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"chun j h"
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| 臺大學術典藏 |
2020-06-16T06:36:20Z |
Thermal modeling and device oise properties of three-dimensional-SOI technology
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Chen, T.W.;Chun, J.-H.;Lu, Y.-C.;Navid, R.;Wang, W.;Chen, C.-L.;Dutton, R.W.; Chen, T.W.; Chun, J.-H.; Lu, Y.-C.; Navid, R.; Wang, W.; Chen, C.-L.; Dutton, R.W.; YI-CHANG LU |
| 臺大學術典藏 |
2020-06-16T06:36:20Z |
Thermal modeling and device oise properties of three-dimensional-SOI technology
|
Chen, T.W.;Chun, J.-H.;Lu, Y.-C.;Navid, R.;Wang, W.;Chen, C.-L.;Dutton, R.W.; Chen, T.W.; Chun, J.-H.; Lu, Y.-C.; Navid, R.; Wang, W.; Chen, C.-L.; Dutton, R.W.; YI-CHANG LU |
Showing items 1-2 of 2 (1 Page(s) Totally)
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