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Showing items 121-145 of 180 (8 Page(s) Totally)
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Institution	Date	Title	Author
臺大學術典藏	2018-09-10T06:58:52Z	Novel approach to fabrication of 3D micro-structures by laser machining	Young, H.-T.; Lin, F.-F.; Hong, S.-B.; HONG-TSU YOUNG
臺大學術典藏	2018-09-10T06:58:52Z	3D micro-scale profile measuring system	HONG-TSU YOUNG;Lin, W.Y.;Young, H.-T.;HONG-TSU YOUNG; Young, H.-T.; Lin, W.Y.; HONG-TSU YOUNG
臺大學術典藏	2018-09-10T06:58:52Z	3D micro-scale profile measuring system	HONG-TSU YOUNG;Lin, W.Y.;Young, H.-T.;HONG-TSU YOUNG; Young, H.-T.; Lin, W.Y.; HONG-TSU YOUNG
臺大學術典藏	2018-09-10T06:58:52Z	3D micro-scale profile measuring system	HONG-TSU YOUNG;Lin, W.Y.;Young, H.-T.;HONG-TSU YOUNG; Young, H.-T.; Lin, W.Y.; HONG-TSU YOUNG
臺大學術典藏	2018-09-10T06:25:55Z	Integrated rough machining methodology for centrifugal impeller manufacturing	Chuang, L.-C.; Young, H.-T.; Chung, E.; Young, H.T.; HONG-TSU YOUNG; Chung, E.
臺大學術典藏	2018-09-10T06:25:55Z	ALLOWING FOR NOSE RADIUS EFFECTS IN PREDICTING THE CHIP FLOW DIRECTION AND CUTTING FORCES IN BAR TURNING.	HONG-TSU YOUNG;Oxley, P.L.B.;Mathew, P.;Young, H.T.;HONG-TSU YOUNG; Young, H.T.; Mathew, P.; Oxley, P.L.B.; HONG-TSU YOUNG
臺大學術典藏	2018-09-10T06:25:55Z	ALLOWING FOR NOSE RADIUS EFFECTS IN PREDICTING THE CHIP FLOW DIRECTION AND CUTTING FORCES IN BAR TURNING.	HONG-TSU YOUNG;Oxley, P.L.B.;Mathew, P.;Young, H.T.;HONG-TSU YOUNG; Young, H.T.; Mathew, P.; Oxley, P.L.B.; HONG-TSU YOUNG
臺大學術典藏	2018-09-10T06:25:55Z	ALLOWING FOR NOSE RADIUS EFFECTS IN PREDICTING THE CHIP FLOW DIRECTION AND CUTTING FORCES IN BAR TURNING.	HONG-TSU YOUNG;Oxley, P.L.B.;Mathew, P.;Young, H.T.;HONG-TSU YOUNG; Young, H.T.; Mathew, P.; Oxley, P.L.B.; HONG-TSU YOUNG
臺大學術典藏	2018-09-10T06:25:54Z	The relationship between the location of obstacle and indoor particle deposition	HONG-TSU YOUNG;Young, H.T.;Ho, J.-E.;HONG-TSU YOUNG; Ho, J.-E.; Young, H.T.; HONG-TSU YOUNG
臺大學術典藏	2018-09-10T06:25:54Z	The relationship between the location of obstacle and indoor particle deposition	HONG-TSU YOUNG;Young, H.T.;Ho, J.-E.;HONG-TSU YOUNG; Ho, J.-E.; Young, H.T.; HONG-TSU YOUNG
臺大學術典藏	2018-09-10T06:25:54Z	The relationship between the location of obstacle and indoor particle deposition	HONG-TSU YOUNG;Young, H.T.;Ho, J.-E.;HONG-TSU YOUNG; Ho, J.-E.; Young, H.T.; HONG-TSU YOUNG
臺大學術典藏	2018-09-10T06:25:54Z	Study of the flow field and scalar transport of indoor ventilating space under the impact of coanda vortex	HONG-TSU YOUNG;Young, H.-T.;Ho, J.-E.;HONG-TSU YOUNG; Ho, J.-E.; Young, H.-T.; HONG-TSU YOUNG
臺大學術典藏	2018-09-10T06:25:54Z	Study of the flow field and scalar transport of indoor ventilating space under the impact of coanda vortex	HONG-TSU YOUNG;Young, H.-T.;Ho, J.-E.;HONG-TSU YOUNG; Ho, J.-E.; Young, H.-T.; HONG-TSU YOUNG
臺大學術典藏	2018-09-10T06:25:54Z	Study of the flow field and scalar transport of indoor ventilating space under the impact of coanda vortex	HONG-TSU YOUNG;Young, H.-T.;Ho, J.-E.;HONG-TSU YOUNG; Ho, J.-E.; Young, H.-T.; HONG-TSU YOUNG
臺大學術典藏	2018-09-10T06:25:54Z	Novel method to investigate the critical depth of cut of ground silicon wafer	Young, H.T.; Liao, H.-T.; Huang, H.-Y.; HONG-TSU YOUNG
臺大學術典藏	2018-09-10T06:25:54Z	Nonlinear penetrating behavior in high energy beam drilling	HONG-TSU YOUNG; Ho, J.E.; Young, H.T.
