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"dai bt"的相关文件
显示项目 31-55 / 56 (共3页)
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| 國立交通大學 |
2014-12-08T15:38:41Z |
Near-infrared femtosecond laser-induced crystallization of amorphous silicon
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Shieh, JM; Chen, ZH; Dai, BT; Wang, YC; Zaitsev, A; Pan, CL |
| 國立交通大學 |
2014-12-08T15:37:19Z |
Post-Cu CMP cleaning for colloidal silica abrasive removal
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Chen, PL; Chen, JH; Tsai, MS; Dai, BT; Yeh, CF |
| 國立交通大學 |
2014-12-08T15:36:01Z |
Pattern effect optimized with non-native surface passivation in copper abrasive-free polishing
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Fang, JY; Tsai, MS; Dai, BT; Wu, YS; Feng, MS |
| 國立交通大學 |
2014-12-08T15:36:01Z |
Emission of bright blue light from mesoporous silica with dense Si (Ge) nanocrystals
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Cho, AT; Shieh, JM; Shieh, J; Lai, YF; Dai, BT; Pan, FM; Kuo, HC; Lin, YC; Chao, KJ; Liu, PH |
| 國立交通大學 |
2014-12-08T15:36:00Z |
Two-additive electrolytes for superplanarizing damascene Cu metals
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Liu, SH; Shieh, JM; Chen, C; Dai, BT; Hensen, K; Cheng, SS |
| 國立交通大學 |
2014-12-08T15:27:11Z |
A study on electrochemical metrologies for evaluating the removal selectivity of AlCMP
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Chiu, SY; Hsu, JW; Tung, IC; Shih, HC; Feng, MS; Tsai, MS; Dai, BT |
| 國立交通大學 |
2014-12-08T15:27:08Z |
Evaluation of impurity migration and microwave digestion methods for lithographic materials
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Ko, FH; Hsiao, LT; Chou, CT; Wang, MY; Wang, TK; Sun, YC; Cheng, BJ; Yeng, S; Dai, BT |
| 國立交通大學 |
2014-12-08T15:27:05Z |
Study on chemical-mechanical polishing of low dielectric constant polyimide thin films
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Tai, YL; Tsai, MS; Tung, IC; Dai, BT; Feng, MS |
| 國立交通大學 |
2014-12-08T15:26:56Z |
Film characterization and evaluation of process performance for the modified electron beam resist
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Ko, FH; Ting, JH; Chou, CT; Hsiao, LT; Huang, TY; Dai, BT |
| 國立交通大學 |
2014-12-08T15:26:56Z |
Technology of electroplating copper with low-K material a-C : F for 0.15 mu m damascene interconnection
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Shieh, JM; Suen, SC; Lin, KC; Chang, SC; Dai, BT; Chen, CF; Feng, MS |
| 國立交通大學 |
2014-12-08T15:17:43Z |
Effect of surface passivation removal on planarization efficiency in Cu abrasive-free polishing
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Fang, JY; Tsai, MS; Dai, BT; Wu, YS; Feng, MS |
| 國立交通大學 |
2014-12-08T15:17:35Z |
Study on pressure-independent Cu removal in Cu abrasive-free polishing
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Fang, JY; Huang, PW; Tsai, MS; Dai, BT; Wu, YS; Feng, MS |
| 國立交通大學 |
2014-12-08T15:17:03Z |
Dopant profile engineering by near-infrared femtosecond laser activation
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Wang, YC; Pan, CL; Shieh, JM; Dai, BT |
| 國立交通大學 |
2014-12-08T15:16:39Z |
Aging influence of poly(ethylene glycol) suppressors of Cu electrolytes on gaps filling
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Liu, SH; Li, TC; Chen, C; Shieh, JM; Dai, BT; Hensen, K; Cheng, SS |
| 國立交通大學 |
2014-12-08T15:03:25Z |
IMPROVEMENT OF THIN OXIDES THERMALLY GROWN ON THE REACTIVE-ION-ETCHED SILICON SUBSTRATES
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UENG, SY; WANG, PW; KANG, TK; CHAO, TS; CHEN, WH; DAI, BT; CHENG, HC |
| 國立交通大學 |
2014-12-08T15:03:25Z |
EFFECTS OF POLYSILICON ELECTRON-CYCLOTRON-RESONANCE ETCHING ON ELECTRICAL CHARACTERISTICS OF GATE OXIDES
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KANG, TK; UENG, SY; DAI, BT; CHEN, LP; CHENG, HC |
| 國立交通大學 |
2014-12-08T15:03:11Z |
CHARACTERIZATION OF THE CHEMICAL-MECHANICAL POLISHING PROCESS-BASED ON NANOINDENTATION MEASUREMENT OF DIELECTRIC FILMS
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LIU, CW; DAI, BT; YEH, CF |
| 國立交通大學 |
2014-12-08T15:03:02Z |
Chemical mechanical polishing of PSG and BPSG dielectric films: The effect of phosphorus and boron concentration
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Liu, CW; Dai, BT; Yeh, CF |
| 國立交通大學 |
2014-12-08T15:02:53Z |
Antenna charging effects on the electrical characteristics of polysilicon gate during electron cyclotron resonance etching
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Kang, TK; Ueng, SY; Dai, BT; Chen, LP; Cheng, HC |
| 國立交通大學 |
2014-12-08T15:02:52Z |
Modeling of the wear mechanism during chemical-mechanical polishing
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Liu, CW; Dai, BT; Tseng, WT; Yeh, CF |
| 國立交通大學 |
2014-12-08T15:02:50Z |
Post cleaning of chemical mechanical polishing process
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Liu, CW; Dai, BT; Yeh, CF |
| 國立交通大學 |
2014-12-08T15:02:49Z |
Fabrication of thin film transistors by chemical mechanical polished polycrystalline silicon films
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Chang, CY; Lin, HY; Lei, TF; Cheng, JY; Chen, LP; Dai, BT |
| 國立交通大學 |
2014-12-08T15:02:33Z |
A novel technology to reduce the antenna charging effects during polysilicon gate electron-cyclotron-resonance etching
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Cheng, HC; Kang, TK; Ku, TK; Dai, BT; Chen, LP |
| 國立交通大學 |
2014-12-08T15:02:11Z |
Effects of mechanical characteristics on the chemical-mechanical polishing of dielectric thin films
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Tseng, WT; Liu, CW; Dai, BT; Yeh, CF |
| 國立交通大學 |
2014-12-08T15:01:16Z |
Charging damages to gate oxides in a helicon O-2 plasma
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Lin, W; Kang, TK; Perng, YC; Dai, BT; Cheng, HC |
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