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Taiwan Academic Institutional Repository >
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"chuang tung han"
Showing items 1-10 of 74 (8 Page(s) Totally)
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| 淡江大學 |
2021-02-28 |
The structures and thermoelectric properties of Zn-Sb alloy films fabricated by electron beam evaporation through an ion beam assisted deposition
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Hsu, Shih-Chieh;Hong, Jhen-Yong;Chen, Cheng-Lung;Chen, Sheng-Chi;Zhen, Jia-Han;Hsieh, Wen-Pin;Chen, Yang-Yuan;Chuang, Tung-Han |
| 淡江大學 |
2020-03-26 |
Study on thermoelectric property optimization of mixed-phase bismuth telluride thin films deposited by co-evaporation process
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Wu, Yen-Ju;Hsu, Shih-Chieh;Lin, Ya-Cheng;Xu, Yibin;Chuang, Tung-Han;Chen, Sheng-Chi |
| 臺大學術典藏 |
2018-09-10T06:58:27Z |
Research on the Superplastic Forming (SPF) and Diffusion Bonding (DB) of aerospace materials
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Chuang, Tung-Han; Cheng, Jung-Ho; Wang, Wen-Hsiung; Yang, Chih-Fu; Koo, Chun-Hao; JUNG-HO CHENG |
| 臺大學術典藏 |
2018-06-28T22:11:31Z |
Intermetallic reactions in a Sn-20In-2.8Ag solder ball-grid-array package with Au/Ni/Cu pads
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Wu, Hui-Min; Wu, Feng-Chih; Chuang, Tung-Han; Wu, Hui-Min; Wu, Feng-Chih; Chuang, Tung-Han |
| 大葉大學 |
2017-03 |
Characterization and crystallization kinetics of sputtered NiSi thin films for blue laser optical recording application
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Ou, Sin-Liang;Chen, Sheng-Chi;Lin, Yan-Cheng;Lin, Po-Chun;Wen, Chao-Kuang;Chuang, Tung-Han |
| 國立臺灣大學 |
2012 |
Reliable Microjoints Formed by Solid-Liquid Interdiffusion (SLID) Bonding Within a Chip-Stacking Architecture
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Chang, Jing-Yao; Cheng, Ren-Shin; Kao, Kuo-Shu; Chang, Tao-Chih; Chuang, Tung-Han |
| 臺大學術典藏 |
2012 |
Reliable Microjoints Formed by Solid-Liquid Interdiffusion (SLID) Bonding Within a Chip-Stacking Architecture
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Chang, Jing-Yao; Cheng, Ren-Shin; Kao, Kuo-Shu; Chang, Tao-Chih; Chuang, Tung-Han; Chang, Jing-Yao; Cheng, Ren-Shin; Kao, Kuo-Shu; Chang, Tao-Chih; Chuang, Tung-Han |
| 國立臺灣大學 |
2011 |
Morphology of the Tin Whiskers on the Surface of a Sn-3Ag-0.5Cu-0.5Nd Alloy
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Chuang, Tung-Han; Jain, Chao-Chi |
| 國立臺灣大學 |
2011 |
Interfacial microstructure and bonding strength of Sn-3Ag-0.5Cu and Sn-3Ag-0.5Cu-0.5Ce-xZn solder BGA packages with immersion Ag surface finish
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Lin, Hsiu-Jen; Chuang, Tung-Han |
| 國立臺灣大學 |
2011 |
Effects of Ce Addition on the Microstructure and Mechanical Properties of Sn-58Bi Solder Joints
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Chuang, Tung-Han; Wu, Hsing-Fei |
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