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Showing items 51-60 of 122  (13 Page(s) Totally)
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Institution Date Title Author
元智大學 2012-04-26 40nm InAs HEMTs with Current-Gain Cutoff Frequency of 663 GHz Biased Near the Occurrence of Impact Ionization Chien-I Kuo ; Che-Yang Chiang; Heng-Tung Hsu; Ching-Yi Hsu; Guo-Wei Huang; Edward Yi Chang
元智大學 2012-04-26 40nm InAs HEMTs with Current-Gain Cutoff Frequency of 663 GHz Biased Near the Occurrence of Impact Ionization Chien-I Kuo ; Che-Yang Chiang; Heng-Tung Hsu; Ching-Yi Hsu; Guo-Wei Huang; Edward Yi Chang
元智大學 2011-10 V-Band Flip-Chip Assembled Gain Block Using In0.6Ga0.4As Metamorphic High-Electron-Mobility Transistor Technology Che-Yang Chiang; Heng-Tung Hsu; Chin-Te Wang; Chien-I Kuo; Heng-Shou Hsu; Edward Yi Chang
元智大學 2011-09 Flip-Chip Packaging of Low-Noise Metamorphic High Electron Mobility Transistors on Low-Cost Organic Substrate Chin-Te Wang; Chien-I Kuo; Heng-Tung Hsu; Edward Yi Chang; Li-Han Hsu; Wee-Chin Lim; Yasuyuki Miyamoto
元智大學 2011-09 Flip-Chip Packaging of Low-Noise Metamorphic High Electron Mobility Transistors on Low-Cost Organic Substrate Chin-Te Wang; Chien-I Kuo; Heng-Tung Hsu; Edward Yi Chang; Li-Han Hsu; Wee-Chin Lim; Yasuyuki Miyamoto
元智大學 2011-08-28 Dislocation Reduction by Double AlGaN Buffer Layers in GaN on Si Substrate Yu-Lin Hsiao; Lung-Chi Lu; Yue-Han Wu; Chia-Ao Chang; Yu-Gong Chen; Jer-Shen Maa; Heng-Tung Hsu; Edward Yi Chang
元智大學 2011-08-28 Dislocation Reduction by Double AlGaN Buffer Layers in GaN on Si Substrate Yu-Lin Hsiao; Lung-Chi Lu; Yue-Han Wu; Chia-Ao Chang; Yu-Gong Chen; Jer-Shen Maa; Heng-Tung Hsu; Edward Yi Chang
元智大學 2011-02 A Flip-Chip Packaged 80-nm In0.7Ga0.3As MHEMT for Millimeter-Wave Low-Noise Applications Chin-Te Wang; Chien-I Kuo; Heng-Tung Hsu; Edward Yi Chang; Li-Han Hsu; Wee-Chin Lim; Che-Yang Chiang; Suz-Ping Tsai; Guo-Wei Huang
元智大學 2011-02 A Flip-Chip Packaged 80-nm In0.7Ga0.3As MHEMT for Millimeter-Wave Low-Noise Applications Chin-Te Wang; Chien-I Kuo; Heng-Tung Hsu; Edward Yi Chang; Li-Han Hsu; Wee-Chin Lim; Che-Yang Chiang; Suz-Ping Tsai; Guo-Wei Huang
元智大學 2010-12 Bonding Temperature Effect on the Performance of Flip Chip Assembled 150nm mHEMT Device on Organic Substrate Chien-I Kuo; Wee-Chin Lim; Heng-Tung Hsu; Chin-Te Wang; Li-Han Hsu; Faiz Aizad; Guo-Wei Huang; Yasuyuki Miyamoto; Edward Yi Chang

Showing items 51-60 of 122  (13 Page(s) Totally)
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