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Showing items 1-7 of 7 (1 Page(s) Totally)
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| 國立成功大學 |
2016-07-28 |
SiP產品於迴焊製程中之溫度分佈及封裝後翹曲模擬
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鄧上軒; Deng, Shang-Shiuan |
| 國立成功大學 |
2016-07 |
Temperature prediction for system in package assembly during the reflow soldering process
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deng, Shang-Shiuan; Hwang, Sheng-Jye; Lee, Huei-Huang |
| 國立成功大學 |
2016-06-27 |
SiP產品於迴焊製程中之溫度分佈及封裝後翹曲模擬
|
鄧上軒; Deng, Shang-Shiuan |
| 國立成功大學 |
2013-03 |
Warpage Prediction and Experiments of Fan-Out Waferlevel Package During Encapsulation Process
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Deng, Shang-Shiuan; Hwang, Sheng-Jye; Lee, Huei-Huang |
| 國立成功大學 |
2011-01 |
Volume Shrinkage Characterization of Underfill Materials
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Deng, Shang-Shiuan; Ho, Chia-Yi; Lee, Huei-Huang; Hwang, Sheng-Jye; Huang, Durn-Yuan |
| 國立成功大學 |
2009-06-30 |
擴散型晶圓級封裝之翹曲研究
|
鄧上軒; Deng, Shang-Shiuan |
| 國立成功大學 |
2009-06-30 |
擴散型晶圓級封裝之翹曲研究
|
鄧上軒; Deng, Shang-Shiuan |
Showing items 1-7 of 7 (1 Page(s) Totally)
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