| 淡江大學 |
2021-02-28 |
The structures and thermoelectric properties of Zn-Sb alloy films fabricated by electron beam evaporation through an ion beam assisted deposition
|
Hsu, Shih-Chieh;Hong, Jhen-Yong;Chen, Cheng-Lung;Chen, Sheng-Chi;Zhen, Jia-Han;Hsieh, Wen-Pin;Chen, Yang-Yuan;Chuang, Tung-Han |
| 淡江大學 |
2020-03-26 |
Study on thermoelectric property optimization of mixed-phase bismuth telluride thin films deposited by co-evaporation process
|
Wu, Yen-Ju;Hsu, Shih-Chieh;Lin, Ya-Cheng;Xu, Yibin;Chuang, Tung-Han;Chen, Sheng-Chi |
| 臺大學術典藏 |
2018-09-10T06:58:27Z |
Research on the Superplastic Forming (SPF) and Diffusion Bonding (DB) of aerospace materials
|
Chuang, Tung-Han; Cheng, Jung-Ho; Wang, Wen-Hsiung; Yang, Chih-Fu; Koo, Chun-Hao; JUNG-HO CHENG |
| 臺大學術典藏 |
2018-06-28T22:11:31Z |
Intermetallic reactions in a Sn-20In-2.8Ag solder ball-grid-array package with Au/Ni/Cu pads
|
Wu, Hui-Min; Wu, Feng-Chih; Chuang, Tung-Han; Wu, Hui-Min; Wu, Feng-Chih; Chuang, Tung-Han |
| 大葉大學 |
2017-03 |
Characterization and crystallization kinetics of sputtered NiSi thin films for blue laser optical recording application
|
Ou, Sin-Liang;Chen, Sheng-Chi;Lin, Yan-Cheng;Lin, Po-Chun;Wen, Chao-Kuang;Chuang, Tung-Han |
| 國立臺灣大學 |
2012 |
Reliable Microjoints Formed by Solid-Liquid Interdiffusion (SLID) Bonding Within a Chip-Stacking Architecture
|
Chang, Jing-Yao; Cheng, Ren-Shin; Kao, Kuo-Shu; Chang, Tao-Chih; Chuang, Tung-Han |
| 臺大學術典藏 |
2012 |
Reliable Microjoints Formed by Solid-Liquid Interdiffusion (SLID) Bonding Within a Chip-Stacking Architecture
|
Chang, Jing-Yao; Cheng, Ren-Shin; Kao, Kuo-Shu; Chang, Tao-Chih; Chuang, Tung-Han; Chang, Jing-Yao; Cheng, Ren-Shin; Kao, Kuo-Shu; Chang, Tao-Chih; Chuang, Tung-Han |
| 國立臺灣大學 |
2011 |
Morphology of the Tin Whiskers on the Surface of a Sn-3Ag-0.5Cu-0.5Nd Alloy
|
Chuang, Tung-Han; Jain, Chao-Chi |
| 國立臺灣大學 |
2011 |
Interfacial microstructure and bonding strength of Sn-3Ag-0.5Cu and Sn-3Ag-0.5Cu-0.5Ce-xZn solder BGA packages with immersion Ag surface finish
|
Lin, Hsiu-Jen; Chuang, Tung-Han |
| 國立臺灣大學 |
2011 |
Effects of Ce Addition on the Microstructure and Mechanical Properties of Sn-58Bi Solder Joints
|
Chuang, Tung-Han; Wu, Hsing-Fei |
| 臺大學術典藏 |
2011 |
Morphology of the Tin Whiskers on the Surface of a Sn-3Ag-0.5Cu-0.5Nd Alloy
|
Chuang, Tung-Han; Jain, Chao-Chi; Chuang, Tung-Han; Jain, Chao-Chi |
| 臺大學術典藏 |
2011 |
Interfacial microstructure and bonding strength of Sn-3Ag-0.5Cu and Sn-3Ag-0.5Cu-0.5Ce-xZn solder BGA packages with immersion Ag surface finish
|
Chuang, Tung-Han; Lin, Hsiu-Jen; Lin, Hsiu-Jen; Chuang, Tung-Han |
