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Showing items 1-3 of 3 (1 Page(s) Totally) 1 View [10|25|50] records per page
國立交通大學 |
2019-04-02T06:04:32Z |
Three dimensional integration of ReRAMs
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Hudec, Boris; Chang, Che-Chia; Wang, I-Ting; Frohlich, Karol; Hou, Tuo-Hung |
國立交通大學 |
2017-04-21T06:56:24Z |
Interface engineered HfO2-based 3D vertical ReRAM
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Hudec, Boris; Wang, I-Ting; Lai, Wei-Li; Chang, Che-Chia; Jancovic, Peter; Frohlich, Karol; Micusik, Matej; Omastova, Maria; Hou, Tuo-Hung |
國立交通大學 |
2017-04-21T06:56:16Z |
3D resistive RAM cell design for high-density storage class memory-a review
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Hudec, Boris; Hsu, Chung-Wei; Wang, I-Ting; Lai, Wei-Li; Chang, Che-Chia; Wang, Taifang; Frohlich, Karol; Ho, Chia-Hua; Lin, Chen-Hsi; Hou, Tuo-Hung |
Showing items 1-3 of 3 (1 Page(s) Totally) 1 View [10|25|50] records per page
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