English  |  正體中文  |  简体中文  |  2828323  
???header.visitor??? :  32232420    ???header.onlineuser??? :  923
???header.sponsordeclaration???
 
臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)
???ui.leftmenu.abouttair???

???ui.leftmenu.bartitle???

???index.news???

???ui.leftmenu.copyrighttitle???

???ui.leftmenu.link???

"h c teng"???jsp.browse.items-by-author.description???

???jsp.browse.items-by-author.back???
???jsp.browse.items-by-author.order1??? ???jsp.browse.items-by-author.order2???

Showing items 1-5 of 5  (1 Page(s) Totally)
1 
View [10|25|50] records per page

Institution Date Title Author
義守大學 2013-01 A FUNCTIONAL MICROSTRIP CIRCUIT MODULE FOR ANNULAR SLOT ANTENNA Y.-M. Lee;S. T. Wang;H.-C. Teng;S. Cherng
義守大學 2012-10 A novel embedded microstrip circuit module design for patch antenna Y.-M. Lee;H.-C. Teng;S. Cherng;S.T. Wang
國立中山大學 2002 The Influence of Thermal Aging on Joint Strength and Fracture Surface of Pb/Sn and Au/Sn Solders in Laser Diode Packages M.T. Sheen; C.M. Chang; H.C. Teng; J.H. Kuang; K.C. Hsich; W.H. Cheng
國立中山大學 2002 The Influence of Thermal Aging on Joint Strength and Fracture Surface of Pb/Sn and Au/Sn Solders in Laser Diode Packages M.T. Sheen;C.M. Chang;H.C. Teng;J.H. Kung;K.C. Hsieh;W.H. Cheng;
國立中山大學 2002 sThe Influence of Thermal Aging on Joint Strength and Fracture Surface of PbSn and AuSn Solders in Laser Diode Packages M.T. Sheen;C.M. Chang;H.C. Teng;J.H. Kuang;K.C. Hsieh;W.H. Cheng

Showing items 1-5 of 5  (1 Page(s) Totally)
1 
View [10|25|50] records per page