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臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)
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Institution Date Title Author
國立交通大學 2018-08-21T05:56:54Z Efficiency improvement of flexible phosphorescent organic light emitting diode by inserting a buffer layer Tsai, Y. S.; Wang, S. H.; Juang, F. S.; Su, S. Y.; Chang, M. H.; Hsieh, T. E.; Liu, M. O.
國立臺灣科技大學 2018 Unraveling the Structure of Magic-Size (CdSe)13 Cluster Pairs Hsieh T.-E.; Yang T.-W.; Hsieh C.-Y.; Huang S.-J.; Yeh Y.-Q.; Chen C.-H.; Li E.Y.; Liu Y.-H.
國立交通大學 2017-04-21T06:49:22Z Evaluation of GaN HEMT with Field Plate for Reliability Improvement Lin, Y. C.; Lin, J. C.; Lin, Y.; Wu, C. H.; Chin, P. C.; Hsu, H. T.; Hsieh, T. E.; Iwai, H.; Chang, E. Y.
國立交通大學 2017-04-21T06:49:22Z Enhancement-Mode GaN MIS-HEMTs with HfLaOx Gate Insulator Lin, Y. C.; Lin, J. C.; Lin, Y.; Wu, C. H.; Huang, Y. X.; Liu, S. C.; Hsu, H. T.; Hsieh, T. E.; Kakushima, K.; Iwai, H.; Chang, E. Y.
國立交通大學 2014-12-12T02:19:24Z 聚亞醯胺的導孔成型之研究 莊寶弟; Chuang, Pao-Ti; 謝宗雍; Hsieh T. E.
國立交通大學 2014-12-12T02:19:23Z 初始化對DVD-RAM相變化光碟擦拭率影響之研究 陳煌文; Chen, Huang-Wen; 謝宗雍; Hsieh, T. E.
國立交通大學 2014-12-12T02:19:22Z 濺鍍法製備五氧化二鉭薄膜及電性改進之研究 曾巧慧; Tseng, Cheau-Huey; 謝宗雍; Hsieh, T. E.
國立交通大學 2014-12-08T15:44:45Z Copper voids improvement for the copper dual damascene interconnection process Wang, T. C.; Wang, Y. L.; Hsieh, T. E.; Chang, S. C.; Cheng, Y. L.
國立交通大學 2014-12-08T15:16:31Z A study of encapsulation resin containing hexagonal boron nitride (hBN) as inorganic filler Chiang, Tzu Hsuan; Hsieh, T. -E.
國立交通大學 2014-12-08T15:14:16Z Sintering behaviors and dielectric properties of nanocrystalline barium titanate Ying, Kuo-Liang; Hsieh, T.-E.
國立交通大學 2014-12-08T15:13:31Z Transparent photo-curable co-polyacrylate/silica nanocomposites prepared by sol-gel process Chou, Yen-Chun; Wang, Yu-Young; Hsieh, T.-E.
國立交通大學 2014-12-08T15:12:40Z A study of UV-curable epoxide resins containing thermal accelerator - Tertiary amines Chiang, Tzu Hsuan; Hsieh, T. -E.
國立臺灣科技大學 2013 The effect of Cr/Zr chemical composition ratios on the mechanical properties of CrN/ZrN multilayered coatings deposited by cathodic arc deposition system Chen, S.-F.;Kuo, Y.-C.;Wang, C.-J.;Huang, S.-H.;Lee, J.-W.;Chan, Y.-C.;Chen, H.-W.;Duh, J.-G.;Hsieh, T.-E.
國立臺灣科技大學 2011 Mechanical and tribological properties evaluation of cathodic arc deposited CrN/ZrN multilayer coatings Huang, S.H.;Chen, S.F.;Kuo, Y.C.;Wang, C.J.;Lee, J.W.;Chan, Y.C.;Chen, H.W.;Duh, J.G.;Hsieh, T.E.
國立成功大學 2005-01-24 Modified polycrystalline silicon chemical-vapor deposition process for improving roughness at oxide/polycrystalline silicon interface Chang, J. J.; Hsieh, T. E.; Wang, Y. L.; Tseng, W. T.; Liu, Chuan-Pu; Lan, C. Y.
國立臺灣大學 2003 Thin-film reactions during diffusion soldering of Cu/Ti/Si and Au/Cu/Al2O3 with Sn interlayers Liang, M. W.; Hsieh, T. E.; Chang, S. Y.; Chuang, T. H.
臺大學術典藏 2003 Thin-film reactions during diffusion soldering of Cu/Ti/Si and Au/Cu/Al2O3 with Sn interlayers Liang, M.W.; Hsieh, T.E.; Chang, S.Y.; Chuang, T.H.; TUNG-HAN CHUANG

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