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| 臺大學術典藏 |
2022-04-21T23:17:26Z |
Synchrotron X-ray study of electromigration, whisker growth, and residual strain evolution in a Sn Blech structure
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Lee, Pei Tzu; Hsieh, Wan Zhen; Lee, Cheng Yu; Tseng, Shao Chin; Tang, Mau Tsu; Chiang, Ching Yu; Kao, C. R.; Ho, Cheng En |
| 國立成功大學 |
2014-12 |
Experimental Determination and Thermodynamic Modeling of the Sn-Rich Corner of the Ternary Ni-Pd-Sn Phase Diagram at 250 degrees C
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Rahman, Md. Arifur; Ho, Cheng En; Gierlotka, Wojciech; Kuo, Jui Chao |
| 國立成功大學 |
2011-05-15 |
Current stressing-induced growth of Cu(3)Sn in Cu/Sn/Cu solder joints
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Chen, Delphic; Ho, Cheng-En; Kuo, Jui-Chao |
| 國立臺灣大學 |
2011 |
Effects of Joining Sequence on the Interfacial Reactions and Substrate Dissolution Behaviors in Ni/Solder/Cu Joints
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Liu, Chao Sheng; Ho, Cheng En; Peng, Cheng Sam; Kao, C.Robert |
| 國立成功大學 |
2010-06-24 |
低損耗微波介電材料 (Mg1-xNix)2TiO4 在無線通訊元件之應用
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何承恩; Ho, Cheng-En |
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