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Showing items 81-127 of 127 (3 Page(s) Totally) << < 1 2 3 > >> View [10|25|50] records per page
| 臺大學術典藏 |
2019 |
The role of humidity in associations of high temperature with mortality: A multicountry, multicity study
|
Armstrong B.;Sera F.;Vicedo-Cabrera A.M.;Abrutzky R.;?str?m D.O.;Bell M.L.;Chen B.-Y.;Coelho M.S.Z.S.;Correa P.M.;Dang T.N.;Diaz M.H.;Van Dung D.;Forsberg B.;Goodman P.;Yue-Liang Guo;Guo Y.;Hashizume M.;Honda Y.;Indermitte E.;??iguez C.;Kan H.;Kim H.;Kysel? J.;Lavigne E.;Michelozzi P.;Orru H.;Ortega N.V.;Pascal M.;Ragettli M.S.;Saldiva P.H.N.;Schwartz J.;Scortichini M.;Seposo X.;Tobias A.;Tong S.;Urban A.;Valencia C.D.L.C.;Zanobetti A.;Zeka A.;Gasparrini A.; Gasparrini A.; Zeka A.; Zanobetti A.; Valencia C.D.L.C.; Armstrong B.; Sera F.; Vicedo-Cabrera A.M.; Abrutzky R.; Åström D.O.; Bell M.L.; Chen B.-Y.; Coelho M.S.Z.S.; Correa P.M.; Dang T.N.; Diaz M.H.; Van Dung D.; Forsberg B.; Goodman P.; YUE-LIANG GUO; Guo Y.; Hashizume M.; Honda Y.; Indermitte E.; Íñiguez C.; Kan H.; Kim H.; Kysel? J.; Lavigne E.; Michelozzi P.; Orru H.; Ortega N.V.; Pascal M.; Ragettli M.S.; Saldiva P.H.N.; Schwartz J.; Scortichini M.; Seposo X.; Tobias A.; Tong S.; Urban A. |
| 國家衛生研究院 |
2018-09-13 |
Temperature-related mortality impacts under and beyond Paris Agreement climate change scenarios
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Vicedo-Cabrera, AM;Guo, Y;Sera, F;Huber, V;Schleussner, CF;Mitchell, D;Tong, S;Coelho, MSZS;Saldiva, PHN;Lavigne, E;Correa, PM;Ortega, NV;Kan, H;Osorio, S;Kyselý, J;Urban, A;Jaakkola, JJK;Ryti, NRI;Pascal, M;Goodman, PG;Zeka, A;Michelozzi, P;Scortichini, M;Hashizume, M;Honda, Y;Hurtado-Diaz, M;Cruz, J;Seposo, X;Kim, H;Tobias, A;Íñiguez, C;Forsberg, B;Åström, DO;Ragettli, MS;Röösli, M;Guo, YL;Wu, CF;Zanobetti, A;Schwartz, J;Bell, ML;Dang, TN;Do Van, D;Heaviside, C;Vardoulakis, S;Hajat, S;Haines, A;Armstrong, B;Ebi, KL;Gasparrini, A |
| 臺大學術典藏 |
2018-09-10T18:04:21Z |
Heat wave and mortality: A multicountry, multicommunity study
|
Guo, Y. ; Gasparrini, A. ; Armstrong, B.G. ; Tawatsupa, B. ; Tobias, A. ; Lavigne, E. ; De Sousa Zanotti Stagliorio Coelho, M. ; Pan, X. ; Kim, H. ; Hashizume, M. ; Honda, Y. ; Leon Guo, Y.-L. ; Wu, C.-F. ; Zanobetti, A. ; Schwartz, J.D. ; Bell, M.L. ; Scortichini, M. ; Michelozzi, P. ; Punnasiri, K. ; Li, S. ; Tian, L. ; Garcia, S.D.O. ; Seposo, X. ; Overcenco, A. ; Zeka, A. ; Goodman, P. ; Dang, T.N. ; Van Dung, D. ; Mayvaneh, F. ; Saldiva, P.H.N. ; Williams, G. ; Tong, S.; CHANG-FU WU |
| 臺大學術典藏 |
2018-09-10T18:04:21Z |
Longer-term impact of high and low temperature on mortality: An international study to clarify length of mortality displacement
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Armstrong, B. ; Bell, M.L. ; Coelho, M.S.Z.S. ; Guo, Y.-L.L. ; Guo, Y. ; Goodman, P. ; Hashizume, M. ; Honda, Y. ; Kim, H. ; Lavigne, E. ; Michelozzi, P. ; Saldiva, P.H.N. ; Schwartz, J. ; Scortichini, M. ; Sera, F. ; Tobias, A. ; Tong, S. ; Wu, C.-F. ; Zanobetti, A. ; Zeka, A. ; Gasparrini, A.; CHANG-FU WU |
| 臺大學術典藏 |
2018-09-10T15:38:04Z |
Temperature variability and mortality: A multi-country study
