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Showing items 1-5 of 5 (1 Page(s) Totally)
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| 國立交通大學 |
2018-08-21T05:56:59Z |
Process Development and Material Characteristics of TSV-less Interconnection Technology for FOWLP
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Shen, Wen-Wei; Lin, Yu-Min; Chang, Hsiang-Hung; Kuo, Tzu-Ying; Fu, Huan-Chun; Lee, Yuan-Chang; Lee, Shu-Man; Lin, Ang-Ying; Huang, Shin-Yi; Chang, Tao-Chih; Lee, Alvin; Su, Jay; Huang, Baron; Bai, Dongshun; Liu, Xiao; Chen, Kuan-Neng |
| 國立交通大學 |
2014-12-08T15:36:21Z |
A Novel 3D Integration Scheme for Backside Illuminated CMOS Image Sensor Devices
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Ko, Cheng-Ta; Hsiao, Zhi-Cheng; Chang, Hsiang-Hung; Lyu, Dian-Rong; Hsu, Chao-Kai; Fu, Huan-Chun; Chien, Chun-Hsien; Lo, Wei-Chung; Chen, Kuan-Neng |
| 國立交通大學 |
2014-12-08T15:35:46Z |
Electrical Investigation and Reliability of 3D Integration Platform using Cu TSVs and Micro-Bumps with Cu/Sn-BCB Hybrid Bonding
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Chang, Yao-Jen; Ko, Cheng-Ta; Hsiao, Zhi-Cheng; Chiang, Cheng-Hao; Fu, Huan-Chun; Yu, Tsung-Han; Fan, Cheng-Han; Lo, Wei-Chung; Chen, Kuan-Neng |
| 國立交通大學 |
2014-12-08T15:23:44Z |
Adhesive Selection and Bonding Parameter Optimization for Hybrid Bonding in 3D Integration
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Chen, Kuan-Neng; Ko, Cheng-Ta; Hsiao, Zhi-Cheng; Fu, Huan-Chun; Lo, Wei-Chung |
| 國立交通大學 |
2014-12-08T15:23:37Z |
A Wafer-Level Three-Dimensional Integration Scheme With Cu TSVs Based on Microbump/Adhesive Hybrid Bonding for Three-Dimensional Memory Application
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Ko, Cheng-Ta; Hsiao, Zhi-Cheng; Chang, Yao-Jen; Chen, Peng-Shu; Hwang, Yu-Jiau; Fu, Huan-Chun; Huang, Jui-Hsiung; Chiang, Chia-Wen; Sheu, Shyh-Shyuan; Chen, Yu-Hua; Lo, Wei-Chung; Chen, Kuan-Neng |
Showing items 1-5 of 5 (1 Page(s) Totally)
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