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| 國立交通大學 |
2017-04-21T06:50:16Z |
Study of Self-Assembly Technology for 3D Integration Applications
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Chang, Hsiao-Chun; Fan, Cheng-Han; Chou, Yi-Chia; Chen, Kuan-Neng |
| 國立交通大學 |
2017-04-21T06:48:57Z |
Interdiffusion of Cu-Sn System with Ni Ultra-thin Buffer Layer and Material Analysis of IMC Growth Mechanism
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Fan, Cheng-Han; Chang, Yao-Jen; Chou, Yi-Chia; Chen, Kuan-Neng |
| 國立交通大學 |
2015-11-26T00:57:02Z |
自我組裝關鍵技術應用於三維積體電路研究
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范承翰; Fan, Cheng-Han; 周苡嘉; 陳冠能; Chou, Yi-Chia; Chen, Kuan-Neng |
| 國立交通大學 |
2014-12-08T15:35:46Z |
Electrical Investigation and Reliability of 3D Integration Platform using Cu TSVs and Micro-Bumps with Cu/Sn-BCB Hybrid Bonding
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Chang, Yao-Jen; Ko, Cheng-Ta; Hsiao, Zhi-Cheng; Chiang, Cheng-Hao; Fu, Huan-Chun; Yu, Tsung-Han; Fan, Cheng-Han; Lo, Wei-Chung; Chen, Kuan-Neng |
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