|
|
???tair.name??? >
???browser.page.title.author???
|
"dai bt"???jsp.browse.items-by-author.description???
Showing items 16-40 of 56 (3 Page(s) Totally)
1 2 3 > >>
View [10|25|50] records per page
| 國立交通大學 |
2014-12-08T15:42:14Z |
Wetting effect on gap filling submicron damascene by an electrolyte free of levelers
|
Chang, SC; Shieh, JM; Lin, KC; Dai, BT; Wang, TC; Chen, CF; Feng, MS; Li, YH; Lu, CP |
| 國立交通大學 |
2014-12-08T15:42:09Z |
Investigation of superfilling and electrical characteristics in low-impurity-incorporated Cu metallization
|
Shieh, JM; Chang, SC; Dai, BT; Feng, MS |
| 國立交通大學 |
2014-12-08T15:42:01Z |
The effect of plating current densities on self-annealing Behaviors of electroplated copper films
|
Chang, SC; Shieh, JM; Dai, BT; Feng, MS; Li, YH |
| 國立交通大學 |
2014-12-08T15:42:00Z |
Microleveling mechanisms and applications of electropolishing on planarization of copper metallization
|
Chang, SC; Shieh, JM; Huang, CC; Dai, BT; Li, YH; Feng, MS |
| 國立交通大學 |
2014-12-08T15:41:49Z |
Leveling effects of copper electrolytes with hybrid-mode additives
|
Lin, KC; Shieh, JM; Chang, SC; Dai, BT; Chen, CF; Feng, MS; Li, YH |
| 國立交通大學 |
2014-12-08T15:41:48Z |
Investigation of carrying agents on microstructure of electroplated Cu films
|
Shieh, JM; Chang, SC; Dai, BT; Feng, MS |
| 國立交通大學 |
2014-12-08T15:41:47Z |
Investigations of pulse current electrodeposition for damascene copper metals
|
Chang, SC; Shieh, JM; Dai, BT; Feng, MS |
| 國立交通大學 |
2014-12-08T15:41:39Z |
Pattern effects on planarization efficiency of Cu electropolishing
|
Chang, SC; Shieh, JM; Huang, CC; Dai, BT; Feng, MS |
| 國立交通大學 |
2014-12-08T15:41:17Z |
Improving the quality of electroplated copper films by rapid thermal annealing
|
Chang, SC; Shieh, JM; Dai, BT; Feng, MS; Wang, YL |
| 國立交通大學 |
2014-12-08T15:40:54Z |
Superpolishing for planarizing copper damascene interconnects
|
Chang, SC; Shieh, JM; Dai, BT; Feng, MS; Li, YH; Shih, CH; Tsai, MH; Shue, SL; Liang, RS; Wang, YL |
| 國立交通大學 |
2014-12-08T15:40:06Z |
The application of electrochemical metrologies for investigating chemical mechanical polishing of Al with a Ti barrier layer
|
Chiu, SY; Wang, YL; Liu, CP; Lan, JK; Ay, C; Feng, MS; Tsai, MS; Dai, BT |
| 國立交通大學 |
2014-12-08T15:39:57Z |
Roles of copper mechanical characteristics in electropolishing
|
Chang, SC; Shieh, JM; Fang, JY; Wang, YL; Dai, BT; Feng, MS |
| 國立交通大學 |
2014-12-08T15:39:46Z |
Stable blue luminescence from mesoporous silica films
|
Shieh, JM; Cho, AT; Lai, YF; Dai, BT; Pan, FM; Chao, KJ |
| 國立交通大學 |
2014-12-08T15:39:45Z |
Synthesis of microcrystalline silicon at room temperature using ICP
|
Wu, JH; Shieh, JM; Dai, BT; Wu, YCS |
| 國立交通大學 |
2014-12-08T15:39:17Z |
The removal of airborne molecular contamination in cleanroom using PTFE and chemical filters
|
Yeh, CF; Hsiao, CW; Lin, SJ; Hsieh, CM; Kusumi, T; Aomi, H; Kaneko, H; Dai, BT; Tsai, MS |
| 國立交通大學 |
2014-12-08T15:38:41Z |
Near-infrared femtosecond laser-induced crystallization of amorphous silicon
|
Shieh, JM; Chen, ZH; Dai, BT; Wang, YC; Zaitsev, A; Pan, CL |
| 國立交通大學 |
2014-12-08T15:37:19Z |
Post-Cu CMP cleaning for colloidal silica abrasive removal
|
Chen, PL; Chen, JH; Tsai, MS; Dai, BT; Yeh, CF |
| 國立交通大學 |
2014-12-08T15:36:01Z |
Pattern effect optimized with non-native surface passivation in copper abrasive-free polishing
|
Fang, JY; Tsai, MS; Dai, BT; Wu, YS; Feng, MS |
| 國立交通大學 |
2014-12-08T15:36:01Z |
Emission of bright blue light from mesoporous silica with dense Si (Ge) nanocrystals
|
Cho, AT; Shieh, JM; Shieh, J; Lai, YF; Dai, BT; Pan, FM; Kuo, HC; Lin, YC; Chao, KJ; Liu, PH |
| 國立交通大學 |
2014-12-08T15:36:00Z |
Two-additive electrolytes for superplanarizing damascene Cu metals
|
Liu, SH; Shieh, JM; Chen, C; Dai, BT; Hensen, K; Cheng, SS |
| 國立交通大學 |
2014-12-08T15:27:11Z |
A study on electrochemical metrologies for evaluating the removal selectivity of AlCMP
|
Chiu, SY; Hsu, JW; Tung, IC; Shih, HC; Feng, MS; Tsai, MS; Dai, BT |
| 國立交通大學 |
2014-12-08T15:27:08Z |
Evaluation of impurity migration and microwave digestion methods for lithographic materials
|
Ko, FH; Hsiao, LT; Chou, CT; Wang, MY; Wang, TK; Sun, YC; Cheng, BJ; Yeng, S; Dai, BT |
| 國立交通大學 |
2014-12-08T15:27:05Z |
Study on chemical-mechanical polishing of low dielectric constant polyimide thin films
|
Tai, YL; Tsai, MS; Tung, IC; Dai, BT; Feng, MS |
| 國立交通大學 |
2014-12-08T15:26:56Z |
Film characterization and evaluation of process performance for the modified electron beam resist
|
Ko, FH; Ting, JH; Chou, CT; Hsiao, LT; Huang, TY; Dai, BT |
| 國立交通大學 |
2014-12-08T15:26:56Z |
Technology of electroplating copper with low-K material a-C : F for 0.15 mu m damascene interconnection
|
Shieh, JM; Suen, SC; Lin, KC; Chang, SC; Dai, BT; Chen, CF; Feng, MS |
Showing items 16-40 of 56 (3 Page(s) Totally)
1 2 3 > >>
View [10|25|50] records per page
|
