|
English
|
正體中文
|
简体中文
|
Total items :0
|
|
Visitors :
51925832
Online Users :
904
Project Commissioned by the Ministry of Education
Project Executed by National Taiwan University Library
|
|
|
|
Taiwan Academic Institutional Repository >
Browse by Author
|
"chuang tung han"
Showing items 11-20 of 74 (8 Page(s) Totally)
<< < 1 2 3 4 5 6 7 8 > >>
View [10|25|50] records per page
| 臺大學術典藏 |
2011 |
Morphology of the Tin Whiskers on the Surface of a Sn-3Ag-0.5Cu-0.5Nd Alloy
|
Chuang, Tung-Han; Jain, Chao-Chi; Chuang, Tung-Han; Jain, Chao-Chi |
| 臺大學術典藏 |
2011 |
Interfacial microstructure and bonding strength of Sn-3Ag-0.5Cu and Sn-3Ag-0.5Cu-0.5Ce-xZn solder BGA packages with immersion Ag surface finish
|
Chuang, Tung-Han; Lin, Hsiu-Jen; Lin, Hsiu-Jen; Chuang, Tung-Han |
| 臺大學術典藏 |
2011 |
Effects of Ce Addition on the Microstructure and Mechanical Properties of Sn-58Bi Solder Joints
|
Wu, Hsing-Fei; Chuang, Tung-Han; Chuang, Tung-Han; Wu, Hsing-Fei |
| 國立臺灣大學 |
2010 |
Effects of Ce and Zn additions on the microstructure and mechanical properties of Sn-3Ag-0.5Cu solder joints
|
Lin, Hsiu-Jen; Chuang, Tung-Han |
| 國立臺灣大學 |
2010 |
The effect of 0.5 wt.% Ce additions on the electromigration of Sn9Zn BGA solder packages with Au/Ni(P)/Cu and Ag/Cu pads
|
Lin, Hsiu-Jen; Chuang, Tung-Han |
| 國立臺灣大學 |
2010 |
Effect of La addition on the interfacial intermetallics and bonding strengths of Sn-58Bi solder joints with Au/Ni/Cu pads
|
Shiue, Yu-Yun; Chuang, Tung-Han |
| 國立臺灣大學 |
2010 |
Effects of Ce and La Additions on the Microstructure and Mechanical Properties of Sn-9Zn Solder Joints
|
Lin, Hsiu-Jen; Chuang, Tung-Han |
| 臺大學術典藏 |
2010 |
Effects of Ce and Zn additions on the microstructure and mechanical properties of Sn-3Ag-0.5Cu solder joints
|
Chuang, Tung-Han; Lin, Hsiu-Jen; Lin, Hsiu-Jen; Chuang, Tung-Han |
| 臺大學術典藏 |
2010 |
The effect of 0.5 wt.% Ce additions on the electromigration of Sn9Zn BGA solder packages with Au/Ni(P)/Cu and Ag/Cu pads
|
Chuang, Tung-Han; Lin, Hsiu-Jen; Lin, Hsiu-Jen; Chuang, Tung-Han |
| 臺大學術典藏 |
2010 |
Effect of La addition on the interfacial intermetallics and bonding strengths of Sn-58Bi solder joints with Au/Ni/Cu pads
|
Chuang, Tung-Han; Shiue, Yu-Yun; Shiue, Yu-Yun; Chuang, Tung-Han |
Showing items 11-20 of 74 (8 Page(s) Totally)
<< < 1 2 3 4 5 6 7 8 > >>
View [10|25|50] records per page
|
