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Taiwan Academic Institutional Repository >
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"chuang tung han"
Showing items 26-35 of 74 (8 Page(s) Totally)
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| 國立臺灣大學 |
2008 |
Low Temperature Direct Electroless Nickel Plating on Silicon Wafer
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Jain, Chao-Chi; Wang, Shiuan-Sheng; Chuang, Tung-Han; Yang, Sang-Ray |
| 國立臺灣大學 |
2008 |
Focused-Ion-Beam-Based Selective Closing and Opening of Anodic Alumina Nanochannels for the Growth of Nanowire Arrays Comprising Multiple Elements
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Liu, Nai-Wei; Liu, Chih-Yi; Wang, Huai-Hsien; Hsu, Chen-Feng; Lai, Ming-Yu; Chuang, Tung-Han; Wang, Yuh-Lin |
| 國立臺灣大學 |
2008 |
Intermetallic Reactions in a Sn-51In Solder BGA Package with immersion Ag Surface Finish
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Jain, Chao-Chi; Wang, Shiuan-Sheng; Wu, Hui-Min; Chuang, Tung-Han |
| 臺大學術典藏 |
2008 |
Low Temperature Direct Electroless Nickel Plating on Silicon Wafer
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Jain, Chao-Chi; Wang, Shiuan-Sheng; Chuang, Tung-Han; Yang, Sang-Ray; Jain, Chao-Chi; Wang, Shiuan-Sheng; Chuang, Tung-Han; Yang, Sang-Ray |
| 臺大學術典藏 |
2008 |
Focused-Ion-Beam-Based Selective Closing and Opening of Anodic Alumina Nanochannels for the Growth of Nanowire Arrays Comprising Multiple Elements
|
Wang, Yuh-Lin; Chuang, Tung-Han; Lai, Ming-Yu; Hsu, Chen-Feng; Wang, Huai-Hsien; Liu, Chih-Yi; Liu, Nai-Wei; Liu, Nai-Wei; Liu, Chih-Yi; Wang, Huai-Hsien; Hsu, Chen-Feng; Lai, Ming-Yu; Chuang, Tung-Han; Wang, Yuh-Lin |
| 臺大學術典藏 |
2008 |
Intermetallic Reactions in a Sn-51In Solder BGA Package with immersion Ag Surface Finish
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Chuang, Tung-Han; Wu, Hui-Min; Jain, Chao-Chi; Wang, Shiuan-Sheng; Jain, Chao-Chi; Wang, Shiuan-Sheng; Wu, Hui-Min; Chuang, Tung-Han |
| 國立臺灣大學 |
2007 |
Temperature Effects on the Whiskers in Rare-Earth Doped Sn-3Ag-0.5Cu-0.5Ce Solder Joints
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Chuang, Tung-Han |
| 國立臺灣大學 |
2007 |
Oxidation-Induced Whisker Growth on the Surface of Sn-6.6(La, Ce) Alloy
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Chuang, Tung-Han; Lin, Hsiu-Jen; Chi, Chih-Chien |
| 國立臺灣大學 |
2006 |
Rapid whisker growth on the surface of Sn–3Ag–0.5Cu–1.0Ce solder joints
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Chuang, Tung-Han |
| 國立臺灣大學 |
2006 |
Intermetallic reactions in Sn-8Zn-20In solder ball grid array packages with Au/Ni/Cu and Ag/Cu pads
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Liu, Yu-Chih; Lin, Wei-Hong; Lin, Hsiu-Jen; Chuang, Tung-Han |
Showing items 26-35 of 74 (8 Page(s) Totally)
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