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Showing items 16-25 of 74  (8 Page(s) Totally)
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Institution Date Title Author
國立臺灣大學 2010 Effect of La addition on the interfacial intermetallics and bonding strengths of Sn-58Bi solder joints with Au/Ni/Cu pads Shiue, Yu-Yun; Chuang, Tung-Han
國立臺灣大學 2010 Effects of Ce and La Additions on the Microstructure and Mechanical Properties of Sn-9Zn Solder Joints Lin, Hsiu-Jen; Chuang, Tung-Han
臺大學術典藏 2010 Effects of Ce and Zn additions on the microstructure and mechanical properties of Sn-3Ag-0.5Cu solder joints Chuang, Tung-Han; Lin, Hsiu-Jen; Lin, Hsiu-Jen; Chuang, Tung-Han
臺大學術典藏 2010 The effect of 0.5 wt.% Ce additions on the electromigration of Sn9Zn BGA solder packages with Au/Ni(P)/Cu and Ag/Cu pads Chuang, Tung-Han; Lin, Hsiu-Jen; Lin, Hsiu-Jen; Chuang, Tung-Han
臺大學術典藏 2010 Effect of La addition on the interfacial intermetallics and bonding strengths of Sn-58Bi solder joints with Au/Ni/Cu pads Chuang, Tung-Han; Shiue, Yu-Yun; Shiue, Yu-Yun; Chuang, Tung-Han
臺大學術典藏 2010 Effects of Ce and La Additions on the Microstructure and Mechanical Properties of Sn-9Zn Solder Joints Chuang, Tung-Han; Lin, Hsiu-Jen; Lin, Hsiu-Jen; Chuang, Tung-Han
臺大學術典藏 2009-01-06T01:29:50Z Abnormal growth of tin whiskers in a Sn3Ag0.5Cu0.5Ce solder ball grid array package Yen, Shiu-Fang; Chuang, Tung-Han; Chuang, Tung-Han; Yen, Shiu-Fang
臺大學術典藏 2009-01-06T01:29:28Z Intermetallic compounds formed during diffusion soldering of Au/Cu/Al2O3 and Cu/Ti/Si with Sn/In interlayer Tsao, Cheng-Wen; Chuang, Tung-Han; Lin, Hsiu-Jen; Chuang, Tung-Han; Lin, Hsiu-Jen; Tsao, Cheng-Wen
臺大學術典藏 2009-01-06T01:28:22Z Intermetallic reactions in Sn-3.5Ag solder ball grid array packages with Ag/Cu and Au/Ni/Cu pads Chuang, Tung-Han; Chi, Chih-Chien; Chi, Chih-Chien; Chuang, Tung-Han
臺大學術典藏 2009-01-06T01:25:25Z Selective formation of intermetallic compounds in Sn-20In-0.8Cu ball grid array solder joints with Au/Ni surface finishes Chuang, Tung-Han; Chiang, Ming-Jui; Wu, Hsing-Fei; Wu, Hsing-Fei; Chiang, Ming-Jui; Chuang, Tung-Han

Showing items 16-25 of 74  (8 Page(s) Totally)
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