臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)

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	2019臺灣學術機構典藏研討會
	機構典藏系統RC7版本已發佈

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Institution	Date	Title	Author
臺大學術典藏	2010	Effects of Ce and La Additions on the Microstructure and Mechanical Properties of Sn-9Zn Solder Joints	Chuang, Tung-Han; Lin, Hsiu-Jen; Lin, Hsiu-Jen; Chuang, Tung-Han
臺大學術典藏	2009-01-06T01:29:50Z	Abnormal growth of tin whiskers in a Sn3Ag0.5Cu0.5Ce solder ball grid array package	Yen, Shiu-Fang; Chuang, Tung-Han; Chuang, Tung-Han; Yen, Shiu-Fang
臺大學術典藏	2009-01-06T01:29:28Z	Intermetallic compounds formed during diffusion soldering of Au/Cu/Al2O3 and Cu/Ti/Si with Sn/In interlayer	Tsao, Cheng-Wen; Chuang, Tung-Han; Lin, Hsiu-Jen; Chuang, Tung-Han; Lin, Hsiu-Jen; Tsao, Cheng-Wen
臺大學術典藏	2009-01-06T01:28:22Z	Intermetallic reactions in Sn-3.5Ag solder ball grid array packages with Ag/Cu and Au/Ni/Cu pads	Chuang, Tung-Han; Chi, Chih-Chien; Chi, Chih-Chien; Chuang, Tung-Han
臺大學術典藏	2009-01-06T01:25:25Z	Selective formation of intermetallic compounds in Sn-20In-0.8Cu ball grid array solder joints with Au/Ni surface finishes	Chuang, Tung-Han; Chiang, Ming-Jui; Wu, Hsing-Fei; Wu, Hsing-Fei; Chiang, Ming-Jui; Chuang, Tung-Han
國立臺灣大學	2008	Low Temperature Direct Electroless Nickel Plating on Silicon Wafer	Jain, Chao-Chi; Wang, Shiuan-Sheng; Chuang, Tung-Han; Yang, Sang-Ray
國立臺灣大學	2008	Focused-Ion-Beam-Based Selective Closing and Opening of Anodic Alumina Nanochannels for the Growth of Nanowire Arrays Comprising Multiple Elements	Liu, Nai-Wei; Liu, Chih-Yi; Wang, Huai-Hsien; Hsu, Chen-Feng; Lai, Ming-Yu; Chuang, Tung-Han; Wang, Yuh-Lin
國立臺灣大學	2008	Intermetallic Reactions in a Sn-51In Solder BGA Package with immersion Ag Surface Finish	Jain, Chao-Chi; Wang, Shiuan-Sheng; Wu, Hui-Min; Chuang, Tung-Han
臺大學術典藏	2008	Low Temperature Direct Electroless Nickel Plating on Silicon Wafer	Jain, Chao-Chi; Wang, Shiuan-Sheng; Chuang, Tung-Han; Yang, Sang-Ray; Jain, Chao-Chi; Wang, Shiuan-Sheng; Chuang, Tung-Han; Yang, Sang-Ray
臺大學術典藏	2008	Focused-Ion-Beam-Based Selective Closing and Opening of Anodic Alumina Nanochannels for the Growth of Nanowire Arrays Comprising Multiple Elements	Wang, Yuh-Lin; Chuang, Tung-Han; Lai, Ming-Yu; Hsu, Chen-Feng; Wang, Huai-Hsien; Liu, Chih-Yi; Liu, Nai-Wei; Liu, Nai-Wei; Liu, Chih-Yi; Wang, Huai-Hsien; Hsu, Chen-Feng; Lai, Ming-Yu; Chuang, Tung-Han; Wang, Yuh-Lin
臺大學術典藏	2008	Intermetallic Reactions in a Sn-51In Solder BGA Package with immersion Ag Surface Finish	Chuang, Tung-Han; Wu, Hui-Min; Jain, Chao-Chi; Wang, Shiuan-Sheng; Jain, Chao-Chi; Wang, Shiuan-Sheng; Wu, Hui-Min; Chuang, Tung-Han
國立臺灣大學	2007	Temperature Effects on the Whiskers in Rare-Earth Doped Sn-3Ag-0.5Cu-0.5Ce Solder Joints	Chuang, Tung-Han
國立臺灣大學	2007	Oxidation-Induced Whisker Growth on the Surface of Sn-6.6(La, Ce) Alloy	Chuang, Tung-Han; Lin, Hsiu-Jen; Chi, Chih-Chien
國立臺灣大學	2006	Rapid whisker growth on the surface of Sn–3Ag–0.5Cu–1.0Ce solder joints	Chuang, Tung-Han
國立臺灣大學	2006	Intermetallic reactions in Sn-8Zn-20In solder ball grid array packages with Au/Ni/Cu and Ag/Cu pads	Liu, Yu-Chih; Lin, Wei-Hong; Lin, Hsiu-Jen; Chuang, Tung-Han
國立臺灣大學	2006	Intermetallic reactions in reflowed and aged Sn-9Zn solder ball grid array packages with Au/Ni/Cu and Ag/Cu pads	Lin, Hsiu-Jen; Chuang, Tung-Han
國立臺灣大學	2006	Intermetallic formation in Sn3Ag0.5Cu and Sn3Ag0.5Cu0.06Ni0.01Ge solder BGA packages with immersion Ag surface finish	Chuang, Tung-Han; Yen, Shiu-Fang; Wu, Hui-Min
國立臺灣大學	2006	Intermetallic reactions in Sn-3.5Ag solder ball grid array packages with Ag/Cu and Au/Ni/Cu pads	Chi, Chih-Chien; Chuang, Tung-Han
國立臺灣大學	2006	Intermetallic compounds formed during diffusion soldering of Au/Cu/Al2O3 and Cu/Ti/Si with Sn/In interlayer	Chuang, Tung-Han; Lin, Hsiu-Jen; Tsao, Cheng-Wen
國立臺灣大學	2006	Abnormal growth of tin whiskers in a Sn3Ag0.5Cu0.5Ce solder ball grid array package	Chuang, Tung-Han; Yen, Shiu-Fang
臺大學術典藏	2006	Rapid whisker growth on the surface of Sn–3Ag–0.5Cu–1.0Ce solder joints	Chuang, Tung-Han; Chuang, Tung-Han
臺大學術典藏	2006	Intermetallic reactions in Sn-8Zn-20In solder ball grid array packages with Au/Ni/Cu and Ag/Cu pads	Liu, Yu-Chih; Lin, Wei-Hong; Lin, Hsiu-Jen; Chuang, Tung-Han; Liu, Yu-Chih; Lin, Wei-Hong; Lin, Hsiu-Jen; Chuang, Tung-Han
臺大學術典藏	2006	Intermetallic formation in Sn3Ag0.5Cu and Sn3Ag0.5Cu0.06Ni0.01Ge solder BGA packages with immersion Ag surface finish	Chuang, Tung-Han; Yen, Shiu-Fang; Wu, Hui-Min; Chuang, Tung-Han; Yen, Shiu-Fang; Wu, Hui-Min
國立臺灣大學	2005	Intermetallic reactions in a Sn-20In-2.8Ag solder ball-grid-array package with Au/Ni/Cu pads	Wu, Hui-Min; Wu, Feng-Chih; Chuang, Tung-Han
國立臺灣大學	2004	Selective formation of intermetallic compounds in Sn-20In-0.8Cu ball grid array solder joints with Au/Ni surface finishes	Wu, Hsing-Fei; Chiang, Ming-Jui; Chuang, Tung-Han

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