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Showing items 1-8 of 8 (1 Page(s) Totally)
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| 臺大學術典藏 |
2020-01-13T08:21:50Z |
Molecular dynamics study of copper trench filling in damascene process
|
Hong, R.T.; Huang, M.J.; Yang, J.Y.; MEI-JIAU HUANG |
| 臺大學術典藏 |
2020-01-13T08:21:49Z |
A comparative molecular dynamics study of copper trench fill properties between Ta and Ti barrier layers
|
Yang, J.Y.; Hong, R.T.; Huang, M.J.; MEI-JIAU HUANG |
| 國立臺灣大學 |
2005-12 |
Molecular Dynamics Study of Copper Trench-Filling in Damascene Process
|
Hong, R. T.; Huang, M. J.; Yang, J. Y. |
| 國立臺灣大學 |
2005-12 |
A Comparative Molecular Dynamics Study of Copper Trench Fill Properties between Ta and Ti Barrier Layer
|
Yang, J. Y.; Hong, R. T.; Huang, M. J. |
| 國立臺灣大學 |
2005-11 |
Molecular Dynamics Study of Copper Trench-Filling in Damascene Process
|
Hong, R. T.; Huang, M. J.; Yang, J. Y. |
| 國立臺灣大學 |
2005 |
A Comparative Molecular Dynamics Study of Copper Trench Fill Properties between Ta and Ti Barrier Layer
|
Yang, J. Y.; Hong, R. T.; Huang, M. J. |
| 國立臺灣大學 |
2005 |
A comparative molecular dynamics study of copper trench fill properties between Ta and Ti barrier layers
|
Yang, J.Y.; Hong, R.T.; Huang, M.J. |
| 國立臺灣大學 |
2005 |
Molecular dynamics study of copper trench filling in damascene process
|
Hong, R.T.; Huang, M.J.; Yang, J.Y. |
Showing items 1-8 of 8 (1 Page(s) Totally)
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