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教育部委託研究計畫 計畫執行:國立臺灣大學圖書館
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"chuang tung han"的相關文件
顯示項目 31-40 / 74 (共8頁)
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| 臺大學術典藏 |
2008 |
Intermetallic Reactions in a Sn-51In Solder BGA Package with immersion Ag Surface Finish
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Chuang, Tung-Han; Wu, Hui-Min; Jain, Chao-Chi; Wang, Shiuan-Sheng; Jain, Chao-Chi; Wang, Shiuan-Sheng; Wu, Hui-Min; Chuang, Tung-Han |
| 國立臺灣大學 |
2007 |
Temperature Effects on the Whiskers in Rare-Earth Doped Sn-3Ag-0.5Cu-0.5Ce Solder Joints
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Chuang, Tung-Han |
| 國立臺灣大學 |
2007 |
Oxidation-Induced Whisker Growth on the Surface of Sn-6.6(La, Ce) Alloy
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Chuang, Tung-Han; Lin, Hsiu-Jen; Chi, Chih-Chien |
| 國立臺灣大學 |
2006 |
Rapid whisker growth on the surface of Sn–3Ag–0.5Cu–1.0Ce solder joints
|
Chuang, Tung-Han |
| 國立臺灣大學 |
2006 |
Intermetallic reactions in Sn-8Zn-20In solder ball grid array packages with Au/Ni/Cu and Ag/Cu pads
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Liu, Yu-Chih; Lin, Wei-Hong; Lin, Hsiu-Jen; Chuang, Tung-Han |
| 國立臺灣大學 |
2006 |
Intermetallic reactions in reflowed and aged Sn-9Zn solder ball grid array packages with Au/Ni/Cu and Ag/Cu pads
|
Lin, Hsiu-Jen; Chuang, Tung-Han |
| 國立臺灣大學 |
2006 |
Intermetallic formation in Sn3Ag0.5Cu and Sn3Ag0.5Cu0.06Ni0.01Ge solder BGA packages with immersion Ag surface finish
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Chuang, Tung-Han; Yen, Shiu-Fang; Wu, Hui-Min |
| 國立臺灣大學 |
2006 |
Intermetallic reactions in Sn-3.5Ag solder ball grid array packages with Ag/Cu and Au/Ni/Cu pads
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Chi, Chih-Chien; Chuang, Tung-Han |
| 國立臺灣大學 |
2006 |
Intermetallic compounds formed during diffusion soldering of Au/Cu/Al2O3 and Cu/Ti/Si with Sn/In interlayer
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Chuang, Tung-Han; Lin, Hsiu-Jen; Tsao, Cheng-Wen |
| 國立臺灣大學 |
2006 |
Abnormal growth of tin whiskers in a Sn3Ag0.5Cu0.5Ce solder ball grid array package
|
Chuang, Tung-Han; Yen, Shiu-Fang |
顯示項目 31-40 / 74 (共8頁)
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