| 國立臺灣大學 |
2010 |
Effect of La addition on the interfacial intermetallics and bonding strengths of Sn-58Bi solder joints with Au/Ni/Cu pads
|
Shiue, Yu-Yun; Chuang, Tung-Han |
| 國立臺灣大學 |
2010 |
Effects of Ce and La Additions on the Microstructure and Mechanical Properties of Sn-9Zn Solder Joints
|
Lin, Hsiu-Jen; Chuang, Tung-Han |
| 臺大學術典藏 |
2010 |
Effects of Ce and Zn additions on the microstructure and mechanical properties of Sn-3Ag-0.5Cu solder joints
|
Chuang, Tung-Han; Lin, Hsiu-Jen; Lin, Hsiu-Jen; Chuang, Tung-Han |
| 臺大學術典藏 |
2010 |
The effect of 0.5 wt.% Ce additions on the electromigration of Sn9Zn BGA solder packages with Au/Ni(P)/Cu and Ag/Cu pads
|
Chuang, Tung-Han; Lin, Hsiu-Jen; Lin, Hsiu-Jen; Chuang, Tung-Han |
| 臺大學術典藏 |
2010 |
Effect of La addition on the interfacial intermetallics and bonding strengths of Sn-58Bi solder joints with Au/Ni/Cu pads
|
Chuang, Tung-Han; Shiue, Yu-Yun; Shiue, Yu-Yun; Chuang, Tung-Han |
| 臺大學術典藏 |
2010 |
Effects of Ce and La Additions on the Microstructure and Mechanical Properties of Sn-9Zn Solder Joints
|
Chuang, Tung-Han; Lin, Hsiu-Jen; Lin, Hsiu-Jen; Chuang, Tung-Han |
| 臺大學術典藏 |
2009-01-06T01:29:50Z |
Abnormal growth of tin whiskers in a Sn3Ag0.5Cu0.5Ce solder ball grid array package
|
Yen, Shiu-Fang; Chuang, Tung-Han; Chuang, Tung-Han; Yen, Shiu-Fang |
| 臺大學術典藏 |
2009-01-06T01:29:28Z |
Intermetallic compounds formed during diffusion soldering of Au/Cu/Al2O3 and Cu/Ti/Si with Sn/In interlayer
|
Tsao, Cheng-Wen; Chuang, Tung-Han; Lin, Hsiu-Jen; Chuang, Tung-Han; Lin, Hsiu-Jen; Tsao, Cheng-Wen |
| 臺大學術典藏 |
2009-01-06T01:28:22Z |
Intermetallic reactions in Sn-3.5Ag solder ball grid array packages with Ag/Cu and Au/Ni/Cu pads
|
Chuang, Tung-Han; Chi, Chih-Chien; Chi, Chih-Chien; Chuang, Tung-Han |
| 臺大學術典藏 |
2009-01-06T01:25:25Z |
Selective formation of intermetallic compounds in Sn-20In-0.8Cu ball grid array solder joints with Au/Ni surface finishes
|
Chuang, Tung-Han; Chiang, Ming-Jui; Wu, Hsing-Fei; Wu, Hsing-Fei; Chiang, Ming-Jui; Chuang, Tung-Han |
| 國立臺灣大學 |
2008 |
Low Temperature Direct Electroless Nickel Plating on Silicon Wafer
|
Jain, Chao-Chi; Wang, Shiuan-Sheng; Chuang, Tung-Han; Yang, Sang-Ray |
| 國立臺灣大學 |
2008 |
Focused-Ion-Beam-Based Selective Closing and Opening of Anodic Alumina Nanochannels for the Growth of Nanowire Arrays Comprising Multiple Elements
|
Liu, Nai-Wei; Liu, Chih-Yi; Wang, Huai-Hsien; Hsu, Chen-Feng; Lai, Ming-Yu; Chuang, Tung-Han; Wang, Yuh-Lin |
| 國立臺灣大學 |
2008 |
Intermetallic Reactions in a Sn-51In Solder BGA Package with immersion Ag Surface Finish
|
Jain, Chao-Chi; Wang, Shiuan-Sheng; Wu, Hui-Min; Chuang, Tung-Han |
| 臺大學術典藏 |
2008 |
Low Temperature Direct Electroless Nickel Plating on Silicon Wafer
|
Jain, Chao-Chi; Wang, Shiuan-Sheng; Chuang, Tung-Han; Yang, Sang-Ray; Jain, Chao-Chi; Wang, Shiuan-Sheng; Chuang, Tung-Han; Yang, Sang-Ray |
| 臺大學術典藏 |
2008 |
