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| 國立交通大學 |
2018-08-21T05:56:34Z |
3D Ferroelectric-like NVM/CMOS Hybrid Chip by sub-400 degrees C Sequential Layered Integration
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Lien, Yu-Chung; Shieh, Jia-Min; Huang, Wen-Hsien; Hsieh, Wei-Shang; Tu, Cheng-Hui; Wang, Chieh; Shen, Chang-Hong; Chou, Tung-Huan; Chen, Min-Cheng; Huang, Jung Y.; Pan, Ci-Ling; Lai, Yin-Chieh; Hu, Chenming; Yang, Fu-Liang |
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