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Showing items 1-14 of 14 (1 Page(s) Totally)
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| 臺大學術典藏 |
2018-06-28T22:23:24Z |
Evolution of Ag3Sn compounds and microhardness of Sn3.5Ag0.5Cu nano-composite solders during different cooling rate and aging
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ChuangTH; Chang, S.Y.; Chung, Chien-Han; Tsao, L.C.; Chuang, T.H.; Chuang, T.H.; Tsao, L.C.; Chung, Chien-Han; Chang, S.Y. |
| 臺大學術典藏 |
2018-06-28T22:11:37Z |
Formation of Whiskers and Hillocks on the Surface of Sn-6.6RE Alloys
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Chuang, T.H.; Chi, C.C.; Lin, H.J.; Chuang, T.H.; Chi, C.C.; Lin, H.J.; ChuangTH |
| 臺大學術典藏 |
2018-06-28T22:11:27Z |
Intermetallic Compounds Formed during the Reflow of In-49Sn Solder Ball-Grid-Array Packages
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Chuang, T. H.; Chang, S. Y.; Tsao, L. C.; Weng, W. P.; Wu, H. M.; Chuang, T. H.; Chang, S. Y.; Tsao, L. C.; Weng, W. P.; Wu, H. M.; ChuangTH |
| 臺大學術典藏 |
2011 |
Strengthening mechanism of nano-Al2O3 particles reinforced Sn3.5Ag0.5Cu lead-free solder
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Wu, M.W.; Chang, S.Y.; Ping, S.F.; Tsao, L.C.; ChuangTH; Chuang, T.H.; Chuang, T.H.; Wu, M.W.; Chang, S.Y.; Ping, S.F.; Tsao, L.C. |
| 臺大學術典藏 |
2008 |
Intermetallic Reactions in Sn-0.4Co-0.7Cu Solder BGA Packages with an ENIG Surface Finish
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ChuangTH; Wu, H.M.; Jain, C.C.; Chuang, T.H.; Chuang, T.H.; Jain, C.C.; Wu, H.M. |
| 臺大學術典藏 |
2006 |
Intermetallic reactions in Sn3Ag0.5Cu and Sn3Ag0.5Cu0.06Ni0.01Ge solder BGA packages with Au/Ni surface finishes
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ChuangTH; Cheng, M. D.; Yen, S. F.; Chuang, T. H.; Chuang, T. H.; Yen, S. F.; Cheng, M. D.Chuangth |
| 臺大學術典藏 |
2004 |
Mechanisms for interfacial reactions between liquid Sn-3.5Ag solders and cu substrates
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Chuang, T. H.; Wu, H. M.; Cheng, M. D.; Chang, S. Y.; Yen, S. F.; Chuang, T. H.; Wu, H. M.; Cheng, M. D.; Chang, S. Y.; Yen, S. F.; ChuangTH |
| 臺大學術典藏 |
2004 |
Mechanisms for the intermetallic formation during the Sn-20In-2.8Ag/Ni soldering reactions
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ChuangTH; Chuang, T. H.; Huang, K. W.; Lin, W. H.; Chuang, T. H.; Huang, K. W.; Lin, W. H. |
| 臺大學術典藏 |
2002 |
Phase Identification And Growth Kinetics of the Intermetallic Compounds Formed during In-49Sn/Cu Soldering Reactions
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ChuangTH; Wang, S. S.; Chang, S. Y.; Yu, C. L.; Chuang, T. H.; Yu, C. L.; Chang, S. Y.; Wang, S. S.; Chuang, T. H. |
| 臺大學術典藏 |
2001 |
AgIn2/Ag2In transformations in an In-49Sn/Ag soldered joint
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ChuangTH; Huang, Y. T.; Tsao, L. C.; Chuang, T. H.; Chuang, T. H.; Huang, Y. T.; Tsao, L. C. |
| 臺大學術典藏 |
2000 |
Brazing of zirconia with AgCuTi and SnAgTi active filler metals
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Chuang, T. H.; Yeh, M. S.; Chai, Y. H.; Chuang, T. H.; Yeh, M. S.; Chai, Y. H.; ChuangTH |
| 臺大學術典藏 |
2000 |
Development of a low-melting-point filler metal for brazing aluminum alloys
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Chuang, T. H.; Tsao, L. C.; Tsai, T. C.; Yeh, M. S.; Wu, C. S.; ChuangTH; Chuang, T. H.; Tsao, L. C.; Tsai, T. C.; Yeh, M. S.; Wu, C. S. |
| 臺大學術典藏 |
1992 |
On the mechanisms of high-temperature intergranular embrittlements of Ni3Al-Zr Alloys
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ChuangTH; Pan, Y. C.; Chuang, T. H.; Pan, Y. C.; Chuang, T. H. |
| 臺大學術典藏 |
1991 |
Grain boundary pest of boron- doped Niin3Al at 1200 ?C
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ChuangTH; Hsu, S. E.; Pan, Y. C.; Chuang, T. H.; Chuang, T. H.; Pan, Y. C.; Hsu, S. E. |
Showing items 1-14 of 14 (1 Page(s) Totally)
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