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Guo, Y. ; Gasparrini, A. ; Armstrong, B.G. ; Tawatsupa, B. ; Tobias, A. ; Lavigne, E. ; Zanotti Stagliorio Coelho, M.S. ; Pan, X. ; Kim, H. ; Hashizume, M. ; Honda, Y. ; Guo, Y.L. ; Wu, C.-F. ; Zanobetti, A. ; Schwartz, J.D. ; Bell, M.L. ; Overcenco, A. ; Punnasiri, K. ; Li, S. ; Tian, L. ; Saldiva, P. ; Williams, G. ; Tong, S.; CHANG-FU WU; YUE-LIANG GUO |
| 臺大學術典藏 |
2018-09-10T15:38:03Z |
Comprehensive approach to understand the association between diurnal temperature range and mortality in East Asia
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Kim, J. ; Shin, J. ; Lim, Y.-H. ; Honda, Y. ; Hashizume, M. ; Guo, Y.L. ; Kan, H. ; Yi, S. ; Kim, H.; YUE-LIANG GUO |
| 臺大學術典藏 |
2018-09-10T15:21:59Z |
Mortality risk attributable to high and low ambient temperature: A multicountry observational study
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CHANG-FU WU; YUE-LIANG GUO; Gasparrini, A.;Guo, Y.;Hashizume, M.;Lavigne, E.;Zanobetti, A.;Schwartz, J.;Tobias, A.;Tong, S.;Rockl{\\"O |
| 臺大學術典藏 |
2018-09-10T15:21:58Z |
Short-term exposure to fine and coarse particles and mortality: A multicity time-series study in East Asia
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Lee, H.;Honda, Y.;Hashizume, M.;Guo, Y.L.;Wu, C.-F.;Kan, H.;Jung, K.;Lim, Y.-H.;Yi, S.;Kim, H.; CHANG-FU WU; YUE-LIANG GUO |
| 臺大學術典藏 |
2018-09-10T15:17:17Z |
Mortality related to extreme temperature for 15 Cities in Northeast Asia
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Chung, Y.;Lim, Y.-H.;Honda, Y.;Guo, Y.-L.L.;Hashizume, M.;Bell, M.L.;Chen, B.-Y.;Kim, H.; YUE-LIANG GUO |
| 臺大學術典藏 |
2018-09-10T14:56:42Z |
Global variation in the effects of ambient temperature on mortality: A systematic evaluation
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Guo, Y. ; Gasparrini, A. ; Armstrong, B. ; Li, S. ; Tawatsupa, B. ; Tobias, A. ; Lavigne, E. ; De Sousa Zanotti Stagliorio Coelho, M. ; Leone, M. ; Pan, X. ; Tong, S. ; Tian, L. ; Kim, H. ; Hashizume, M. ; Honda, Y. ; Guo, Y.-L.L. ; Wu, C.-F. ; Punnasiri, K. ; Yi, S.-M. ; Michelozzi, P. ; Saldiva, P.H.N. ; Williams, G.; CHANG-FU WU; YUE-LIANG GUO |
| 國家衛生研究院 |
2018-07-31 |
Quantifying excess deaths related to heatwaves under climate change scenarios: A multicountry time series modelling study
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Guo, Y;Gasparrini, A;Li, S;Sera, F;Vicedo-Cabrera, AM;de Sousa Zanotti Stagliorio Coelho, M;Saldiva, PHN;Lavigne, E;Tawatsupa, B;Punnasiri, K;Overcenco, A;Correa, PM;Ortega, NV;Kan, H;Osorio, S;Jaakkola, JJK;Ryti, NRI;Goodman, PG;Zeka, A;Michelozzi, P;Scortichini, M;Hashizume, M;Honda, Y;Seposo, X;Kim, H;Tobias, A;��iguez, C;Forsberg, B;�str�m, DO;Guo, YL;Chen, BY;Zanobetti, A;Schwartz, J;Dang, TN;Van, DD;Bell, ML;Armstrong, B;Ebi, KL;Tong, S |
| 國立臺灣科技大學 |
2018 |
A design for testability of open defects at interconnects in 3D stacked ICs
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Ashikin F.; Hashizume M.; Yotsuyanagi H.; Lu S.-K.; Roth Z. |
| 國立臺灣科技大學 |
2018 |
Address Remapping Techniques for Enhancing Fabrication Yield of Embedded Memories
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Lu S.-K.; Jheng H.-C.; Lin H.-W.; Hashizume M. |
| 國立臺灣科技大學 |
2018 |
Fault Leveling Techniques for Yield and Reliability Enhancement of NAND Flash Memories
