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臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)
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Institution Date Title Author
義守大學 2008/08/20 Dynamic scanning method to clarify the mechanism of WLCSP package reliability issue Po-Ying Chen ; Chwei-Shyong Tsai ; Ming-Hsiung Tsai ; Heng-Yu Kung ; Shen-Li Chen ; Jing, M.H. ; Wen-Kuan Yeh
義守大學 2008-10 Elucidating the effects of current stress history on reliability characteristics by dynamic analysis Po-Ying Chen;Shen-Li Chen;Ming-Hsiung Tsai;Wen-Kuan Yeh;Heng-Yu Kung;YuKon Chang
義守大學 2008-02 Reliability and characteristics of wafer-level chip-scale packages under current stress Po-Ying Chen;Heng-Yu Kung;Yi-Shao Lai;Ming Hsiung Tsai;Wen-Kuan Yeh
義守大學 2006/12/06 The effect of stressing history in reliability characteristics Po-Ying Chen ; Heng-Yu Kung ; Yi-Shao Lai ; Wen-Kuan Yeh

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