Focused-Ion-Beam-Based Selective Closing and Opening of Anodic Alumina Nanochannels for the Growth of Nanowire Arrays Comprising Multiple Elements
|
Wang, Yuh-Lin; Chuang, Tung-Han; Lai, Ming-Yu; Hsu, Chen-Feng; Wang, Huai-Hsien; Liu, Chih-Yi; Liu, Nai-Wei; Liu, Nai-Wei; Liu, Chih-Yi; Wang, Huai-Hsien; Hsu, Chen-Feng; Lai, Ming-Yu; Chuang, Tung-Han; Wang, Yuh-Lin |
| 臺大學術典藏 |
2008 |
Intermetallic Reactions in a Sn-51In Solder BGA Package with immersion Ag Surface Finish
|
Chuang, Tung-Han; Wu, Hui-Min; Jain, Chao-Chi; Wang, Shiuan-Sheng; Jain, Chao-Chi; Wang, Shiuan-Sheng; Wu, Hui-Min; Chuang, Tung-Han |
| 國立臺灣大學 |
2007 |
Temperature Effects on the Whiskers in Rare-Earth Doped Sn-3Ag-0.5Cu-0.5Ce Solder Joints
|
Chuang, Tung-Han |
| 國立臺灣大學 |
2007 |
Oxidation-Induced Whisker Growth on the Surface of Sn-6.6(La, Ce) Alloy
|
Chuang, Tung-Han; Lin, Hsiu-Jen; Chi, Chih-Chien |
| 國立臺灣大學 |
2006 |
Rapid whisker growth on the surface of Sn–3Ag–0.5Cu–1.0Ce solder joints
|
Chuang, Tung-Han |
| 國立臺灣大學 |
2006 |
Intermetallic reactions in Sn-8Zn-20In solder ball grid array packages with Au/Ni/Cu and Ag/Cu pads
|
Liu, Yu-Chih; Lin, Wei-Hong; Lin, Hsiu-Jen; Chuang, Tung-Han |
| 國立臺灣大學 |
2006 |
Intermetallic reactions in reflowed and aged Sn-9Zn solder ball grid array packages with Au/Ni/Cu and Ag/Cu pads
|
Lin, Hsiu-Jen; Chuang, Tung-Han |
| 國立臺灣大學 |
2006 |
Intermetallic formation in Sn3Ag0.5Cu and Sn3Ag0.5Cu0.06Ni0.01Ge solder BGA packages with immersion Ag surface finish
|
Chuang, Tung-Han; Yen, Shiu-Fang; Wu, Hui-Min |
| 國立臺灣大學 |
2006 |
Intermetallic reactions in Sn-3.5Ag solder ball grid array packages with Ag/Cu and Au/Ni/Cu pads
|
Chi, Chih-Chien; Chuang, Tung-Han |
| 國立臺灣大學 |
2006 |
Intermetallic compounds formed during diffusion soldering of Au/Cu/Al2O3 and Cu/Ti/Si with Sn/In interlayer
|
Chuang, Tung-Han; Lin, Hsiu-Jen; Tsao, Cheng-Wen |
| 國立臺灣大學 |
2006 |
Abnormal growth of tin whiskers in a Sn3Ag0.5Cu0.5Ce solder ball grid array package
|
Chuang, Tung-Han; Yen, Shiu-Fang |
| 臺大學術典藏 |
2006 |
Rapid whisker growth on the surface of Sn–3Ag–0.5Cu–1.0Ce solder joints
|
Chuang, Tung-Han; Chuang, Tung-Han |
| 臺大學術典藏 |
2006 |
Intermetallic reactions in Sn-8Zn-20In solder ball grid array packages with Au/Ni/Cu and Ag/Cu pads
|
Liu, Yu-Chih; Lin, Wei-Hong; Lin, Hsiu-Jen; Chuang, Tung-Han; Liu, Yu-Chih; Lin, Wei-Hong; Lin, Hsiu-Jen; Chuang, Tung-Han |
| 臺大學術典藏 |
2006 |
Intermetallic formation in Sn3Ag0.5Cu and Sn3Ag0.5Cu0.06Ni0.01Ge solder BGA packages with immersion Ag surface finish
|
Chuang, Tung-Han; Yen, Shiu-Fang; Wu, Hui-Min; Chuang, Tung-Han; Yen, Shiu-Fang; Wu, Hui-Min |
| 國立臺灣大學 |
2005 |
Intermetallic reactions in a Sn-20In-2.8Ag solder ball-grid-array package with Au/Ni/Cu pads
|
Wu, Hui-Min; Wu, Feng-Chih; Chuang, Tung-Han |
| 國立臺灣大學 |
2004 |
Selective formation of intermetallic compounds in Sn-20In-0.8Cu ball grid array solder joints with Au/Ni surface finishes
|