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Lu S.-K.; Zhong S.-X.; Hashizume M. |
| 國立臺灣科技大學 |
2018 |
A defective level monitor of open defects in 3D ICs with a comparator of offset cancellation type
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Kanda, M.;Hashizume, M.;Yotsuyanagi, H.;Lu, S.-K. |
| 國立臺灣科技大學 |
2018 |
A defect level monitor of resistive open defect at interconnects in 3D ICs by injected charge volume
|
Ohtani, K.;Osato, N.;Hashizume, M.;Yotsuyanagi, H.;Lu, S.-K. |
| 國立臺灣科技大學 |
2018 |
Open defect detection with a built-in test circuit by IDDT appearance time in CMOS ICs
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Kambara A.; Yotsuyanagi H.; Miyoshi D.; Hashizume M.; Lu S.-K. |
| 國立臺灣科技大學 |
2018 |
Fault-aware page address remapping techniques for enhancing yield and reliability of flash memories
|
Lu S.-K.; Yu S.-C.; Hashizume M.; Yotsuyanagi H. |
| 國家衛生研究院 |
2017-08-10 |
Heat wave and mortality: A multicountry, multicommunity study
|
Guo, Y;Gasparrini, A;Armstrong, BG;Tawatsupa, B;Tobias, A;Lavigne, E;Coelho, M;Pan, X;Kim, H;Hashizume, M;Honda, Y;Guo, YL;Wu, CF;Zanobetti, A;Schwartz, JD;Bell, ML;Scortichini, M;Michelozzi, P;Punnasiri, K;Li, S;Tian, L;Garcia, SDO;Seposo, X;Overcenco, A;Zeka, A;Goodman, P;Dang, TN;Dung, DV;Mayvaneh, F;Saldiva, PHN;Williams, G;Tong, S |
| 國家衛生研究院 |
2017-05 |
Temporal changes in mortality related to extreme temperatures for 15 cities in northeast Asia: Adaptation to heat and maladaptation to cold
|
Chung, Y;Noh, H;Honda, Y;Hashizume, M;Bell, ML;Guo, YLL;Kim, H |
| 國立臺灣科技大學 |
2017 |
Electrical tests for capacitive open defects in assembled PCBs
|
Alia, F.A.B.;Odoriba, A.;Hashizume, M.;Yotsuyanagi, H.;Lu, S.-K. |
| 國立臺灣科技大學 |
2017 |
Electrical test of resistive and capacitive open defects at data bus in 3D memory IC
|
Hashizume, M.;Shiraishi, Y.;Yotsuyanagi, H.;Yokoyama, H.;Tada, Tada T.;Lu, S.-K. |
| 國立臺灣科技大學 |
2017 |
Resistive open defects detected by interconnect testing based on charge volume injected to 3D ICs
|
Ohtani, K.;Osato, N.;Hashizume, M.;Yotsuyanagi, H.;Lu, S.-K. |
| 國立臺灣科技大學 |
2017 |
A built-in current sensor made of a comparator of offset cancellation type for electrical interconnect tests of 3D ICs
|
Kanda, M.;Hashizume, M.;Yotsuyanagi, H.;Lu, S.-K. |
| 國立臺灣科技大學 |
2016 |
Integration of Hard Repair Techniques with ECC for Enhancing Fabrication Yield and Reliability of Embedded Memories
|
Lu, S.-K;Tsai, C.-J;Hashizume, M. |
| 國立臺灣科技大學 |
2016 |
A built-in electrical test circuit for detecting open leads in assembled PCB circuits
|
Miyabe, T;Hashizume, M;Yotsuyanagi, H;Lu, S.-K;Roth, Z. |
| 國立臺灣科技大學 |
2016 |
Electrical interconnect test of solder joint part with boundary scan flip flops and a built-in test circuit
|
Hashizume, M;Ikiri, Y;Konishi, T;Yotsuyanagi, H;Lu, S.-K. |
| 國立臺灣科技大學 |
2016 |
Enhanced Built-In Self-Repair Techniques for Improving Fabrication Yield and Reliability of Embedded Memories
|
Lu, S.-K;Tsai, C.-J;Hashizume, M. |
| 國立臺灣科技大學 |
2016 |
A power supply circuit for interconnect tests based on injected charge volume of 3D IC
|
Ohtani, K;Hashizume, M;Suga, D;Yotsuyanagi, H;Lu, S.-K. |
| 國立臺灣科技大學 |
2016 |
A built-in defective level monitor of resistive open defects in 3D ICs with logic gates
|
