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"chuang t h"的相關文件
顯示項目 291-300 / 384 (共39頁)
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| 國立臺灣大學 |
2002 |
Evaluation of the Formability of Plastic/Zn22AI/Plastic Sandwiched Structures by Gas Blowing
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Tsao, L. C.; Su, T. L.; Chuang, T. H. |
| 國立臺灣大學 |
2002 |
Phase Identification And Growth Kinetics of the Intermetallic Compounds Formed during In-49Sn/Cu Soldering Reactions
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Chuang, T. H.; Yu, C. L.; Chang, S. Y.; Wang, S. S. |
| 國立臺灣大學 |
2002 |
Corrosion behaviors of Al-Si-Cu-based filler metals and 6061-T6 brazements
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Su, T. L.; Wang, S. S.; Tsao, L. C.; Chang, S. Y.; Chuang, T. H.; Yeh, M. S. |
| 國立臺灣大學 |
2002 |
Brazeability of a 3003 Aluminum alloy with Al-Si-Cu-based filler metals
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Tsao, L. C.; Weng, W. P.; Cheng, M. D.; Tsao, C. W.; Chuang, T. H. |
| 國立臺灣大學 |
2002 |
Morphology and growth kinetics of Ag3Sn during soldering reaction between liquid Sn and an Ag substrate
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Su, T. L.; Tsao, L. C.; Chang, S. Y.; Chuang, T. H. |
| 國立臺灣大學 |
2002 |
Interfacial reactions of liquid Sn and Sn-3.5Ag solders with Ag thick films
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Su, T. L.; Tsao, L. C.; Chang, S. Y.; Chuang, T. H. |
| 國立臺灣大學 |
2002 |
Interfacial Reaction between Liquid Sn-20In-2.8Ag Solder and Ag Substrate
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Chiang, M. J.; Chuang, T. H. |
| 臺大學術典藏 |
2002 |
Phase Identification And Growth Kinetics of the Intermetallic Compounds Formed during In-49Sn/Cu Soldering Reactions
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ChuangTH; Wang, S. S.; Chang, S. Y.; Yu, C. L.; Chuang, T. H.; Yu, C. L.; Chang, S. Y.; Wang, S. S.; Chuang, T. H. |
| 臺大學術典藏 |
2002 |
Characterization of intermetallic compounds formed during the interfacial reactions of liquid Sn and Sn-58Bi solders with Ni substrates
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Tseng, Y.H.; Chan, Y.C.; Chuang, T.H.; TUNG-HAN CHUANG; Chiu, M.Y.; Chang, S.Y. |
| 國立臺灣大學 |
2001 |
Corrosion behavior of Al–Si–Cu–(Sn, Zn) brazing filler metals
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Wang, S. S.; Cheng, M. D.; Tsao, L. C.; Chuang, T. H. |
顯示項目 291-300 / 384 (共39頁)
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