臺大學術典藏	2018-09-10T05:53:59Z	Online dressing of profile grinding wheels	Young, H.-T.; Chen, D.-J.; Young, H.T.; Chen, D.J.; Young, H.T.; HONG-TSU YOUNG; Chen, D.J.
臺大學術典藏	2018-09-10T05:53:59Z	Development of automatic 3D profile measuring system	Young, H.-T.; Lin, W.; HONG-TSU YOUNG
臺大學術典藏	2018-09-10T05:53:59Z	A study on wafer thinning techniques with residual stress estimation	HONG-TSU YOUNG;Liao, H.-T.;Chang, M.-T.;Lin, C.-C.;Young, H.-T.;HONG-TSU YOUNG; Young, H.-T.; Lin, C.-C.; Chang, M.-T.; Liao, H.-T.; HONG-TSU YOUNG
臺大學術典藏	2018-09-10T05:53:59Z	A study on wafer thinning techniques with residual stress estimation	HONG-TSU YOUNG;Liao, H.-T.;Chang, M.-T.;Lin, C.-C.;Young, H.-T.;HONG-TSU YOUNG; Young, H.-T.; Lin, C.-C.; Chang, M.-T.; Liao, H.-T.; HONG-TSU YOUNG
臺大學術典藏	2018-09-10T05:53:59Z	A study on wafer thinning techniques with residual stress estimation	HONG-TSU YOUNG;Liao, H.-T.;Chang, M.-T.;Lin, C.-C.;Young, H.-T.;HONG-TSU YOUNG; Young, H.-T.; Lin, C.-C.; Chang, M.-T.; Liao, H.-T.; HONG-TSU YOUNG
臺大學術典藏	2018-09-10T05:53:59Z	A fundamental modeling approach for nano-grinding of silicon wafers	HONG-TSU YOUNG;Yang, Y.-J.;Huang, H.-Y.;Young, H.T.;HONG-TSU YOUNG; Young, H.T.; Huang, H.-Y.; Yang, Y.-J.; HONG-TSU YOUNG
臺大學術典藏	2018-09-10T05:53:59Z	A fundamental modeling approach for nano-grinding of silicon wafers	HONG-TSU YOUNG;Yang, Y.-J.;Huang, H.-Y.;Young, H.T.;HONG-TSU YOUNG; Young, H.T.; Huang, H.-Y.; Yang, Y.-J.; HONG-TSU YOUNG
臺大學術典藏	2018-09-10T05:53:59Z	A fundamental modeling approach for nano-grinding of silicon wafers	HONG-TSU YOUNG;Yang, Y.-J.;Huang, H.-Y.;Young, H.T.;HONG-TSU YOUNG; Young, H.T.; Huang, H.-Y.; Yang, Y.-J.; HONG-TSU YOUNG
臺大學術典藏	2018-09-10T05:53:59Z	ALLOWING FOR END CUTTING EDGE EFFECTS IN PREDICTING FORCES IN BAR TURNING WITH OBLIQUE MACHINING CONDITIONS.	HONG-TSU YOUNG;Young, H.T.;Oxley, P.L.B.;Mathew, P.;Hu, R.S.;HONG-TSU YOUNG; Hu, R.S.; Mathew, P.; Oxley, P.L.B.; Young, H.T.; HONG-TSU YOUNG

Showing items 121-145 of 180 (8 Page(s) Totally)
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