Wu, Hsing-Fei; Chiang, Ming-Jui; Chuang, Tung-Han |
| 國立臺灣大學 |
2000 |
Erosion- and wear-corrosion behavior of Fe–Mn–Al alloys in NaCl solution
|
Huang, Her-Hsiung; Chuang, Tung-Han |
| 臺大學術典藏 |
2000 |
Erosion- and wear-corrosion behavior of Fe–Mn–Al alloys in NaCl solution
|
Huang, Her-Hsiung; Chuang, Tung-Han; Huang, Her-Hsiung; Chuang, Tung-Han |
| 淡江大學 |
1998-05-05 |
Process and apparatus for manufacturing aluminum laminally filled plastic pellets for shielding electromagnetic interference
|
Chuang, Tung-han; 林清彬; Lin, Ching-bin; Tsai, Teng-chun; Chang, Jiin-chyuan |
| 國立臺灣大學 |
1998 |
Discontinuous coarsening of discontinuous precipitates in a Co–6 at.% Mo alloy
|
Lee, Shiu-Li; Lee, Kuan-Ching; Chuang, Tung-Han |
| 臺大學術典藏 |
1998 |
Discontinuous coarsening of discontinuous precipitates in a Co–6 at.% Mo alloy
|
Lee, Shiu-Li; Lee, Kuan-Ching; Chuang, Tung-Han; Lee, Shiu-Li; Lee, Kuan-Ching; Chuang, Tung-Han |
| 淡江大學 |
1997-08-07 |
Verfahren und vorrichtung zur herstellung von pellets aus metallisiertem kunststoff fur die formverarbeitung zum abschirmen von elektromagnetischer beeinflussung
|
林清彬; Lin, Ching-bin; Chuang, Tung-han |
| 淡江大學 |
1997-07-14 |
Shielding effects of different aspect ratio of aluminum flakes in conductive plastics for injection molding processes
|
Hung, Huang-lung; 陳炤彰; Chen, A. C. C.; Lin, C. B.; Liu, C. H.; Chuang, Tung-han |
| 國立臺灣大學 |
1997 |
Ultrasonic testing of artificial defects in alumina ceramic
|
Chang, Li-Shin; Chuang, Tung-Han |
| 臺大學術典藏 |
1997 |
Ultrasonic testing of artificial defects in alumina ceramic
|
Chang, Li-Shin; Chuang, Tung-Han; Chang, Li-Shin; Chuang, Tung-Han |
| 淡江大學 |
1996/11/01 |
Process and apparatus for manufacturing aluminum laminally filled plastic pellets for shielding electromagnetic interference
|
Chuang, Tung-Han;Lin, Ching-Bin;Tsai, Teng-Chun;Chang, Jiin-Chyuan |
| 淡江大學 |
1996-07-02 |
Process for making metallized plastic molding pellets for shielding electromagnetic interface
|
林清彬; Lin, Ching-bin; Chuang, Tung-han |
| 國立臺灣大學 |
1996-05 |
台灣地區建材耐久性暨標準化研討會論文集
|
莊東漢; Chuang, Tung-Han |
| 國立臺灣大學 |
1996 |
航太材料超塑性成型與擴散接合研究總計畫(第五年)
|
莊東漢; 王文雄; 鄭榮合; 楊智富; 顧鈞豪; Chuang, Tung-Han; Wang, Wen-Hsung; 鄭榮合; 楊智富; Koo, Chun-Hao |
| 國立臺灣大學 |
1996 |
航太材料超塑性成型與擴散接合研究總計劃(IV)
|
莊東漢; 鄭榮和; 王文雄; 楊智富; Chuang, Tung-Han; Cheng, Jung-Ho; Wang, Wen-Hsung; 楊智富 |
| 國立臺灣大學 |
1996 |
超塑性成型與擴散接合之加工製程研究(第五年)
|
莊東漢; Chuang, Tung-Han |
| 國立臺灣大學 |
1996 |
超塑性成型與擴散接合之有限元素分析
|
莊東漢; Chuang, Tung-Han |
| 臺大學術典藏 |
1996 |
航太材料超塑性成型與擴散接合研究總計畫(第五年)
|
楊智富; 鄭榮合; Chuang, Tung-Han; 顧鈞豪; 鄭榮合; 楊智富; 王文雄; 莊東漢; 莊東漢; 王文雄; 鄭榮合; 楊智富; 顧鈞豪 |
| 臺大學術典藏 |
1996 |
航太材料超塑性成型與擴散接合研究總計劃(IV)
|
Cheng, Jung-Ho; Chuang, Tung-Han; 楊智富; 王文雄; 鄭榮和; 莊東漢; 莊東漢; 鄭榮和; 王文雄; 楊智富 |
| 淡江大學 |
1995/04/28 |
Process for making metallized plastic molding pellets for shielding electromagnetic interference
|
Lin, Ching-Bin;Chuang, Tung-Han |
| 國立臺灣大學 |
1995-09 |
超塑性成型與擴散接合之加工製程研究(第三年)
|
莊東漢; Chuang, Tung-Han |
