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Showing items 26-32 of 32 (2 Page(s) Totally)
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| 國立臺灣大學 |
2001-09 |
Reflow soldering and isothermal solid-state aging of Sn-Ag eutectic solder on Au/Ni surface finish
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Liu, C. M.; Ho, C. E.; Chen, W. T.; Kao, and C. R. |
| 國立臺灣大學 |
2001-04 |
Interactions between solder and metallization during long-term aging of advanced microelectronic packages
|
Ho, C. E.; Chen, W. T.; Kao, and C. R. |
| 國立臺灣大學 |
2001-02 |
Selective interfacial reaction between Ni and Eutectic BiSn lead-free solder
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Tao, W. H.; Chen, C.; Ho, C. E.; Chen, W. T.; Kao, and C. R. |
| 國立臺灣大學 |
2000-10 |
Formation and resettlement of (AuxNi1-x)Sn4 in solder joints of ball-grid-array packages with the Au/Ni surface finish
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Ho, C. E.; Zheng, R.; Luo, G. L.; Lin, A. H.; Kao, and C. R. |
| 國立臺灣大學 |
2000-09 |
Optimizing the wire-bonding parameters for second bond in ball grid array packages
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Ho, C. E.; Chen, C.; Kao, and C. R. |
| 國立臺灣大學 |
1999-11 |
Reaction kinetics of the solder-balls with pads in BGA packages during reflow soldering
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Ho, C. E.; Chen, Y. M.; Kao, and C. R. |
| 國立臺灣大學 |
1999-04 |
Phase relation in the titanium-rich region of the Ge-Si-Ti ternary system
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Jain, T. A.; Huang, C.G.; Ho, C. E.; Kao, and C. R. |
Showing items 26-32 of 32 (2 Page(s) Totally)
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