| 臺大學術典藏 |
2011 |
Effects of Ce Addition on the Microstructure and Mechanical Properties of Sn-58Bi Solder Joints
|
Wu, Hsing-Fei; Chuang, Tung-Han; Chuang, Tung-Han; Wu, Hsing-Fei |
| 國立臺灣大學 |
2010 |
Effects of Ce and Zn additions on the microstructure and mechanical properties of Sn-3Ag-0.5Cu solder joints
|
Lin, Hsiu-Jen; Chuang, Tung-Han |
| 國立臺灣大學 |
2010 |
The effect of 0.5 wt.% Ce additions on the electromigration of Sn9Zn BGA solder packages with Au/Ni(P)/Cu and Ag/Cu pads
|
Lin, Hsiu-Jen; Chuang, Tung-Han |
| 國立臺灣大學 |
2010 |
Effect of La addition on the interfacial intermetallics and bonding strengths of Sn-58Bi solder joints with Au/Ni/Cu pads
|
Shiue, Yu-Yun; Chuang, Tung-Han |
| 國立臺灣大學 |
2010 |
Effects of Ce and La Additions on the Microstructure and Mechanical Properties of Sn-9Zn Solder Joints
|
Lin, Hsiu-Jen; Chuang, Tung-Han |
| 臺大學術典藏 |
2010 |
Effects of Ce and Zn additions on the microstructure and mechanical properties of Sn-3Ag-0.5Cu solder joints
|
Chuang, Tung-Han; Lin, Hsiu-Jen; Lin, Hsiu-Jen; Chuang, Tung-Han |
| 臺大學術典藏 |
2010 |
The effect of 0.5 wt.% Ce additions on the electromigration of Sn9Zn BGA solder packages with Au/Ni(P)/Cu and Ag/Cu pads
|
Chuang, Tung-Han; Lin, Hsiu-Jen; Lin, Hsiu-Jen; Chuang, Tung-Han |
| 臺大學術典藏 |
2010 |
Effect of La addition on the interfacial intermetallics and bonding strengths of Sn-58Bi solder joints with Au/Ni/Cu pads
|
Chuang, Tung-Han; Shiue, Yu-Yun; Shiue, Yu-Yun; Chuang, Tung-Han |
| 臺大學術典藏 |
2010 |
Effects of Ce and La Additions on the Microstructure and Mechanical Properties of Sn-9Zn Solder Joints
|
Chuang, Tung-Han; Lin, Hsiu-Jen; Lin, Hsiu-Jen; Chuang, Tung-Han |
| 臺大學術典藏 |
2009-01-06T01:29:50Z |
Abnormal growth of tin whiskers in a Sn3Ag0.5Cu0.5Ce solder ball grid array package
|
Yen, Shiu-Fang; Chuang, Tung-Han; Chuang, Tung-Han; Yen, Shiu-Fang |
| 臺大學術典藏 |
2009-01-06T01:29:28Z |
Intermetallic compounds formed during diffusion soldering of Au/Cu/Al2O3 and Cu/Ti/Si with Sn/In interlayer
|
Tsao, Cheng-Wen; Chuang, Tung-Han; Lin, Hsiu-Jen; Chuang, Tung-Han; Lin, Hsiu-Jen; Tsao, Cheng-Wen |
| 臺大學術典藏 |
2009-01-06T01:28:22Z |
Intermetallic reactions in Sn-3.5Ag solder ball grid array packages with Ag/Cu and Au/Ni/Cu pads
|
Chuang, Tung-Han; Chi, Chih-Chien; Chi, Chih-Chien; Chuang, Tung-Han |
| 臺大學術典藏 |
2009-01-06T01:25:25Z |
Selective formation of intermetallic compounds in Sn-20In-0.8Cu ball grid array solder joints with Au/Ni surface finishes
|
Chuang, Tung-Han; Chiang, Ming-Jui; Wu, Hsing-Fei; Wu, Hsing-Fei; Chiang, Ming-Jui; Chuang, Tung-Han |
