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"chuang tung han"
Showing items 36-45 of 74 (8 Page(s) Totally)
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| 國立臺灣大學 |
2006 |
Intermetallic reactions in reflowed and aged Sn-9Zn solder ball grid array packages with Au/Ni/Cu and Ag/Cu pads
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Lin, Hsiu-Jen; Chuang, Tung-Han |
| 國立臺灣大學 |
2006 |
Intermetallic formation in Sn3Ag0.5Cu and Sn3Ag0.5Cu0.06Ni0.01Ge solder BGA packages with immersion Ag surface finish
|
Chuang, Tung-Han; Yen, Shiu-Fang; Wu, Hui-Min |
| 國立臺灣大學 |
2006 |
Intermetallic reactions in Sn-3.5Ag solder ball grid array packages with Ag/Cu and Au/Ni/Cu pads
|
Chi, Chih-Chien; Chuang, Tung-Han |
| 國立臺灣大學 |
2006 |
Intermetallic compounds formed during diffusion soldering of Au/Cu/Al2O3 and Cu/Ti/Si with Sn/In interlayer
|
Chuang, Tung-Han; Lin, Hsiu-Jen; Tsao, Cheng-Wen |
| 國立臺灣大學 |
2006 |
Abnormal growth of tin whiskers in a Sn3Ag0.5Cu0.5Ce solder ball grid array package
|
Chuang, Tung-Han; Yen, Shiu-Fang |
| 臺大學術典藏 |
2006 |
Rapid whisker growth on the surface of Sn–3Ag–0.5Cu–1.0Ce solder joints
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Chuang, Tung-Han; Chuang, Tung-Han |
| 臺大學術典藏 |
2006 |
Intermetallic reactions in Sn-8Zn-20In solder ball grid array packages with Au/Ni/Cu and Ag/Cu pads
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Liu, Yu-Chih; Lin, Wei-Hong; Lin, Hsiu-Jen; Chuang, Tung-Han; Liu, Yu-Chih; Lin, Wei-Hong; Lin, Hsiu-Jen; Chuang, Tung-Han |
| 臺大學術典藏 |
2006 |
Intermetallic formation in Sn3Ag0.5Cu and Sn3Ag0.5Cu0.06Ni0.01Ge solder BGA packages with immersion Ag surface finish
|
Chuang, Tung-Han; Yen, Shiu-Fang; Wu, Hui-Min; Chuang, Tung-Han; Yen, Shiu-Fang; Wu, Hui-Min |
| 國立臺灣大學 |
2005 |
Intermetallic reactions in a Sn-20In-2.8Ag solder ball-grid-array package with Au/Ni/Cu pads
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Wu, Hui-Min; Wu, Feng-Chih; Chuang, Tung-Han |
| 國立臺灣大學 |
2004 |
Selective formation of intermetallic compounds in Sn-20In-0.8Cu ball grid array solder joints with Au/Ni surface finishes
|
Wu, Hsing-Fei; Chiang, Ming-Jui; Chuang, Tung-Han |
Showing items 36-45 of 74 (8 Page(s) Totally)
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