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"chuang tung han"的相关文件
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| 臺大學術典藏 |
2006 |
Rapid whisker growth on the surface of Sn–3Ag–0.5Cu–1.0Ce solder joints
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Chuang, Tung-Han; Chuang, Tung-Han |
| 臺大學術典藏 |
2006 |
Intermetallic reactions in Sn-8Zn-20In solder ball grid array packages with Au/Ni/Cu and Ag/Cu pads
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Liu, Yu-Chih; Lin, Wei-Hong; Lin, Hsiu-Jen; Chuang, Tung-Han; Liu, Yu-Chih; Lin, Wei-Hong; Lin, Hsiu-Jen; Chuang, Tung-Han |
| 臺大學術典藏 |
2006 |
Intermetallic formation in Sn3Ag0.5Cu and Sn3Ag0.5Cu0.06Ni0.01Ge solder BGA packages with immersion Ag surface finish
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Chuang, Tung-Han; Yen, Shiu-Fang; Wu, Hui-Min; Chuang, Tung-Han; Yen, Shiu-Fang; Wu, Hui-Min |
| 國立臺灣大學 |
2005 |
Intermetallic reactions in a Sn-20In-2.8Ag solder ball-grid-array package with Au/Ni/Cu pads
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Wu, Hui-Min; Wu, Feng-Chih; Chuang, Tung-Han |
| 國立臺灣大學 |
2004 |
Selective formation of intermetallic compounds in Sn-20In-0.8Cu ball grid array solder joints with Au/Ni surface finishes
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Wu, Hsing-Fei; Chiang, Ming-Jui; Chuang, Tung-Han |
| 國立臺灣大學 |
2000 |
Erosion- and wear-corrosion behavior of Fe–Mn–Al alloys in NaCl solution
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Huang, Her-Hsiung; Chuang, Tung-Han |
| 臺大學術典藏 |
2000 |
Erosion- and wear-corrosion behavior of Fe–Mn–Al alloys in NaCl solution
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Huang, Her-Hsiung; Chuang, Tung-Han; Huang, Her-Hsiung; Chuang, Tung-Han |
| 淡江大學 |
1998-05-05 |
Process and apparatus for manufacturing aluminum laminally filled plastic pellets for shielding electromagnetic interference
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Chuang, Tung-han; 林清彬; Lin, Ching-bin; Tsai, Teng-chun; Chang, Jiin-chyuan |
| 國立臺灣大學 |
1998 |
Discontinuous coarsening of discontinuous precipitates in a Co–6 at.% Mo alloy
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Lee, Shiu-Li; Lee, Kuan-Ching; Chuang, Tung-Han |
| 臺大學術典藏 |
1998 |
Discontinuous coarsening of discontinuous precipitates in a Co–6 at.% Mo alloy
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Lee, Shiu-Li; Lee, Kuan-Ching; Chuang, Tung-Han; Lee, Shiu-Li; Lee, Kuan-Ching; Chuang, Tung-Han |
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