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Institution Date Title Author
元智大學 Nov-23 High-frequency signal transmission in a coplanar waveguide structure with different surface finishes Y. C. Chiang; H. W. Tseng; C. J. Yu; C. Y. Lee; Chien-Chang Huang; Cheng-En Ho
元智大學 2021/12/21 Microstructure Modification of Copper Interconnects and Their Transmission Losses at 1–40 GHz C. Y. Lee; S. Kao; J. C. Yu; Y. K. Hsiung; H. W. Tseng; Chien-Chang Huang; Cheng-En Ho
元智大學 2021/12/21 Microstructure Modification of Copper Interconnects and Their Transmission Losses at 1–40 GHz C. Y. Lee; S. Kao; J. C. Yu; Y. K. Hsiung; H. W. Tseng; Chien-Chang Huang; Cheng-En Ho
元智大學 2021/12/21 3D Electromagnetic Simulation and VNA Measurements of Signal Transmission Loss of Cu Interconnects at 1–100 GHz: Surface Finish Effect C. J. Yu; H. W. Tseng; S. Kao; C. Y. Lee; Chien-Chang Huang; Cheng-En Ho
元智大學 2021/12/21 3D Electromagnetic Simulation and VNA Measurements of Signal Transmission Loss of Cu Interconnects at 1–100 GHz: Surface Finish Effect C. J. Yu; H. W. Tseng; S. Kao; C. Y. Lee; Chien-Chang Huang; Cheng-En Ho
元智大學 2021/11/13 Electromagnetic Simulation and VNA Measurements of Surface Finish Effect on the Cu Interconnect Transmission Characteristics at 1–100 GHz J. C. Yu; H. W. Tseng; C. Y. Lee; P. C. Hsu; Chien-Chang Huang; Cheng-En Ho
元智大學 2021/11/13 Improvement of High-frequency Transmission Performance through Copper Microstructure Modification C. Y. Lee; J. C. Yu; Y. K. Hsiung; H. W. Tseng; Chien-Chang Huang; Cheng-En Ho
元智大學 2021/11/13 Electromagnetic Simulation and VNA Measurements of Surface Finish Effect on the Cu Interconnect Transmission Characteristics at 1–100 GHz J. C. Yu; H. W. Tseng; C. Y. Lee; P. C. Hsu; Chien-Chang Huang; Cheng-En Ho
元智大學 2021/11/13 Improvement of High-frequency Transmission Performance through Copper Microstructure Modification C. Y. Lee; J. C. Yu; Y. K. Hsiung; H. W. Tseng; Chien-Chang Huang; Cheng-En Ho
元智大學 2020/10/21 Electromagnetic Properties of Ni(P) and Its Signal Transmission Performance in 5G Communication Applications W. L. Chou; H. W. Tseng; C. J. Yu; C. Y. Lee; Huei-Ru Fuh; T. T. Kuo; Chien-Chang Huang; Cheng-En Ho

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