions between liquid Sn-8Zn-3Bi solders and Ni substrates	Chiu, M. Y.; Wang, S. S.; Chuang, T. H.
國立臺灣大學	2002	Evaluation of the Formability of Plastic/Zn22AI/Plastic Sandwiched Structures by Gas Blowing	Tsao, L. C.; Su, T. L.; Chuang, T. H.
國立臺灣大學	2002	Phase Identification And Growth Kinetics of the Intermetallic Compounds Formed during In-49Sn/Cu Soldering Reactions	Chuang, T. H.; Yu, C. L.; Chang, S. Y.; Wang, S. S.
國立臺灣大學	2002	Corrosion behaviors of Al-Si-Cu-based filler metals and 6061-T6 brazements	Su, T. L.; Wang, S. S.; Tsao, L. C.; Chang, S. Y.; Chuang, T. H.; Yeh, M. S.
國立臺灣大學	2002	Brazeability of a 3003 Aluminum alloy with Al-Si-Cu-based filler metals	Tsao, L. C.; Weng, W. P.; Cheng, M. D.; Tsao, C. W.; Chuang, T. H.
國立臺灣大學	2002	Morphology and growth kinetics of Ag3Sn during soldering reaction between liquid Sn and an Ag substrate	Su, T. L.; Tsao, L. C.; Chang, S. Y.; Chuang, T. H.
國立臺灣大學	2002	Interfacial reactions of liquid Sn and Sn-3.5Ag solders with Ag thick films	Su, T. L.; Tsao, L. C.; Chang, S. Y.; Chuang, T. H.
國立臺灣大學	2002	Interfacial Reaction between Liquid Sn-20In-2.8Ag Solder and Ag Substrate	Chiang, M. J.; Chuang, T. H.
臺大學術典藏	2002	Phase Identification And Growth Kinetics of the Intermetallic Compounds Formed during In-49Sn/Cu Soldering Reactions	ChuangTH; Wang, S. S.; Chang, S. Y.; Yu, C. L.; Chuang, T. H.; Yu, C. L.; Chang, S. Y.; Wang, S. S.; Chuang, T. H.
臺大學術典藏	2002	Characterization of intermetallic compounds formed during the interfacial reactions of liquid Sn and Sn-58Bi solders with Ni substrates	Tseng, Y.H.; Chan, Y.C.; Chuang, T.H.; TUNG-HAN CHUANG; Chiu, M.Y.; Chang, S.Y.
國立臺灣大學	2001	Corrosion behavior of Al–Si–Cu–(Sn, Zn) brazing filler metals	Wang, S. S.; Cheng, M. D.; Tsao, L. C.; Chuang, T. H.
國立臺灣大學	2001	AgIn2/Ag2In transformations in an In-49Sn/Ag soldered joint	Chuang, T. H.; Huang, Y. T.; Tsao, L. C.
國立臺灣大學	2001	Evaluation of Superplastic Formability of the AZ31, Magnesium Alloy	Tsao, L. C.; Wu, C. F.; Chuang, T. H.
國立臺灣大學	2001	Surface Self-Cleaning Effect of Zn-22 Alloy during Superplastic Deformation	Chuang, T. H.; Tsao, L. C.
國立臺灣大學	2001	Brazeability of the 6061-T6 Aluminum Alloy with Al-Si-20Cu Based Filler Metals	Tsao, L. C.; Tsai, T. C.; Wu, C. S.; Chuang, T. H.
國立臺灣大學	2001	The Ultra-High Rate Superplastic Forming of a Zn-22Al Thin Sheet Material	Tsao, L. C.; Wang, S. S.; Yang, C. F.; Chuang, T. H.
臺大學術典藏	2001	AgIn2/Ag2In transformations in an In-49Sn/Ag soldered joint	ChuangTH; Huang, Y. T.; Tsao, L. C.; Chuang, T. H.; Chuang, T. H.; Huang, Y. T.; Tsao, L. C.
國立臺灣大學	2000	Characterization of alumina ceramics by ultrasonic testing	Chang, L. -S.; Chuang, T. -H.; Wei, W. J.
國立臺灣大學	2000	Brazing of zirconia with AgCuTi and SnAgTi active filler metals	Chuang, T. H.; Yeh, M. S.; Chai, Y. H.
國立臺灣大學	2000	Plastic flow behavior during the forging of a 6061 Al/10 vol pct Al2O3 ( p ) composite	Yeh, M. S.; Weng, W. P.; Wang, S. C.; Chuang, T. H.
國立臺灣大學	2000	Interfacial reactions between liquid indium and Au-deposited substrates	Liu, Y. M.; Chuang, T. H.
國立臺灣大學	2000	Temperature Effects on the Erosion of Aluminum Alloy	Fang, C. K.; Chuang, T. H.
國立臺灣大學	2000	Diffusion bonding of a superplastic inconel 718SPF superalloy by electroless nickel plating	Yeh, M. S.; Chang, C. B.; Chuang, T. H.
國立臺灣大學	2000	Evaluation of Low Temperature Superplastic Formability for Zn-22Ae Thin Sheets	Tsao, L. C.; Yeh, M. S.; Lo, C. J.; Wu, F. C.; Chuang, T. H.
國立臺灣大學	2000	Development of a low-melting-point filler metal for brazing aluminum alloys	Chuang, T. H.; Tsao, L. C.; Tsai, T. C.; Yeh, M. S.; Wu, C. S.
國立臺灣大學	2000	Interfacial Reactions between In10Ag Solders and Ag Substrates	Liu, Y. M.; Chuang, T. H.
國立臺灣大學	2000	Interfacial Reactions between Liquid Indium and Silver Substrates	Liu, Y. M.; Chen, Y. L.; Chuang, T. H.
國立臺灣大學	2000	Effects of Microstructures on Corrosion and Stress Corrosion Behaviors of an Al-12.1 at.% Zn Alloy	Yeh, M. S.; Tsao, L. C.; Chuang, T. H.
國立臺灣大學	2000	The Degradation of Corrosion Resistance for Al 5083 Alloy after Thermal and Superplastic Forming Processes	Chang, J. C.; Chuang, T. H.
國立臺灣大學	2000	Interfacial Reactions between Liquid In48Sn Solders and Ag Substrates	Huang, Y. T.; Chuang, T. H.
臺大學術典藏	2000	Brazing of zirconia with AgCuTi and SnAgTi active filler metals	Chuang, T. H.; Yeh, M. S.; Chai, Y. H.; Chuang, T. H.; Yeh, M. S.; Chai, Y. H.; ChuangTH
臺大學術典藏	2000	Development of a low-melting-point filler metal for brazing aluminum alloys	Chuang, T. H.; Tsao, L. C.; Tsai, T. C.; Yeh, M. S.; Wu, C. S.; ChuangTH; Chuang, T. H.; Tsao, L. C.; Tsai, T. C.; Yeh, M. S.; Wu, C. S.
臺大學術典藏	2000	Diffusion bonding of a superplastic Inconel 718SPF superalloy by electroless nickel plating	TUNG-HAN CHUANG; Chuang, T.H.; Chang, C.B.; Yeh, M.S.
國立臺灣大學	1999	Recent Research and Development Activities on superplasticity in Taiwan	Huang, J. C.; Chuang, T. H.
國立臺灣大學	1999	Evaluation of Superplastic Formability for a 5083 Al-Mg alloy	Tseng, Y. H.; Chuang, T. H.
國立臺灣大學	1999	Progress on superplasticity and superplastic forming in Taiwan during 1987–1997	Huang, J. C.; Chuang, T. H.

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