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Showing items 1-15 of 15 (1 Page(s) Totally)
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| 國立交通大學 |
2019-04-03T06:40:46Z |
Effect of bis-(3-sodiumsulfopropyl disulfide) byproducts on copper defects after chemical mechanical polishing
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Hung, Chi-Cheng; Lee, Wen-Hsi; Hu, Shao-Yu; Chang, Shih-Chieh; Chen, Kei-Wei; Wang, Ying-Lang |
| 國立交通大學 |
2019-04-02T05:59:51Z |
Pulsed Electrodeposition of CuInSe2 Thin Films onto Mo-Glass Substrates
|
Hu, Shao-Yu; Lee, Wen-Hsi; Chang, Shih-Chieh; Cheng, Yi-Lung; Wang, Ying-Lang |
| 國立交通大學 |
2018-08-21T05:54:27Z |
Reduced Junction Leakage by Hot Phosphorus Ion Implantation of NiGe-Contacted Germanium n(+)/p Shallow Junction
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Chen, Yi-Ju; Tsui, Bing-Yue; Chou, Hung-Ju; Li, Ching-I; Lin, Ger-Pin; Hu, Shao-Yu |
| 國立成功大學 |
2015 |
Ultra low-temperature microwave annealing for ultra-shallow junctions and P-MOS devices
|
Tsai, Ming-Han; Wu, Chi-Ting; Hu, Shao-Yu; Lee, Wen-Hsi |
| 國立交通大學 |
2014-12-08T15:37:50Z |
Pulsed Electrodeposition of CuInSe(2) Thin Films onto Mo-Glass Substrates
|
Hu, Shao-Yu; Lee, Wen-Hsi; Chang, Shih-Chieh; Cheng, Yi-Lung; Wang, Ying-Lang |
| 國立交通大學 |
2014-12-08T15:24:16Z |
A Novel Synthesis of a CuInSe2 Thin Film from Electrodeposited Cu-Se-In-Se Precursors with Three Steps Annealing
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Hu, Shao-Yu; Lee, Wen-Hsi; Chang, Shih-Chieh; Wang, Ying-Lang |
| 國立交通大學 |
2014-12-08T15:23:03Z |
Effect of Electrolyte Composition on Cu Stripping of Pt Contact Pins in Semiconductor Cu Electroplating Process
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Hu, Shao-Yu; Lee, Wen-Hsi; Chang, Shih-Chieh; Wang, Ying-Lang |
| 國立交通大學 |
2014-12-08T15:22:20Z |
A Study of Trimethylsilane (3MS) and Tetramethylsilane (4MS) Based alpha-SiCN:H/alpha-SiCO:H Diffusion Barrier Films
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Chen, Sheng-Wen; Wang, Yu-Sheng; Hu, Shao-Yu; Lee, Wen-Hsi; Chi, Chieh-Cheng; Wang, Ying-Lang |
| 國立成功大學 |
2012-09 |
A Novel Synthesis of a CuInSe2 Thin Film from Electrodeposited Cu-Se-In-Se Precursors with Three Steps Annealing
|
Hu, Shao-Yu; Lee, Wen-Hsi; Chang, Shih-Chieh; Wang, Ying-Lang |
| 國立成功大學 |
2012-07-31 |
電化學分析應用於半導體銅金屬化與銅化合物薄膜太陽能電池電沈積之探討
|
胡邵喻; Hu, Shao-Yu |
| 國立成功大學 |
2012-03 |
A Study of Trimethylsilane (3MS) and Tetramethylsilane (4MS) Based alpha-SiCN:H/alpha-SiCO:H Diffusion Barrier Films
|
Chen, Sheng-Wen; Wang, Yu-Sheng; Hu, Shao-Yu; Lee, Wen-Hsi; Chi, Chieh-Cheng; Wang, Ying-Lang |
| 國立成功大學 |
2011 |
Pulsed Electrodeposition of CuInSe(2) Thin Films onto Mo-Glass Substrates
|
Hu, Shao-Yu; Lee, Wen-Hsi; Chang, Shih-Chieh; Cheng, Yi-Lung; Wang, Ying-Lang |
| 國立成功大學 |
2008-12-01 |
Investigation of deplating behavior of Pt contact pins in semiconductor Cu electroplating process
|
Hu, Shao-Yu; Hung, Chi-Cheng; Lee, Wen-Hsi; Chang, Shih-Chieh; Chan, Din-Yuen; Wang, Ying-Lang |
| 國立成功大學 |
2008-01 |
Effect of bis-(3-sodiumsulfopropyl disulfide) byproducts on copper defects after chemical mechanical polishing
|
Hung, Chi-Cheng; Lee, Wen-Hsi; Hu, Shao-Yu; Chang, Shih-Chieh; Chen, Kei-Wei; Wang, Ying-Lang |
| 國立成功大學 |
2008 |
Investigation of bis-(3-sodiumsulfopropyl disulfide) (SPS) decomposition in a copper-electroplating bath using mass spectroscopy
|
Hung, Chi-Cheng; Lee, Wen-Hsi; Hu, Shao-Yu; Chang, Shih-Chieh; Chen, Kei-Wei; Wang, Ying-Lang |
Showing items 1-15 of 15 (1 Page(s) Totally)
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