臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)

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Institution	Date	Title	Author
國立交通大學	2014-12-08T15:45:37Z	Copper electroplating for future ultralarge scale integration interconnection	Gau, WC; Chang, TC; Lin, YS; Hu, JC; Chen, LJ; Chang, CY; Cheng, CL
國立交通大學	2014-12-08T15:44:54Z	Copper electroplating for future ultralarge scale integration interconnection (vol 18, pg 656, 2000)	Gau, WC; Chang, TC; Lin, YS; Hu, JC; Chen, LJ; Chang, CY; Cheng, CL

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