English  |  正體中文  |  简体中文  |  总笔数 :2823698  
造访人次 :  30519828    在线人数 :  1299
教育部委托研究计画      计画执行:国立台湾大学图书馆
 		 
搜寻范围 进阶搜寻
臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)
关于TAIR
计画说明

浏览
典藏机构
作者
题名
日期
统计图表
机构即时统计
学术趋势

消息
2019臺灣學術機構典藏
研討會
機構典藏系統RC7版本已
發佈

著作权
出版社及期刊政策查询
TAIR著作权会议记录

相关连结
機構典藏計畫網站
ROAR
OpenDOAR
SHERPA
OAIster
JAIRO
Ira
DSPACE
RWWR
臺大學術典藏NTU Scholars
台湾机构典藏 TAIR >  依作者浏览

"f y han"的相关文件

回到依作者浏览
依题名排序 依日期排序

显示项目 1-25 / 28 (共2页)
1 2 > >>
每页显示[10|25|50]项目

机构 日期 题名 作者
國立中山大學 2009-12 A dual-conversion zero-IF design for DVB-H RF tuner applications Y.C. Lin;Y.J. Lian;F.Y. Han;K.C. Lu;T.S. Horng;J.M. Wu
國立中山大學 2009-06 Packaging effects on the figure of merit of a CMOS cascode low-noise amplifier: flip-chip versus wire-bond F.Y. Han;K.C. Lu;T.S. Horng;J. Lin;H.H. Cheng;C.T. Chiu;C.P. Hung
國立中山大學 2009-05 Packaging effects on degrading the figure of merit of a CMOS low-noise amplifier: flip-chip versus wirebond F.Y. Han;K.C. Lu;T.S. Horng;J.Y. Li;C.C. Chen;H.H. Chen;C.T. Chiu;C.P Hung
國立高雄師範大學 2006-10 A rigorous study of package and PCB effects on W-CDMA upconverter RFICs Jian-Ming Wu;F.Y. Han;T.S. Horng; 吳建銘
國立中山大學 2006-10 A rigorous study of package and PCB effects on W-CDMA upconverter RFICs F.Y. Han; J.M. Wu; T.S. Horng; C.C. Tu
國立高雄師範大學 2006-09 A rigorous comparison of package and PCB effects on micromixer- and Gilbert mixer-based upconverter MMICs Jian-Ming Wu;F. Y. Han;J. M. Wu;T. S. Horng; 吳建銘
國立中山大學 2006-09 A rigorous comparison of package and PCB effects on micromixer- and Gilbert mixer-based upconverter MMICs F.Y. Han;J.M. Wu;T.S. Horng
國立高雄師範大學 2006-06 Direct-conversion quadrature modulator MMIC design with a new 90 degrees phase shifter including package and PCB effects for W-CDMA applications Jian-Ming Wu;F.Y. Han;T.S. Horng;J. Lin; 吳建銘
國立高雄師範大學 2006-06 Implementation of a W-CDMA direct-conversion IQ modulator module including evaluation of chip-package-board interactions Jian-Ming Wu;F. Y. Han;T. S. Horng;J. Lin;C. C. Tu; 吳建銘
國立中山大學 2006-06 Direct-conversion quadrature modulator MMIC design with a new 90 degrees phase shifter including package and PCB effects for W-CDMA applications J.M. Wu;F.Y. Han; T.S. Horng; J. Lin
國立中山大學 2006-06 Implementation of a W-CDMA direct-conversion IQ modulator module including evaluation of chip-package-board interactions F.Y. Han;J.M. Wu;T.S. Horng;J. Lin
國立中山大學 2006 A rigorous study of package and PCB effects on W-CDMA upconverter RFICs F.Y. Han;J.M. Wu;T.S. Horng;C.C. Tu
國立中山大學 2006 Direct-conversion quadrature modulator MMIC design with a new 90 degrees phase shifter including package and PCB effects for W-CDMA applications J.M. Wu;F.Y. Han;T.S. Horng;J. Lin
國立高雄師範大學 2005-12 A rigorous study of package and PCB effects on W-CDMA RFICs Jian-Ming Wu;F. Y. Han;T. S. Horng;C. C. Tu; 吳建銘
國立中山大學 2005-12 A rigorous study of package and PCB effects on W-CDMA RFICs F.Y. Han;J.M. Wu;T.S. Horng;C.C. Tu
國立高雄師範大學 2005-11 Evaluation of package and PCB effects on RFICs in W-CDMA applications Jian-Ming Wu;F. Y. Han;T. S. Horng;C. C. Tu; 吳建銘
國立中山大學 2005-11 Evaluation of package and PCB effects on RFICs in W-CDMA applications F.Y. Han;J.M. Wu;T.S. Horng;C.C. Tu
國立高雄師範大學 2005-10 Direct-conversion quadrature modulator MMIC design with a new 90 degrees phase shifter including package and PCB effects for W-CDMA applications Jian-Ming Wu;F. Y. Han;T. S. Horng;J. Lin; 吳建銘
國立高雄師範大學 2005-10 Chip-Package-Board Codesign of W-CDMA RFICs Jian-Ming Wu;F. Y. Han;T. S. Horng; 吳建銘
國立中山大學 2005-10 Chip-Package-Board Codesign of W-CDMA RFICs F.Y. Han;J.M. Wu;T.S. Horng
國立中山大學 2005-10 Direct-conversion quadrature modulator MMIC design with a new 90 degrees phase shifter including package and PCB effects for W-CDMA applications J.M. Wu;F.Y. Han;T.S. Horng;J. Lin
國立中山大學 2005-10 A novel closed-form approach for comparing the Q-factor responses between the asymmetric and symmetric on-chip inductors T.S. Horng;C.H. Huang;F.Y. Han;C.J. Li
國立高雄師範大學 2005-06 Chip-package-board codesign of highly linear 3G-CDMA upconverter modules Jian-Ming Wu;F. Y. Han;T. S. Horng;C. C. Tu;R. Chen;C.H. Chu; 吳建銘
國立中山大學 2005-06 Chip-package-board codesign of highly linear 3G-CDMA upconverter modules F.Y. Han;J.M. Wu;T.S. Horng;C.C. Tu;R. Chen;C.H. Chu
國立高雄師範大學 2004-10 Package and PCB effects on linearity of a micromixer-based W-CDMA upconverter Jian-Ming Wu;F. Y. Han;J. K. Jau;T.S. Horng; 吳建銘

显示项目 1-25 / 28 (共2页)
1 2 > >>
每页显示[10|25|50]项目

DSpace Software Copyright © 2002-2004  MIT   &  Hewlett-Packard   /   Enhanced by   NTU Library IR team