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| 臺大學術典藏 |
2022-09-21T23:30:34Z |
Thermal Compression Cu-Cu bonding using electroless Cu and the evolution of voids within bonding interface
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Huang, C. H.; Shih, P. S.; Huang, J. H.; Grafner, S. J.; Chen, Y. A.; Kao, C. R. |
| 臺大學術典藏 |
2022-09-21T23:30:34Z |
Development of Cu-Cu Side-by-Side Interconnection Using Controlled Electroless Cu Plating
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Chen, Y. A.; Shih, P. S.; Chang, F. L.; Grafner, S. J.; Huang, J. H.; Huang, C. H.; Kao, C. R.; Lin, Y. S.; Hung, Y. C.; Kao, C. L.; Tarng, D. |
| 臺大學術典藏 |
2022-09-21T23:30:33Z |
A novel method of low temperature, pressureless interconnection for wafer level scale 3D packaging
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Shih, P. S.; Shen, C. H.; Chen, Y. A.; Huang, C. H.; Grafner, S. J.; Huang, J. H.; Kao, C. R. |
| 臺大學術典藏 |
2022-09-21T23:30:32Z |
Flow in a microchannel filled with arrays of numerous pillars
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Gräfner, S. J.; Wu, P. Y.; Kao, C. R. |
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