| 國立成功大學 |
2004-02-01 |
Dielectric property and structure of anodic alumina template and their effects on the electrophoretic deposition characteristics of ZnO nanowire arrays
|
Wang, Y. C.; Leu, Ing-Chi; Hon, Min-Hsiung |
| 國立成功大學 |
2004-02 |
Effect of thermal cycling on the adhesion strength of Sn-9Zn-xAg-Cu interface
|
Chang, Tao-Chih; Hon, Min-Hsiung; Wang, Moo-Chin; Lin, Dong-Yih |
| 國立成功大學 |
2004-01 |
Kinetics of electrophoretic deposition for nanocrystalline zinc oxide coatings
|
Wang, Yuan-Chung; Leu, Ing-Chi; Hon, Min-Hsiung |
| 國立成功大學 |
2004-01 |
Sheath-dependent orientation control of carbon nanofibres and carbon nanotubes during plasma-enhanced chemical vapour deposition
|
Lin, Chien-Chih; Leu, Ing-Chi; Yen, Jung-Hsien; Hon, Min-Hsiung |
| 國立成功大學 |
2004 |
Size control of ZnO nanofibril within template by electrophoretic deposition
|
Wang, Yuan-Chung; Leu, Ing-Chi; Hon, Min-Hsiung |
| 國立成功大學 |
2004 |
Preparation of Ni nanodot and nanowire arrays using porous alumina on silicon as a template without a conductive interlayer
|
Wu, Min-Tao; Leu, Ing-Chi; Yen, Jung-Hsien; Hon, Min-Hsiung |
| 國立成功大學 |
2004 |
Density control for carbon nanotube arrays synthesized by ICP-CVD using AAO/Si as a nanotemplate
|
Yen, Jung-Hsien; Leu, Ing-Chi; Wu, Min-Tao; Lin, Chien-Chih; Hon, Min-Hsiung |
| 國立成功大學 |
2004 |
Electrochemical behavior of nanocrystalline tin oxide electrodeposited on a Cu substrate for Li-ion batteries
|
Chang, S. T.; Leu, Ing-Chi; Liao, C. L.; Yen, Jung-Hsien; Hon, Min-Hsiung |
| 國立成功大學 |
2004 |
Electrochemical behaviors of the Sn-9Zn-xAg lead-free solders in a 3.5 wt % NaCl solution
|
Chang, Tao-Chih; Hon, Min-Hsiung; Wang, Moo-Chin; Lin, Dong-Yih |
| 國立成功大學 |
2004 |
Morphology and phase transformation at a solder joint in a solid-state reaction
|
Chang, Tao-Chih; Hon, Min-Hsiung; Wang, Moo-Chin |
| 國立成功大學 |
2003-12 |
Preparation and characterization of pH sensitive sugar mediated (polyethylene glycol/chitosan) membrane
|
Wang, Jian-Wen; Hon, Min-Hsiung |
| 國立成功大學 |
2003-11-15 |
Sensitivity properties of a novel NO2 gas sensor based on mesoporous WO3 thin film
|
Teoh, L. G.; Hon, Y. M.; Shieh, J.; Lai, W. H.; Hon, Min-Hsiung |
| 國立成功大學 |
2003-10-06 |
Enhancement of the wettability and solder joint reliability at the Sn-9Zn0.5Ag lead-free solder alloy-Cu interface by Ag precoating
|
Chang, Tao-Chih; Hsu, Ying-Tun; Hon, Min-Hsiung; Wang, Moo-Chin |
| 國立成功大學 |
2003-08 |
Pore structure and permeation properties of kaolin-silica-alumina ceramics
|
Chen, Yung-Feng; Wang, Moo-Chin; Hon, Min-Hsiung |
| 國立成功大學 |
2003-08 |
High sensitivity semiconductor NO2 gas sensor based on mesoporous WO3 thin film
|
Teoh, L. G.; Hung, I-Ming; Shieh, J.; Lai, W. H.; Hon, Min-Hsiung |
| 國立成功大學 |
2003-07-20 |
Texture effect of hot-pressed magnesium fluoride on optical transmittance
|
Chang, Chen-Shen; Hon, Min-Hsiung |
| 國立成功大學 |
2003-07-15 |
The preparation of ITO films via a chemical solution deposition process
|
Tsai, Ming-Shyong; Wang, Chang-Long; Hon, Min-Hsiung |
| 國立成功大學 |
2003-07 |
Transformation kinetics for mullite in kaolin-Al2O3 ceramics
|
Chen, Yung-Feng; Wang, Moo-Chin; Hon, Min-Hsiung |
| 國立成功大學 |
2003-06 |
Solid-state reactions at the Sn-9Zn-xAg lead-free solders/Cu interface
|
Chang, Tao-Chih; Hon, Min-Hsiung; Wang, Moo-Chin |
| 國立成功大學 |
2003-06 |
Adhesion strength of the Sn-9Zn-xAg/Cu interface
|
Chang, Tao-Chih; Hon, Min-Hsiung; Wang, Moo-Chin |
| 國立成功大學 |
2003-05-25 |
Effects of Al2O3 addition on the phases, flow characteristics and morphology of the porous kaolin ceramics
|
Chen, Yung-Feng; Chang, Yu-Hsein; Wang, Moo-Chin; Hon, Min-Hsiung |
| 國立成功大學 |
2003-05-01 |
Crystal growth of the intermetallic compounds at the Sn-9Zn-xAg/Cu interface during isothermal aging
|
Chang, Tao-Chih; Wang, Moo-Chin; Hon, Min-Hsiung |
| 國立成功大學 |
2003-05 |
Effect of Ag addition on the structures of intermetallic compounds and the adhesion strength of the Sn-9Zn-xAg/Cu interface
|
Chang, Tao-Chih; Wang, Moo-Chin; Hon, Min-Hsiung |
| 國立成功大學 |
2003-04-30 |
Intermetallic compounds formed at the interface between Cu substrate and an Sn-9Zn-0.5Ag lead-free solder
|
Chang, Tao-Chih; Hon, Min-Hsiung; Wang, Moo-Chin |
| 國立成功大學 |
2003-03-24 |
Intermetallic compounds formation and interfacial adhesion strength of Sn-9Zn-0.5Ag solder alloy hot-dipped on Cu substrate
|
Chang, Tao-Chih; Hon, Min-Hsiung; Wang, Moo-Chin |