Hashizume, M;Odoriba, A;Yotsuyanagi, H;Lu, S.-K. |
| 國立臺灣科技大學 |
2016 |
Testability for resistive open defects by electrical interconnect test of 3D ICs without boundary scan flip flops
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Ali, F.A.B;Hashizume, M;Ikiri, Y;Yotsuyanagi, H;Lu, S.-K. |
| 國立臺灣科技大學 |
2016 |
Adaptive ECC Techniques for Yield and Reliability Enhancement of Flash Memories
|
Lu, S.-K;Zhong, S.-X;Hashizume, M. |
| 國立臺灣科技大學 |
2016 |
An enhanced built-in self-repair technique for yield and reliability improvement of embedded memories
|
Lu, S.-K;Lin, H.-W;Hashizume, M. |
| 國立臺灣科技大學 |
2015 |
Address scrambling and data inversion techniques for yield enhancement of NROM-Based ROMs
|
Lu, S.-K.;Li, T.-L.;Hashizume, M.;Chen, J.-L. |
| 國立臺灣科技大學 |
2015 |
Electrical interconnect test method of 3D ICs by injected charge volume
|
Suga, D.;Hashizume, M.;Yotsuyanagi, H.;Lu, S.-K. |
| 國立臺灣科技大學 |
2015 |
Hybrid scrambling technique for increasing the fabrication yield of NROM-Based ROMs
|
Lu, S.-K.;Lin, S.-L.;Lin, H.-W.;Hashizume, M. |
| 國立臺灣科技大學 |
2015 |
Electrical interconnect test of 3D ICs made of dies without ESD protection circuits with a built-in test circuit
|
Nanbara, K.;Odoriba, A.;Hashizume, M.;Yotsuyanagi, H.;Lu, S.-K. |
| 國立臺灣科技大學 |
2015 |
A testable design for electrical interconnect tests of 3D ICs
|
Odoriba, A.;Umezu, S.;Hashizume, M.;Yotsuyanagi, H.;Ali, F.A.B.;Lu, S.-K. |
| 國立臺灣科技大學 |
2015 |
An enhanced built-in self-repair technique for yield and reliability improvement of embedded memories
|
Lu, S.-K;Lin, H.-W;Hashizume, M. |
| 國立臺灣科技大學 |
2015 |
Electrical interconnect test method of 3D ICs without boundary scan flip flops
|
Hashizume, M;Umezu, S;Ikiri, Y;Ali, F.A.B;Yotsuyanagi, H;Lu, S.-K. |
| 臺大學術典藏 |
2014 |
Effect of Asian dust storms on mortality in three Asian cities
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YUE-LIANG GUO; Lee, H. ; Honda, Y. ; Lim, Y.-H. ; Guo, Y.L. ; Hashizume, M. ; Kim, H. |
| 國立臺灣科技大學 |
2013 |
Testable design for electrical testing of open defects at interconnects in 3D ICs
|
Hashizume, M.;Konishi, T.;Yotsuyanag, H.;Lu, S.-K. |
| 國立臺灣科技大學 |
2013 |
Reduction method of number of electromagnetic simulation times for estimating output voltage at hard open TSV in 3D IC
|
Haraguchi, E.;Hashizume, M.;Manabe, K.;Yotsuyanagi, H.;Tada, T.;Lu, S.-K.;Roth, Z. |
| 國立臺灣科技大學 |
2013 |
Built-in IDDT appearance time sensor for detecting open faults in 3D IC
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Suenaga, S.;Hashizume, M.;Yotsuyanagi, H.;Tada, T.;Lu, S.-K. |
| 國立臺灣科技大學 |
2013 |
Fault scrambling techniques for yield enhancement of embedded memories
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Lu, S.-K.;Jheng, H.-C.;Hashizume, M.;Huang, J.-L.;Ning, P. |
| 國立臺灣科技大學 |
2013 |
DFT for supply current testing to detect open defects at interconnects in 3D ICs
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Suenaga, S.;Hashizume, M.;Yotsuyanagi, H.;Lu, S.-K.;Roth, Z. |
| 國立臺灣科技大學 |
2013 |
An efficient test and repair flow for yield enhancement of one-time-programming NROM-based ROMs
|
Li, T.-L.;Hashizume, M.;Lu, S.-K. |
Showing items 81-127 of 127 (3 Page(s) Totally) << < 1 2 3 > >> View [10|25|50] records per page
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